GENIO™ IC/Package Co-Design EDA Tool First to Offer End-to-End Optimization

ROME, Jan. 12, 2021 — (PRNewswire) — MZ Technologies today underscored several key IC/package co-design features that are critical to meeting today's high-performance advanced technology IC device needs.  The company's GENIO IC/Package Co-Design EDA tool is the industry's only end-to-end optimized solution that covers all the requirements.

Visionary IC systems designers have identified seven key features that should be incorporated into the ideal integrated IC/package co-design tool. These include: IC, package PCB design environment support, system-level I/O planning and optimization, a holistic design environment, mixed silicon and photonics, interconnect optimization, open standards, and tool agnostic work flows.   

GENIOTM is the only EDA tool that provides all seven, integrating silicon and package EDA flows to create a full co-design and end-to-end optimized design environment for complex multi-chip designs that comprise advanced heterogeneous microelectronic systems. 

"The IC/Packaging co-design tool segment today is swiftly maturing, but none of the Big 3 have yet to offer an optimized end-to-end solution.  Because we imagined and built the technology platform from the ground up, GENIOTM is architected from a 'design first' rather than a 'proprietary technology first' perspective," explained Anna Fontanelli, Founder and CEO of MZ Technologies.  

GENIO's holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system.  It has proven to be very application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.

The result is right-the-first-time concept-to-design methodology, thanks to strong "what-if" analysis and system level exploration across architectures.  GENIO identifies the most proficient solution and avoids entering "dead-end" architectures/design roads.  At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.

GENIO also eliminates design environment boundaries to enable system architectural exploration that identifies errors and bottleneck early in the design process. It also features cross-hierarchical pathfinding for pin assignment optimization, wire lengths/crossovers reduction, and floor planning-aware silicon interposer design.

For a more information, go to www.monozukuri.eu

About MZ Technologies

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri's mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

 

Cision View original content to download multimedia: http://www.prnewswire.com/news-releases/genio-icpackage-co-design-eda-tool-first-to-offer-end-to-end-optimization-301205952.html

SOURCE Monozukuri Technologies

Contact:
Company Name: Monozukuri Technologies
Chuck Byers
Email Contact +1-408-310-9244
Business contact, Eric Gunn
Email Contact +44 0783 4490803
Web: https://www.monozukuri.eu/




Review Article Be the first to review this article
Editorial
More Editorial  
Latest Blog Posts
Industry ExpertsEDACafe Editorial
by Industry Experts
EDACafe Industry Predictions for 2022 – Zuken
Industry ExpertsEDACafe Editorial
by Industry Experts
EDACafe Industry Predictions for 2022 – Avishtech
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Chips and Wine: It’s All About the Process
Jobs
Senior Design Verification Engineer for Arteris IP at Campbell, California
Systems Engineer/Product Definer for Cirrus Logic, Inc. at San Francisco,, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Hardware Engineer - Entry Level for Apple Inc at Cupertino, California
Upcoming Events
IPC Apex Expo 2022 at San Diego CA - Jan 22, 2022 - Dec 31, 1969
AltiumLive 2022 CONNECT at 111 W Harbor Drive San Diego CA - Jan 26 - 28, 2022
SEMICON Korea 2022 Hybrid at Seoul Korea (South) - Feb 9, 2022 - Dec 31, 1969
SEMICON Korea 2022 Hybrid at United States - Feb 9, 2022 - Dec 31, 1969



© 2022 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise