Broadcom Debuts Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure

SAN JOSE, Calif., Nov. 30, 2020 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced sampling of its 5nm ASIC device for data center and cloud infrastructure. Built on TSMC’s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS® interposer technology. In addition, Broadcom has multiple ASIC devices in development targeting artificial intelligence (AI), high performance computing (HPC) and 5G wireless infrastructure applications.

5nm Technology Portfolio Highlights

  • High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes cores
  • HBM2e and HBM3 protocol solution
  • High bandwidth Die2Die PHY for multi-die SoC and silicon disaggregation
  • High performance and high-density standard cell libraries and memory compilers
  • Advanced packaging solutions including multi-chip-modules and 2.5D stacking

Benefits of 5nm ASIC Platform vs. Previous Generation

  • 2x increase in on-die computation for training and inference applications
  • 2x to 4x increase in memory bandwidth with HBM2e and HBM3 PHY
  • 2x higher bandwidth serial links with 112-Gbps SerDes
  • Up to 30% reduction in power per given work function
  • System size and cost reduction with advanced packaging solutions

“Broadcom’s pioneering ASIC leverages both N5, the industry’s most advanced silicon technology, and our high-performance CoWoS integration solution to address the demanding requirements of next-generation cloud and data center applications,” said Dr. Kevin Zhang, senior vice president of business development at TSMC. “We’re excited to see the new applications Broadcom’s ASIC platform will enable, and look forward to continued partnership to empower end customers and their innovations.”

“This first-to-market 5nm ASIC extends Broadcom’s embedded SoC leadership and paves the way for new innovations across AI, HPC, 5G and hyperscale infrastructure applications,” said Frank Ostojic, senior vice president and general manager of the ASIC Product Division at Broadcom. “Our innovative IP, proven design methodology and partnership with TSMC continue to provide leadership solutions with power, performance and time to market advantage for our customers.”

About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise, mainframe and cyber security software focused on automation, monitoring and security, smartphone components, telecoms and factory automation. For more information, go to www.broadcom.com.

Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom.  The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.

Press Contact:
Khanh Lam
Corporate Communications
press.relations@broadcom.com
Telephone: +1 408 433 8649


Primary Logo




Review Article Be the first to review this article


Featured Video
Jobs
SerDes Applications Design Engineer for Xilinx at San Jose, California
Senior Analog IC Design Engineer for Marvell Semiconductor at Santa Clara, California
Technical Marketing Mmanager for EDA Careers at Fremont, California
Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California
Senior Application Engineer Formal Verification for EDA Careers at California or Austin, California
Product Line Manager for EDA Careers at Multiple, North Carolina
Upcoming Events
Si2 AI/ML Winter Workshop at United States - Jan 29, 2021
virtual DATE 2021 at France - Feb 1 - 5, 2021
SEMI Technology Unites Global Summit at United States - Feb 15 - 19, 2021
DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise