Virtual FLEX Conference 2021 Opens with Leading-Edge Innovations to Make the World Safer

MILPITAS, Calif. – February 22, 2021 – Virtual Flexible Hybrid Electronics Conference and Exhibition (FLEX Conference 2021) opens today, gathering more than 100 industry leaders, visionaries and technology experts for four days of insights into the latest trends, innovations and developments in flexible hybrid and printed electronics aimed at cutting-edge applications that deepen interactions between users and their surroundings. Registration is open.


Themed 20 Years of Driving Innovation to Make the World Safer, FLEX Conference 2021 focuses on materials, processes and equipment that enable business strategies to help drive electronics innovation. The annual event features keynotes, panels, technical sessions, TechTALKS and networking opportunities.

Keynotes by industry executives and experts from Imprint Energy, Elephantech, PlayNitride Display, Air Force Research Laboratory, UC Berkeley and University of Cambridge will highlight advancements in wearable medical devices, electronics for the brain, high-performance green batteries and advanced materials.

Industry Leaders to Present at FLEX Conference 2021

  • Companies and Research Centers – Google, GE Research, HP Incorporated, NovaCentrix, Palo Alto Research Center, AiQ Smart Clothing, Alertgy, Birla Carbon, CCDC Army Research Lab, CHASM Advanced Materials, General Silicones, IDTechEx, ITN Energy Systems, Lithium Battery Engineering and NextFlex
  • Academia – Auburn University, Eindhoven University of Technology, Soochow University, Tohoku University, UCLA, University of Manchester, Simon Fraser University, Stanford University, SUNY-Buffalo, UC-San Diego, University of Arizona, University of Washington and Yamagata University

A special session, Promoting Diversity in Tech – Bringing Awareness to Unconscious Biases, will highlight diversity and mentoring opportunities in the electronics design and manufacturing industry. See the complete agenda for FLEX Conference 2021.


About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit to learn more, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter.


Association contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050

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