SEMI 3D & Systems Summit Keynotes Spotlight 5G, HPC and System-in-Package Innovations

DRESDEN, Germany – 14 January, 2020 – Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch International will headline the event with keynotes. Event registration is open.

The 3D & Systems Summit will showcase prominent players in 3D integration for microelectronics manufacturing while offering business-to-business matchmaking, networking for participants to explore new partnerships, an exhibition, and a gala dinner.

SEMI 3D & Systems Summit Keynotes

Jan Vardaman
Jan Vardaman President and Founder,  TechSearch International Inc.
TechSearch Logo
Vardaman will kick off the summit with her keynote A New Era for 3D. Vardaman will discuss the latest developments and trends in areas including three-layer image sensors, Samsung’s three-layer stack, new packaging technologies with active interposers, Foveros 3D integration technology for heterogeneous system integration, 3D and SoIC face-to-face stacking, Wafer-on-wafer (WoW) and High Bandwidth Memory (HBM).
Eelco Bergman photo
Eelco Bergmann Senior Director, Strategic Sales and Business Development, ASE Group
ase group logo
Leading day two with his keynote Integration Technologies Transforming the World, Bergmann will explore how System-in-Package (SiP) technologies are delivering on their promise of miniaturization, power efficiency and high performance. The timing of his keynote is ripe as the electronics industry, largely driven by semiconductor innovation, is enabling life-changing applications from health to mobility and from virtual reality to AI.
Dr. Douglas Yu
Dr. Doug Yu Vice President of Integrated Interconnect and Packaging, TSMC
TSMC Logo
In his presentation SoIC - A Longtime Game Changer, Yu will present research and development of advanced packaging and system integration solutions, System on Integrated Chips (SoICTM) and their derivatives, TSMC’s wafer-level system integration technologies, Chip on Wafer on Substrate (CoWoS®), and Integrated Fan-Out (InFO).
Mustafa Badaroglu
Mustafa Badaroglu Technical Director, Huawei Technologies
Huawei
In his talk 3D IC Opportunities for High-performance Computing, Badaroglu will explore trends in intelligent data connectivity, HPC, how sensors are driving energy-efficiency for computing, connectivity bandwidth, and new assembly and integration schemes such as 3D integration for energy-efficient machine learning computation.

Visit 3D & Systems Summit for more information. Follow #3DSummit @SEMIEurope on LinkedIn and Twitter.     

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter.  



Contact:

Serena Brischetto
SEMI Europe
Email:  Email Contact
Phone: +49 30 3030 8077-11




Review Article Be the first to review this article

Featured Video
Latest Blog Posts
Jacek HankeEDACafe Editorial
by Jacek Hanke
EDACafe Industry Predictions for 2020 – DCD
Colin WallsEmbedded Software
by Colin Walls
struct vs class in C++
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Revenue Increase Offers Welcome News to Start 2020
Jobs
Senior Account Manager… FORMAL VERIFICATION...VALLEY for EDA Careers at San Jose, California
Salesforce Technical Lead   East Coast  for EDA Careers at Cherry Hill, New Jersey
Senior Software Architect Internet for EDA Careers at San Jose, California
Ecommerce Account Manager for Bright Atlas LLC at Miami Gardens, Florida
Upcoming Events
RWW 2020 at San Antonio TX - Jan 26 - 29, 2020
DesignCon 2020 at Santa Clara Convention Center Santa Clara CA - Jan 28 - 30, 2020
3D Printing Electronics Conference at High Tech Campus 1b 5656 AE Eindhoven Netherlands - Jan 28, 2020
DesignCon 2020 at 5001 Great America Pkwy Santa Clara CA - Jan 28 - 30, 2020
Mark you calendar



Internet Business Systems © 2020 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise