STATS ChipPAC Reports First Quarter Results

SINGAPORE, April 27 /PRNewswire-FirstCall/ -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" - NNM: STTS and SGX: STATSChP), a leading independent semiconductor test and advanced packaging service provider, today announced results for the first quarter ended March 31, 2005.

Revenue for the three months ended March 31, 2005 increased 77% to $234.1 million, compared to $132.3 million in the same quarter a year ago. This represents a sequential decrease of 12% compared to the prior quarter and is in line with prior guidance.

On a US GAAP basis, net loss for the three months ended March 31, 2005 was $27.1 million or $0.14 per diluted ADS, compared to net income of $4.1 million or $0.04 per diluted ADS in the same quarter a year ago. US GAAP results for the first quarter of 2005 include $17.6 million in special items and costs associated with the merger of STATS and ChipPAC. Excluding the special items and including certain adjustments, non-US GAAP adjusted net loss in the first quarter ended March 31, 2005 was $9.5 million or $0.05 per diluted ADS, compared to net income of $4.1 million or $0.04 per diluted ADS in the same quarter a year ago.

Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, "Although the first quarter was a challenging one, we achieved revenue and net loss in line with prior guidance. We benefited from normal seasonal demand in graphics and computing, with continued leadership in advanced packages, including 3D packages. Areas where we saw weakness in the first quarter included wafer probe because of fewer wafer starts by outsource fabs, and some softness in CDMA chipsets late in the quarter caused by excess inventory. Our turns business was again strong but came in at the lower end of our expectations. We believe that the worst is over in the first quarter and, overall, we ended the quarter in a good position operationally, with good momentum in new programs and continued leadership in 3D packaging. On 3D packaging, we believe we continue to have one of the most comprehensive portfolios of capabilities, including stacked die up to 7 die stacked and in our recently announced Package-in-Package and Package-on-Package technologies. We are gaining increased confidence in our prospects for the second half of the year due to improved inventory levels, general stability in demand from a majority of our customers and an expected return to more healthy utilization levels."

Michael G. Potter, Chief Financial Officer of STATS ChipPAC, said, "The first quarter came out at the lower end of our revenue expectations, but slightly better than normal seasonal trends. We are starting to achieve the revenue and cost synergies we anticipated and we expect to see continued gains through the year as end market demand improves. For the first quarter, however, our gross margin came in lower than the prior quarter primarily due to mix with lower test sales driven by lower than usual wafer probe revenue. Average selling prices declined 5% during the quarter versus the prior quarter on a mix adjusted basis. Utilization levels were about 66% compared to the blended utilization rate of 67% for the Company in the prior quarter. Finally, we ended the first quarter with $178.9 million in cash, cash equivalents and marketable securities, giving us the financial strength to execute on our growth strategy. The decline in cash, cash equivalents and marketable securities over the prior quarter primarily reflects our use of cash and short term financing related to the $125.9 million aggregate principal amount of 1.75% convertible notes due 2007 that were put to the Company during the quarter."


Tan Lay Koon commented, "Based on current customer forecasts, we believe the worst is behind us. We expect to return to a growth mode in the second quarter, with an increase in revenue quarter over quarter. We remain confident in our prospects due to the compelling strategic advantages of our business model, our strong financial position, our leadership in test and advanced packages, and our geographic leadership in fast growth regions. Specifically, for the second quarter 2005, we expect revenues to be approximately 10% to 15% higher than the first quarter 2005, with US GAAP net loss per ADS of $0.05 to $0.08 and non-US GAAP adjusted net (loss) or income per ADS in the range of ($0.01) to $0.03 per ADS for the second quarter of 2005. Non-US GAAP adjusted (loss) income is calculated without the effect of certain merger and integration expenses and purchase accounting adjustments."

Investor Conference Call / Webcast Details

A conference call has been scheduled for 8:00 a.m. in Singapore on April 28, 2005. This will be 8:00 p.m. on April 27 in New York. During the call, time will be set-aside for analysts and interested investors to ask questions of executive officers.

The call may be accessed by dialing +1-913-981-4911 and referencing confirmation code 6864067. A replay of the call will be available approximately two hours after the conclusion of the conference call and will be accessible by dialing +1-719-457-0820 and referencing confirmation code 6864067. The Company will also webcast the conference call live on its website

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. ("STATS ChipPAC" or "the Company" -- NNM: STTS and SGX: STATSChP) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides total solutions of fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to market faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs) and fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company's customer support offices are centered in the United States (California's Silicon Valley, Arizona, Texas, Massachusetts, Florida, Colorado and North Carolina). Our offices outside the United States are located in the Netherlands, United Kingdom, China, Singapore, Japan, Taiwan, South Korea and Malaysia. STATS ChipPAC's facilities include those of its subsidiary, Winstek Semiconductor Corporation in Hsinchu Valley, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with our research and development centers in Singapore and South Korea as well as test facilities in the United States, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both the Nasdaq National Market and The Singapore Exchange. In addition, STATS ChipPAC is also listed on the Morgan Stanley Capital International (MSCI) Index and the Straits Times Industrial Index. Further information is available at Information contained in this website does not constitute a part of this release.

Certain statements in this press release including statements regarding expected future financial results and industry growth, and all statements made under the heading "Outlook," are forward-looking statements that involve a number of risks and uncertainties that could cause actual results to differ materially. Factors that could cause actual results to differ include our ability to successfully integrate the operations of former STATS and ChipPAC and employees; general business and economic conditions and the state of the semiconductor industry; demand for end-use applications products such as communications equipment and personal computers; reliance on a small group of principal customers; decisions by customers to discontinue outsourcing of test and assembly services; changes in customer order patterns; rescheduling or canceling of customer orders; changes in product mix; capacity utilization; level of competition; pricing pressures including declines in average selling prices; continued success in technological innovations; delays in acquiring or installing new equipment; shortages in supply of key components; availability of financing; exchange rate fluctuations; litigation and other risks described from time to time in the Company's SEC filings, including its annual report on Form 20-F dated March 18, 2005, the Registration Statement on Form F-3/S-3 (File Nos. 333-119705 and 333-119705-1) of STATS ChipPAC and STATS ChipPAC, Inc. respectively and the Registration Statement on Form F-4 (File No. 333- 123480) of STATS ChipPAC. We undertake no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise. Unless otherwise specified, references to "$" are to the lawful currency of the United States of America. Unless otherwise specified, references to "US GAAP" are to Generally Accepted Accounting Principles as practiced in the United States of America.

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