Sigrity's New Physical Design Solution Accelerates Throughput and Reduces Design Errors in High-Density Packages

Unified Package Designer™ tackles complex IC package design by combining best-in-class layout with new 3D design rule checking and viewing capabilities

SANTA CLARA, Calif., March 27, 2006 - Sigrity, Inc., the market leader in power and signal integrity software solutions, today announced Unified Package Designer (UPD), a new physical design product for single and multi-chip advanced IC packages. Using packaging-specific algorithms, it automates the difficult and time-consuming tasks associated with flip chip and wire bond designs, and ensures designs meet all electrical, manufacturing and reliability requirements. This approach helps designers design IC packages correctly the first time, speeding development. UPD's robust design capability supports a wide variety of package configurations including stacked-die, flip chip, chip scale, and system-in-package (SiP).

UPD builds on the core Encore package design technology that Sigrity acquired from Synopsys two months ago. It adds new 3D design rule checking (DRC) and viewing capabilities, along with a tight linkage to Sigrity's SpeedXP tool suite that handles pre- and post-layout power and signal integrity analysis, decoupling capacitor placement evaluation, and synthesis of highly accurate SPICE models from multi-port S parameters. UPD provides capabilities such as 3D modeling and checking that are necessary for accurately representing the multi-tier wire interactions common in today's stacked-die and high-density wire bond designs, and ensuring manufacturability.

Jiayuan Fang, president of Sigrity, commented: "UPD, with its advanced capabilities for 3D packages, enables companies to handle even the most complex physical design challenges, and produce high-quality designs for manufacturing in the shortest cycle time. Sigrity is fully committed to develop the best-in-class tools to help customers ensure success of their increasingly complex package and system-in-package designs."

Availability
UPD is available now. The new 3D checking and viewing capabilities are included in all UPD licenses at no additional cost. Sigrity is offering a special transition program that provides Encore users a growth path to Unified Package Designer. Full details are available through Sigrity Sales.

About Sigrity
Sigrity, Inc., a privately held U.S. company incorporated in 1998, delivers advanced software solutions for package physical design and for analyzing power and signal integrity in chips, packages and printed circuit boards. Sigrity's patented electrical analysis methodologies run orders of magnitude faster than general-purpose electromagnetic tools, helping leading companies in the semiconductor, computer, graphics, communications and networking industries ensure high performance and reduce time to market. The company is headquartered in Santa Clara, Calif., with direct sales and global distribution through worldwide representatives. For more information about how to ensure operational designs by using Sigrity's package physical design and power and signal integrity analysis solutions, please visit: http://www.sigrity.com.


For more information

Teo Yatman
Sigrity, Inc.
(408) 260-9344 ext. 115
Email Contact

Sarah Miller
ThinkBold Corporate Communications, LLC
(231) 264-8636
Email Contact

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