H3C Semiconductor and Ansys Innovate Next-Generation Network Processor Chip for High-end Routing, 5G Backhaul, AI and Cybersecurity Applications

Ansys' multiphysics platform enabled H3C Semiconductor engineers to speed simulation analysis time by 10x and greatly improve product reliability

PITTSBURGH, April 14, 2021 — (PRNewswire) —  

/ Key Highlights

  • H3C Semiconductor designers used Ansys' comprehensive multiphysics platform — including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC — to engineer a state-of-the-art network processor chip featuring 56G Serdes and LPDDR5 interfaces
  • Using Ansys solutions, H3C Semiconductor designers managed multifaceted design issues from chip design to signoff, co-simulating the chip and package to power advanced routing, 5G backhaul, artificial intelligence (AI) and cybersecurity applications

H3C Semiconductor leveraged Ansys (NASDAQ: ANSS) simulation solutions to launch ENGIANT 660, a highly sophisticated network processor chip that enables routing, AI, 5G backhaul and cybersecurity applications. H3C Semiconductor designers used Ansys' cutting-edge multiphysics simulation platform to enhance product signoff efficiency, spur product development and pass stringent testing requirements.

To innovate a large-scale complex network processor chip for advanced processes, reduce development costs and solve a myriad of complicated design issues, H3C Semiconductor designers employed a broad spectrum of multiphysics simulation solutions. Ansys solutions empowered designers to perform comprehensive analysis of power noise, signal integrity, thermal reliability and structural dependability from chip design to signoff. This ensured the highly reliable processor chip met demanding design specifications and accelerated the development of chip, package and system.

By integrating Ansys simulations into their workflow, H3C Semiconductor designers cut hardware costs and substantially sped production of next-gen chips for routing, AI, 5G backhaul and cybersecurity applications. Designers used Ansys® Redhawk-SC with its cloud-native, elastic compute Ansys® SeaScape database to validate full-chip power integrity and slash analysis times by 10x. Additionally, they harnessed Ansys® SIwave to analyze signal integrity, leveraged Ansys® HFSS to optimize 3D electromagnetic performance and used Ansys® Mechanical and Ansys® Icepak® to solve difficult thermal and structural reliability issues.

"As enterprise customers rapidly develop high-end core routers, 5G backhaul, SDN/NFV, AI, Firewall and Load Balancing applications around the world, Ansys' multiphysics simulation solutions for chip packaging systems address the thermal and structural reliability and power integrity challenges associated with large-scale chips," said David Dai, vice president of engineering operations at H3C Semiconductor. "Collaborating with Ansys proved instrumental to our design team, which heavily relied on simulations to create ENGIANT 660, the first network processor chip independently developed by H3C Semiconductor."

"Engineering new chips for exciting new routing, 5G, AI and cybersecurity applications creates complex power noise and electromagnetic, thermal and structural challenges that can only be overcome with simulation," said John Lee, vice president and general manager at Ansys. "Our continued collaboration with H3C Semiconductor will drive new designs with increased confidence and help ensure first-time design success across their organization."

/ About Ansys

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS–C

/ Contacts

Media

Mary Kate Joyce


724.820.4368


marykate.joyce@ansys.com 

Investors

Kelsey DeBriyn


724.820.3927


kelsey.debriyn@ansys.com 

 

Cision View original content to download multimedia: http://www.prnewswire.com/news-releases/h3c-semiconductor-and-ansys-innovate-next-generation-network-processor-chip-for-high-end-routing-5g-backhaul-ai-and-cybersecurity-applications-301268636.html

SOURCE Ansys

Contact:
Company Name: Ansys, H3C Semiconductor
Web: https://www.ansys.com
Financial data for Ansys, H3C Semiconductor




Review Article Be the first to review this article

 Advanced Asembly

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
You’re Invited! CEO Outlook May 18
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Automating the UVM Register Abstraction Layer (RAL)
Jobs
ASIC SoC Verification Engineer for Ericsson at Austin, Texas
Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
SoC Physical Design Engineer for Qualcomm at Austin, Texas
Staff SerDes Applications Design Engineer for Xilinx at San Jose, California
Upcoming Events
DVCon China 2021 at Shanghai China - May 26, 2021
CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise