Si2 Annual Technical Forum Focuses on Semiconductor Design in the Cloud

AUSTIN, Texas — (BUSINESS WIRE) — July 6, 2021 — The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. - to 10:00 a.m. Pacific Standard Time.

Registration is free. For details click here.

Silicon Integration Initiative is an R&D joint venture providing standard interoperability solutions for semiconductor design tools. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.

AGENDA

Keynote Presentation: Silicon-to-System – Addressing Design, Verification, and Implementation Challenges with Cloud-Based Engineering

David Pellerin
Head of Worldwide Business Development
Hitech/Semiconductor
Amazon Web Services

Executive Panel Discussion: EDA-in-the-Cloud Challenges are Already Solved by Providers

Kerim Kalafala
Senior Technical Staff Member
IBM

Ramond Rodriguez
Senior Director of Strategic CAD Capabilities
Intel

Dr. Rhett Davis
Professor of Computer and Electrical Engineering
NC State University

Rajeev Jain
Senior Director of Technology
Qualcomm

Si2 Technical Coalition Updates

OpenAccess, oaScript Extensions
Marshall Tiner
Si2 Director of Production Standards

Standard Compact Models
John Ellis
Si2 President and CEO

AI/ML, Unified Power Models
Dr. Leigh Anne Clevenger
Si2 Director of OpenStandards

Special Announcement

Learn about a new Si2 industry initiative focusing on silicon-to-system design interoperability

Vic Kulkarni
Si2 Chief Strategy Officer

Annual Power of Partnerships Award

Presented to the Si2 team that has made the most significant contributions to the field of electronic design automation



Contact:

Terry Berke
tberke@si2.org
512-917-1358




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