SEMI 3D & Systems Summit to Spotlight Latest in 3D Roadmap, Heterogeneous Integration and System-in-Package Technologies

DRESDEN, Germany – 5 November, 2019 – Top experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in the 3D roadmap, heterogeneous integration and system-in-package technologies. 3D in packaging and transistor cell design is critical to scaling the performance of integrated circuits to meet the demands of artificial intelligence (AI), machine learning and other data-intensive applications. Registration is now open with early-bird pricing until 30 November, 2019.

SEMI 3D & Systems Summit returns to Dresden for the second year with a broader scope of topics including:

  • 3DIC Through-Silicon-Via (TSV) technology
  • 2.5D, 3D FO-WLP/e-WLB
  • Heterogeneous Integration
  • Stacked dies and stacked wafers
  • 3D alternative technologies
  • 5G applications
  • uLED and photonics applications

Experts from Global Leaders to Present

Event speakers will explore disruptive applications such as mobile Internet of Things (IoT) and high-performance power electronics. 3D & Systems Summit presenters include experts from global leaders such as AMKOR, ASE Group, Dow, GLOBALFOUNDRIES, Savansys, SystemPlus, STMicroelectronics, TechSearch International, Yole Développement and Xperi.

The summit will showcase prominent players in 3D integration for microelectronics manufacturing while offering business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities. Visit 3D & Systems Summit for more information.

To reserve an exhibition space, contact Revi Gani at Email Contact.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.



Contact: 

Serena Brischetto 
SEMI Europe
Phone: +49 30 3030 8077-11
Email: Email Contact 




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