TDK announces worldwide availability of Chirp CH101 ultrasonic ToF sensor platform

  • CH101 Time-of-Flight (ToF) range sensor is a system-in-package that integrates a PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low-power SoC (system on chip) in a miniature 3.5 x 3.5 mm reflowable package.
  • Provides accurate range measurements at distances up to 1.2m over a wide and configurable Field-of-View (FoV) in any lighting condition
  • CH101 range sensor platform solution includes CH101 MEMS sensors, sensor modules and developer kits, all currently available through worldwide distribution.

 

September 17, 2020  TDK Corporation (TSE: 6762) announces the worldwide availability of the Chirp CH101 ultra-low power integrated ultrasonic Time-of-Flight (ToF) range sensor platform solution, which includes the CH101 MEMS sensor, sensor modules, and developer kits. Chirp’s MEMS ultrasonic technology leverages a proprietary Time-of-Flight (ToF) range sensor in a 3.5 mm x 3.5 mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a low-power mixed-signal ASIC. As the first commercially available MEMS-based ultrasonic ToF sensor, it is ultra-low power, compact, immune to lighting conditions and target composition/color, has a configurable Field-of-View (FoV), and a flexible DSP capable of handling a variety of ultrasonic signal-processing algorithms.

The CH101 enables flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence/proximity sensing, object-detection/avoidance, material composition, as well as wearable range-sensing tags to enable social distancing and contact tracing to help people remain safely distanced from one another, during COVID-19 and other scenarios.

Sensor platform solution:

  • CH101: The CH101 MEMS sensor provides accurate range measurements to targets up to 1.2m away. Using ultrasonic time-of-flight measurements, the sensor works in any lighting condition, including full sunlight, and provides millimeter-level accuracy, independent of the target’s color and optical transparency.
  • DK-CH101: Developer Kit for prototyping with one or more ToF sensors. The DK-CH101 includes one CH101 with the option to add up to four additional ultrasonic modules.
  • EV_MOD_CH101-03-01: Easy-to-use module for rapid integration and evaluation of hardware designs. Different acoustic housings available to adjust the field of view.
  • MOD_CH101-03-02: Complete module solution with a 45° FoV acoustic housing and IP5 particle ingress filter for rapid mass production and accelerated time to market
  • Ensuring safe social distancing in the workplace is one piece of the puzzle in the age of COVID-19. Tracking-solution providers can use Chirp ultrasonic ToF sensors to detect proximity breaches and provide warnings before crossing social distancing guidelines. Chirp provides a complete hardware and software reference design to make it easy for solution providers to quickly incorporate ultrasonic range-finding technology into their tracking solutions. Learn more: https://invensense.tdk.com/social-distancing/

The all-in-one sensor platform solution is now available from multiple distributors worldwide. For additional information and collateral, please visit https://invensense.tdk.com/technology/ultrasonic/ or contact InvenSense Sales at sales@invensense.com.

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Glossary

  • ToF: Time of Flight
  • FoV: Field of View
  • IMU: Inertial Measurement Unit
  • EV: Evaluation module
  • DK: Developer Kit
  • DSP: Digital Signal Processor
  • MEMS: Micro-Electro-Mechanical Systems

Main applications

  • Augmented and Virtual Reality
  • Robotics
  • Obstacle avoidance
  • Mobile and Computing Devices
  • Proximity/Presence sensing
  • Ultra-low power remote presence-sensing nodes
  • Home/Building automation

Main features and benefits

  • Ultra-Low Power
  • Works in Any Lighting Condition
  • Detects objects of any color and optical transparency
  • Customizable field of view (FoV) up to 180°
  • Integrated 3.5mm x 3.5mm x 1.26mm Package
  • Low-power SoC firmware for ultrasonic processing a wide-range of usage cases


Key Data: https://publitekltd.sharepoint.com/:i:/g/ER3kcIQU6ohGmEAXz1RGx7sBUaRKsdWjEnoh0jNfa-wbhw

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About TDK Corporation
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2020, TDK posted total sales of USD 12.5 billion and employed about 107,000 people worldwide.

About Chirp Microsystems
Chirp Microsystems is bringing ultrasonics to everyday products. Founded in 2013 based on pioneering research performed at the University of California, Chirp’s piezoelectric MEMS ultrasonic transducers offer long range and low power in a tiny package, enabling products that accurately perceive the three-dimensional world in which we live. Combined with Chirp’s embedded software library, these sensors advance user experiences with VR/AR, wearables, robotics, drones and occupancy detection. For more information, please visit: www.chirpmicro.com.

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Further information on the products can be found under https://www.invensense.com/ 

Contacts for media

Press Contact
David Almoslino, InvenSense, a TDK Group Company, USA
San Jose, CA, USA
Tel: +1-408-501-2278
E-mail: dalmoslino@invensense.com

Sarah MacKenzie, Publitek
Tel: +1 503.720.3743
E-mail: sarah.mackenzie@publitek.com

Issued by:
TDK Global, Publitek
Tel: 01582390980
E-mail: TDK-global@publitek.com




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