IPC Calls for Participation in Electronics Materials Forum

February 14, 2020 — IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.

The Electronics Materials Forum will focus on developments in materials and processes associated with advanced electronics assembly and manufacturing. The content will focus on emerging technologies challenging existing material sets for board fabrication, assembly, and post-assembly protection.

Expert technical presentations are being sought in the following areas:

Substrate materials:

  • Novel board laminates
  • Surface finishes
  • Solder mask advancements
  • Flexible/wearable circuits
  • HDI developments

Assembly materials:

  • New solder alloys
  • Flux development
  • Cleaning chemistries
  • Assembly process strategies
  • Thermal interface solutions

Protective materials:

  • Cleaning chemistries
  • Conformal coatings
  • Adhesives
  • Underfills

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

Technical conference paper abstracts and course proposals are due March 13, 2020. To submit an abstract or course proposal, contact  Email Contact,  IPC technical conference program manager.




Review Article Be the first to review this article
Aldec


Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
What’s on Tap from the ESD Alliance? Plenty! Read On …
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Automating IP and SoC Development
Jobs
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
SerDes Applications Design Engineer for Xilinx at San Jose, California
Test and Measurement System Architect for Xilinx at San Jose, California
Electronics Engineer for Lockheed Martin at Sunnyvale, California
Upcoming Events
Simulation World at United States - Apr 20 - 21, 2021
Virtual ASMC 2021 at United States - May 10 - 12, 2021
DVCon China 2021 at Shanghai China - May 26, 2021
CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021
True Circuits PHY



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise