SAN JOSE, Calif. — (BUSINESS WIRE) — October 6, 2010 — Apache Design Solutions, the technology leader in power integrity and noise closure for chip-package-systems (CPS) convergence, along with Texas Instruments, Cadence, Insight SiP and Amkor will present a technical panel discussion on the topic of Advanced Packaging Technology at the Sophia Antipolis Microelectronics Forum on October 6th, 2010.
|Apache Design Solutions|
|Wednesday, October 6, 2010|
|15:30pm – 17:00pm|
|Sophia Antipolis Microelectronics Forum 2010|
|Room: Amphi Lumière|
|2229, route des Cretes|
|06560 Sophia Antipolis, France|
About Apache Design Solutions
Apache delivers the industry’s leading power and noise solutions for chip-package-system (CPS) convergence from RTL to sign-off. Apache's innovative platforms address the unique power and noise challenges associated with specific design domains such as digital, analog/mixed-signal, and IC package/PCB, while providing a co-analysis environment that integrates the SoC, custom IP, and System worlds. From RTL power analysis and reduction, to early stage prototyping and optimization, and through chip and package sign-off, Apache’s products enable designers to lower power consumption, increase operating performance, reduce system cost, and mitigate design risks. Apache is a global company with R&D centers and direct sales/support offices worldwide and their products are adopted by all of the top semiconductor companies.
Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.
Apache Design Solutions
Yukari Ohno, 408-457-2000