TriLumina Launches 3 W Surface-Mount Flip Chip Back-Emitting VCSEL Array Without The Need For A Submount

ALBUQUERQUE, New Mexico, Nov. 21, 2019 — (PRNewswire) — TriLumina®, the leading developer of flip chip vertical-cavity surface-emitting laser (VCSEL) technology for 3D sensing, announces the launch of the world's first 3 W surface-mount, flip-chip, back-emitting VCSEL array without the need for a package submount or bond wires for mobile 3D sensing cameras. This new VCSEL-on-Board (VoB) technology enables higher performance, smaller size and lower costs, and simplifies time-of-flight (ToF) camera supply chains as compared to conventional VCSELs for 3D sensing.

The TriLumina 3 W VoB SMT VCSEL array has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices.

"We were very pleased to launch the 4 W VoB for automotive applications this past summer," said Brian Wong, president and chief executive officer of TriLumina. "Now, with the new 3 W flip-chip VoB, TriLumina has created an even smaller form factor, which enables a thinner and smaller solution with improved performance as compared to conventional top-emitting VCSELs specifically targeted at mobile ToF applications."

Conventional VCSEL arrays are mounted on a submount and use bond wires for electrical connections. The new 3 W VCSEL on board surface mount technology (SMT) device is a compact, surface-mountable design, consisting of a single VCSEL array die that is flip-chipped with standard SMT to a printed circuit board (PCB) without the need for a submount carrier for the VCSEL die at the same time as other SMT components on the same PCB. TriLumina's integrated back-side etched micro-lenses enable integrated optics, which further reduces part height as compared to conventional VCSELs with separate optical lenses. It has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices.

Although direct flip-chip SMT technology has been used in other components such as radio frequency (RF) and power field-effect transistor (FET) chips, TriLumina's VoB is the first time this technology has been able to be used on a VCSEL device. The VCSEL device uses copper pillars with solder bumps that are currently in use for other types of products and mounts directly to a PCB using standard lead-free SMT, with the added benefit of built-in hermeticity and excellent thermal properties due to TriLumina's unique back-emitting VCSEL structure. The VoB family of products is starting sampling now. Contact TriLumina for data sheets, and additional technical and pricing information.

Please visit http://www.trilumina.com for more information.

TriLumina Logo

Photo - https://mma.prnewswire.com/media/1029733/TriLumina_3_W_VoB_SMT_VCSEL_Pencil.jpg

Logo -  https://mma.prnewswire.com/media/950577/TriLumina_Logo.jpg

Contact:
Company Name: TriLumina
Jason Farrell
Email Contact (480) 539-2706
Web: http://www.trilumina.com




Review Article Be the first to review this article
Downstream : Solutuions for Post processing PCB Designs

Featured Video
Latest Blog Posts
Janusz KitelAldec Design and Verification
by Janusz Kitel
When is robustness verification for DO-254 projects complete?
Colin WallsEmbedded Software
by Colin Walls
Exception handling in C++
Jobs
Ecommerce Account Manager for Bright Atlas LLC at Miami Gardens, Florida
Upcoming Events
VLSID 2020 at The Leela Palace 23, HAL Old Airport Rd, HAL 2nd Stage, Kodihalli, Bengaluru India - Jan 4 - 8, 2020
CES 2020 at LAS VEGAS NV - Jan 7 - 10, 2020
INDUSTRY STRATEGY SYMPOSIUM—ISS 2020 at The Ritz Carlton Half Moon Bay CA - Jan 15 - 20, 2020
RWW 2020 at San Antonio TX - Jan 26 - 29, 2020
DownStream: Solutions for Post Processing PCB Designs
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: DDR 4/3



Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise