CHANDLER, Ariz.—(BUSINESS WIRE)—June 30, 2008—
Amkor Technology, Inc. (Nasdaq: AMKR) today announced the introduction
of a new flip chip packaging technology to be featured at SEMICON
West2008 July 15 - 17. The breakthrough in high performance flip chip
packaging utilizes an advanced molding process technology that is
expected to provide a number of design, cost and performance advantages
for field programmable gate arrays, CPUs, graphics processors and ASICs
that are widely used in embedded processing applications like PCs,
servers, switches and personal gaming machines. The new molding process
establishes a platform technology, with the first package offering for
flip chip (over) molded ball grid array called FCM
The advanced molding process used in the FCMBGA
package underfills the flip chip die with molding compound providing
both mechanical and electrical performance advantages. Mechanical
Larger die to package ratios that reduce package footprints providing
improved printed wiring board utilization.
Reduced package warpage for tighter coplanarity control which improves
surface mount assembly.
Improved package mechanical reliability by reducing material stresses.
Additional mechanical support for heat sink attachment and multi die
Electrical improvements include:
Improved signal integrity for noise sensitive high speed signals
through the placement of surface mounted passive devices (like
decoupling capacitors) closer to the die.
Reduced signal lengths and power distribution for challenging signal
and power integrity requirements by enabling use of coreless or thin
“Amkor developed this technology as a cost and
performance enhancement to our industry leading SuperFC®
package family. The molded structure improves coplanarity without
requiring a stiffener, yet offers flexibility for lid attach in large
package or high power applications,” said
Miguel Jimarez, vice president of Advanced Process Development at Amkor.
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of
semiconductor assembly and test services. The company offers
semiconductor companies and electronics OEMs a complete set of
microelectronic design and manufacturing services. More information on
Amkor is available from the company's SEC filings. Additional technical
information on FCMBGA can be found on Amkor's
Amkor Technology, Inc.
Manager II, Marcom
480-821-5000 ext. 5415