IBM Unveils World's Fastest On-Chip Dynamic Memory Technology

SAN FRANCISCO, CA -- (MARKET WIRE) -- Feb 14, 2007 -- In papers presented at the International Solid State Circuits Conference (ISSCC) today, IBM (NYSE: IBM) revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (embedded dynamic random access memory).

This new technology, designed using IBM's Silicon-on-Insulator (SOI) for high-performance at low power, vastly improves microprocessor performance in multi-core designs and speeds the movement of graphics in gaming, networking, and other image intensive, multi-media applications.

The technology is expected to be a key feature of IBM's 45nm (nanometer) microprocessor roadmap and will become available beginning in 2008.

IBM's new eDRAM technology, designed in stress-enabled 65nm SOI using deep trench, dramatically improves on-processor memory performance in about one-third the space with one-fifth the standby power of conventional SRAM (static random access memory).

"With this breakthrough solution to the processor/memory gap, IBM is effectively doubling microprocessor performance beyond what classical scaling alone can achieve," said Dr. Subramanian Iyer, Distinguished Engineer and director of 45 nm technology development at IBM. "As semiconductor components have reached the atomic scale, design innovation at the chip-level has replaced materials science as a key factor in continuing Moore's Law. Today's announcement further demonstrates IBM's leadership in this critical area of microprocessor design innovation."

IBM innovations in microelectronics and the company's groundbreaking system-on-a-chip designs have transformed the world of semiconductors. IBM breakthroughs include High-k, which enhances the transistor's function while allowing it to be shrunk beyond today's limits, dual-core and multi-core microprocessors, copper on-chip wiring, silicon-on-insulator and silicon germanium transistors, strained silicon, and eFUSE, a technology that enables computer chips to automatically respond to changing conditions. The White House has awarded IBM the National Medal of Technology, the nation's highest technical honor, for 40 years of innovation in semiconductors.

IBM chips are the heart of the company's server and storage systems, the world's fastest supercomputers and many of the best-known and widely used communications and consumer electronics brands.

eDRAM Specifications

Among the specifications of IBM's high-performance eDRAM technology:

cell size: 0.126 mm2

Power supply: 1 V
availability: 98.7%
Tile: 1K RowX16 Col X146 (2Mb)
AC power: 76 mW
standby keep alive Power: 42 mW
Random cycle time: 2ns
Latency: 1.5ns
About IBM

For more information about leadership semiconductor technologies at IBM, please visit www.ibm.com/chips.

Image Available: http://www.marketwire.com/mw/frame_mw?attachid=424843
Image Available: http://www.marketwire.com/mw/frame_mw?attachid=424848

Add to Digg Bookmark with del.icio.us Add to Newsvine

 

Contact:

Glen Brandow
IBM Media Relations, Technology
Email Contact
914.766.4615 (tie 826)





Review Article Be the first to review this article

Aldec

Featured Video
Latest Blog Posts
Colin WallsEmbedded Software
by Colin Walls
Low power modes
Jobs
Product Applications Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Electrical Engineer ‐  ASIC Layout  for SECOND SIGHT MEDICAL PRODUCTS at Sylmar, California
Principal Software Engineer (Middleware) for Alcon Research, LLC. at Lake Forest, California
Electrical Engineer for SECOND SIGHT MEDICAL PRODUCTS at Sylmar, California
Nano-Optics Process Engineer for DiCon Fiberoptics, Inc. at Richmond, California
Lead Validation Engineer for Alcon Research, LLC. at Johns Creek, Georgia
Upcoming Events
Embedded Systems Conference (ESC) Silicon Valley at San Jose Convention Center San Jose CA - Aug 27 - 29, 2019
Tech Symposium on RISC-V at Hotel Daniel Herzlia Tel Aviv Israel - Sep 5, 2019
PCB West 2019 at santa clara convention center Santa Clara CA - Sep 9 - 12, 2019
SEMICON Taiwan 2019 at TaiNEX Taipei Taiwan - Sep 18 - 20, 2019
DownStream: Solutions for Post Processing PCB Designs
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: UltraPLL



Internet Business Systems © 2019 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise