Virtual FLEX 2021 to Showcase Leading-Edge Innovations to Make the World Safer

MILPITAS, Calif. â”� January 12, 2021 – The latest advances in flexible and printed electronics for a safer future will take center stage at the 20th anniversary Flexible Hybrid Electronics Conference and Exhibition (FLEX Conference 2021), February 22-26. The virtual event will feature keynotes, panels, technical sessions, TechTALKS and networking opportunities.  Registration is open.

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FLEX Conference 2021 runs daily from 8:00am to 12:00pm Pacific Time and Feb. 23-24 at 4:00pm Pacific Time to feature speakers in Asia.

Sponsored by SEMI FlexTech, FLEX will explore 20 Years of Driving Innovation to Make the World Safer with cutting-edge applications that deepen interactions between users and their surroundings. The annual event focuses on equipment, processes, and materials for flexible hybrid and printed electronic products, highlighting the latest technical breakthroughs, electronics applications and business strategies.

Keynote Speakers

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  Dr. Ana Claudia Arias, Professor, UC Berkeley 

Printed Electronic Materials and Applications in Flexible     Electronics and Wearable Medical Devices 

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Dr. Charles Geraci, Jr., Associate Director for Emerging Technologies, National Institute for Occupational Safety and Health (NIOSH) 

Safety and Stewardship as Elements of Success with        Advanced Materials

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Dr. George Malliaras, University of Cambridge

Electronics on the Brain 

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Dr. Christine Ho, CEO and Co-founder, Imprint Energy 

Safe, High-Performance Green Batteries for Blending      Electronics Into Our Lives

 

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Market and Application Drivers with Top Executives and Academics

Featured organizations include:

  • Google, GE Research, HP Incorporated, NovaCentrix, AiQ Smart Clothing, Alertgy, Air Force Research Laboratory, Birla Carbon, CCDC Army Research Lab, CHASM Advanced Materials, Elephantech, General Silicones, IDTechEx, ITN Energy Systems, Lithium Battery Engineering, NextFlex and PlayNitride Display 
  • Auburn University, Eindhoven University of Technology, Palo Alto Research Center, Soochow University, Tohoku University, UCLA, University of Manchester, Simon Fraser University, Stanford University, SUNY-Buffalo, UC-San Diego, University of Arizona, University of Washington and Yamagata University

Technical Sessions

  • Flexible Materials and Technology from Asia
  • Flexible Hybrid Electronics Systems
  • Materials Processing
  • Sensors and MEMS
  • Sustainability and Power

Workforce Development

The Promoting Diversity in Tech – Bringing Awareness to Unconscious Biases session will highlight diversity and mentoring opportunities in the electronics design and manufacturing industry. FLEX 2021 will also host the annual university student poster session showcasing flexible electronics, MEMS and sensors projects.

See the complete agenda for FLEX 2021.

Platinum Partners are E Ink and NovaCentrix.

Follow FLEX 2021 on Twitter at #SEMI_FLEX and @flextechnews.

FLEX 2021 is the second of eight conferences comprising SEMI’s third annual Technology Leadership Series of the Americas. Aligned from coast to coast throughout 2021, the series is designed to foster critical discussions on the short- and long-term influences and opportunities in the $2 trillion emerging markets.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org   to learn more, contact one of our worldwide offices, and connect with SEMI on  LinkedIn   and  Twitter .

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