Samsung Electronics Announces Availability of Its Next Generation 2.5D Integration Solution ‘I-Cube4’ for High-Performance Applications

'I-Cube4' incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management as well as stable power supply

SEOUL, South Korea — (BUSINESS WIRE) — May 6, 2021 — Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210506005483/en/

Samsung’s I-Cube4 for high-performance applications (Photo: Business Wire)

Samsung’s I-Cube4 for high-performance applications (Photo: Business Wire)

Samsung’s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.

Samsung’s new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.

“With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips,” said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. “With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.”

In general, the silicon interposer area proportionally increases to accommodate more logic dies and HBMs. Since the silicon interposer in the I-Cube is thinner (around 100㎛ thick) than paper, the chances of bending or warping a larger interposer becomes higher, which negatively impacts product quality.

With strong expertise and knowledge on semiconductors, Samsung has studied how to control interposer warpage and thermal expansion through changes to material and thickness, succeeding in commercializing the I-Cube4 solution.

Additionally, Samsung has developed its own mold-free structure for I-Cube4 to efficiently remove heat and enhanced its yield by conducting a pre-screening test that can filter out defective products during the fabrication process. This approach provides additional benefits such as a reduction in the number of process steps, which result in cost savings and shorter turnaround time.

Since the launch of I-Cube2 in 2018 and eXtended-Cube (X-Cube) in 2020, Samsung’s heterogeneous integration technology has signaled a new era in the high-performance computing market. Samsung is currently developing more advanced packaging technologies to I-Cube6 and higher by using a combination of advanced process nodes, high speed interface IPs and advanced 2.5/3D packaging technologies, which will help customers design their products in the most effective way.

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.

# # #



Contact:

Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com




Review Article Be the first to review this article
Aldec

 Advanced Asembly

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
You’re Invited! SEMI’s Innovation for a Transforming World
intelThe Dominion of Design
by intel
The Long Game: Product and Security Assurance
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Setting a High Standard for Standards-Based IP
Jobs
Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California
Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California
Test and Measurement System Architect for Xilinx at San Jose, California
Staff SerDes Applications Design Engineer for Xilinx at San Jose, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California
Upcoming Events
Innovation for a Transforming World -virtual Event at United States - Jul 13 - 14, 2021
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021
7th International Conference on Sensors & Electronic Instrumentation Advances (SEIA' 2021) at Palma de Mallorca, Mallorca balearic islands) Spain - Sep 14 - 16, 2021
Verific: SystemVerilog & VHDL Parsers



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise