SAN JOSE, Calif., - Dec. 10, 2007 – Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, announced today that Broadcom Corporation has evaluated Magma’s Talus® IC implementation platform and determined that Talus delivered significant advances in runtime, power reduction and timing closure over Magma’s previous generation technology, Blast Fusion®. Talus’ Automated Floorplan Creation also generated a smaller floorplan without user intervention, a significant efficiency advantage. Broadcom, a global leader in semiconductors for wired and wireless communications and a long-time user of Magma’s IC implementation products, will use Talus in Broadcom’s suite of place and route technologies for 65-nm chip development.
“Talus performed very well in this evaluation and gave us confidence to deploy it at Broadcom,” said Neil Kim, senior vice president of Central Engineering at Broadcom. “We are excited to continue to work with Magma and its next-generation Talus technology.”
“We are obviously very pleased that Talus delivered such positive results for Broadcom,” said Kam Kittrell, general manager of Magma’s Design Implementation Business Unit. “This is further confirmation that Talus will become the industry’s choice for 65- and 45-nm design.”
Magma's software for designing integrated circuits (ICs) is used to create complex, high-performance chips required in cellular telephones, electronic games, WiFi, MP3 players, DVD/digital video, networking, automotive electronics and other electronic applications. Magma's EDA software for IC implementation, analysis, physical verification, circuit simulation and characterization is recognized as embodying the best in semiconductor technology, enabling the world's top chip companies to "Design Ahead of the Curve" while reducing design time and costs. Magma is headquartered in San Jose, Calif., with offices around the world. Magma's stock trades on Nasdaq under the ticker symbol LAVA. Visit Magma Design Automation on the Web at
Magma Design Automation Inc.
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