March 05, 2009 -- R3Logic, world leader in design tools for 3D integrated circuits announces that it has created a new R&D center in Grenoble, France to develop and enhance its design tools for 3D heterogeneous system and system-in-package design. This center is part of a newly created French subsidiary, R3Logic-France, which when fully staffed over the next two years will employ over 20 engineers. The center will work in close collaboration with ST Microelectronics and with CEA-LETI (Laboratoire d’Electronique et de Technologie de l’Information).
Within our "Systems On Chip" developments, design requirements dictate partitioning functions onto several chips that must be integrated within a single package,” says Dominique Henoff, Advanced Technology & Innovation Director for ST’s Home Video Division. “This engenders a complex system where different tools are used concurrently to treat different aspects of the problem: SOC design, substrate design, signal integrity, thermal management, environmental constraints, RF, …. Right now, all of these problems are handled individually, while the simple movement of an interconnect between two elements can break the entire system. ST sees very favorably R3Logic’s solution to build a full 3D design flow that combines multiple point tools to obtain the best solution in a specifications/time and price/performance space.”
Laurent Malier, General Manager of CEA-LETI further adds, “The availability of 3D integration capabilities is a major step for a wide range of products. We believe that R3Logic’s 3D design solutions will accelerate our developments in 3D chip-package co-design. This is critical because there are no available tools that allow us to manage all of the different aspects of the design flow in an integrated fashion.”
Patrick Botti, R3Logic’s COO, and a native Frenchman with dual US-French citizenship, will serve as General Manager of R3-France. Lisa McIlrath, R3Logic’s CEO, who has lived in France and holds a degree from the University of Paris VII, is very excited about this new center. “Grenoble is a very vibrant city and the designers coming out of the schools in the area are top-notch. R3-France will be strategically located right in the heart of Europe where we can effectively participate in multiple European projects, with ST, LETI, Fraunhofer, IMEC, and many others.”
R3Logic is a privately-held company, founded in 2000, specializing in the design of 3D integrated circuits. Since 2001, working with DARPA-sponsored research programs, it has developed a unique set of patent-pending EDA tools for 3D integrated circuit design. In October 2007, in partnership with Micro Magic, Inc., it announced the first commercial true 3D Mask Layout Editor, MAX-3D. MAX-3D is incorporated within the full MMI tool suite and licensed by Micro Magic. R3Logic has been a participant in US Government-sponsored 3D Electronics research since its inception.
For more information, please visit www.r3logic.com or send e-mail to ( Email Contact).