MoSys to Exhibit and Present at IEEE Hot Chips

Company is a Gold Sponsor of Event

SANTA CLARA, Calif. — (BUSINESS WIRE) — August 17, 2011 — MoSys, Inc. (NASDAQ: MOSY):

Who:

 

MoSys (NASDAQ: MOSY), a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is presenting at IEEE Hot Chips.

 

MoSys’ VP of Technology Innovation and System Applications, Michael Miller, will be presenting, “Bandwidth Engine Serial Memory Chip Breaks 2 Billion Accesses per Second.” Miller will discuss the first commercially available smart memory chip from MoSys, the Bandwidth Engine®, and its newly sampling single chip serial memory device that delivers 2x to 4x the performance of any currently available network memory device, such as QDR SRAM or RLDRAM.

 

What:

Hot Chips is one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits. It is sponsored by the IEEE Technical Committee on Microprocessors and Microcomputers in cooperation with ACM SIGARCH.
 

When:

Hot Chips takes place August 17-19, 2011.
 

Where:

Stanford Memorial Auditorium Stanford University
551 Serra Mall
Stanford, CA 94305
 

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