Ensphere Solutions Announced the Availability of a New 10G Transceiver and Low Power Laser Diode Shunt Driver ICs Targeting 10G Optical Modules.

An Optimized Pair Intended to Minimize the Power Dissipation of 10G Optical Modules --

Santa Clara, Calif., January 24, 2011 – Ensphere Solutions, an emerging leader in advanced communications semiconductor ICs, today announced the availability of a new 10G transceiver IC (ESI-1002) as well as matching laser diode shunt driver IC (ESI-1010).

ESI-1002 is a highly integrated 10G Optical Transceiver Device with integrated limiting amplifier (LIA) and vertical-cavity surface emitting laser (VCSEL) driver. It can be used in optical modules for 10G Ethernet, 4G, and 8G Fiber Channel (FC). It is fully compliant to SFF-8472 electrical requirements and supports a SPI processor interface for diagnostics and monitoring. The device includes elaborate circuitry to monitor key parameters such as system supply voltage, temperature, laser bias and modulation currents, transmit power levels, and many other key parameters. This device can also be used to drive FP/DFB laser in conjunction with an external driver such as ESI-1010. ESI-1002 can drive VCSELs with up to 28mA modulation current. A complete system will have a power dissipation of less than 800mW which includes the laser current.

ESI-1010 is a single channel 10G laser diode driver (LDD) able to support a wide variety of laser RC time constants. It is capable of supplying up to 100 mA of bias and 50 mA of modulation currents. In a shunt configuration, ESI-1010 assumes the heavy burden of driving a low impedance laser diode while presenting a 50Ω load to the preceding driver which is far easier to drive. This configuration reduces the overall power dissipation of the system dramatically. ESI-1010 is implemented in a low power CMOS technology and has a power dissipation of only 50 mW. This device is available in die form and can be installed in constricted spaces adjacent to the actual FP/DFB laser. This minimizes the length of bond wires. Its predriver can be conveniently placed further away with no risk of signal integrity degradation.

“These products have been defined and developed in close cooperation with leading optical module vendors and are being shipped in volume” said Hessam Mohajeri, Ensphere’s Chief Executive Officer. “Aside from low power dissipation, their key differentiation is the fact that they have been part of real live networks and have passed the test of time with flying colors”.

“Our application engineering team has a wealth of experience in building optical modules based on these products” said Al Gharakhanian, Ensphere’s VP of Marketing. “We have found that optimized packaging and installation techniques to be as important as device performance in determining the overall performance of the optical module”.


These two products are released to production and are available for volume shipment. The pair is priced at $5 in high volumes.

About Ensphere Solutions Inc.

Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA, the company specializes in the development of standard and custom mixed signal transceivers and RF chips. The company’s standard products are targeted for high-speed optical data communications.


Al Gharakhanian
Vice President of Marketing
Email Contact
(408) 850-3520

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