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HDL Design House selects Silicon Frontline’s P2P Software for Fast, Easy IR Drop and Resistance Mapping
PC Shipments Show Continued Strength in Q1 2021 Despite Component Shortages and Logistics Issues, According…
Accellera IP Security Working Group's Draft Standard SA-EDI 1.0 Now Available for Public Review
"How does the Mars Perseverance rover benefit from FPGAs as the main processing units?" by Farhad Fa…
"What’s on Tap from the ESD Alliance? Plenty! Read On …" by Bob Smith, Executive Director
"New emulation and prototyping systems; Arm v9 architecture; low power FPGAs; HKMG DRAM; automotive …
Cadence Announces First Quarter 2021 Financial Results Webcast
Cadence Delivers Automotive Reference Flow for Samsung Foundry 14LPU Process Technology
Cadence Collaborates With Samsung Foundry to Accelerate Hyperscale Computing SoC Design for Process …
Open Source FPGA Launches Foundation to Accelerate Widespread Adoption of Programmable Logic
John Lee of Ansys Joins Si2 Board of Directors
5G Connectivity Agenda for Ansys Simulation World 2021 is now online
Interview with Jean-Marie Brunet, Senior Director Product Management/Engineering - Emulation and Prototyping…
Cypress Industries Expands Printed Circuit Board & High Level Assembly in Mexico
AVISHTECH INTRODUCES LATEST GENERATION OF ITS REVOLUTIONARY Gauss 2D Field Solver Tool
Intel Launches Its Most Advanced Performance Data Center Platform
Synopsys and Samsung Foundry Collaboration Delivers High-Performance Physical Signoff on Samsung SAFE…
H.I.G. Capital Completes Acquisition of SMTC Corporation
Siemens introduces PCBflow, a secure, cloud-based solution for accelerating design-to-manufacturing …
Synopsys Extends Market Leadership in Verification Hardware with Performance and Enterprise Scalability…
Cadence Unveils Next-Generation Palladium Z2 and Protium X2 Systems to Dramatically Accelerate Pre‑Silicon…
Industry Strategy Symposium Europe to Explore Digitalization, Security and Environmental Sustainabil…
Siemens’ Veloce Virtual Network App Certified for IxVerify 3.0
Monozukuri Joins ESD Alliance
DVCon Europe Announces Format and Dates for Eighth Edition and Issues Calls For Papers, Tutorials And…
North American Semiconductor Equipment Industry Posts February 2021 Billings, Surpassing $3 Billion …
vayyar becomes first and only company in world to offer full-cabin monitoring with one radar-on-chip…
SEMI Joins UK Initiative to Promote Cybersecurity Adoption
SEMI Applauds Initiatives to Bolster Semiconductor Manufacturing and Research in American Jobs Plan
"Special report: EDA requirements in the design of AI accelerator chips" by Roberto Frazzoli
SEGGER Embedded Studio Available for the Renesas RE Family of MCUs
Enhanced X-FAB Process Variant Enables Major Boost in Photodiode Responsiveness
Media Alert: Intel to Launch 3rd Gen Intel Xeon Scalable Portfolio
SiFive and DARPA Collaborate to Bring the Power of RISC-V to Technology Innovation
Elliptic Labs Collaborates with Cadence to Bring Advanced Virtual Sensors to More Embedded Systems
Ultra Librarian and TDK Partner to Provide a Multi-Power Module Reference Design in 8 Different CAD Formats
Arm’s Solution to the Future Needs of AI, Security and Specialized Computing Is v9
Tortuga Logic and DARPA Extend Partnership Through the DARPA Toolbox initiative.
Synopsys Authorized as a CVE Numbering Authority (CNA)
Digi-Key Electronics Adds DKRed Custom Circuit Board Option to PCB Builder
QP Technologies™ Expands Interposer Design Capabilities
IPC Releases Version 1.3 of IPC-2591, Connected Factory Exchange, the Industry’s Only Clean Data Pipeline…
SEMICON Southeast Asia Rescheduled to 23-27 August 2021 as Hybrid Event
Siemens delivers next-generation, comprehensive hardware-assisted verification system
Volkswagen Brand Annual Media Conference 2021 unveils its New Vision of Electric Future
eInfochips teams with Tricentis to offer AI Driven test automation services
Intel Unleashed: Engineering the Future - Intel CEO Pat Gelsinger outlines Intel's path forward
Interview with Dr. Rado Danilak, CEO, Tachyum
Lattice Announces Training Webinar Focused on Low Power, FPGA-based RISC-V Embedded System Design Using…
PLDA Joins ETP4HPC to share its expertise in High Speed Interconnect Solution IP with the European High…
Synopsys Research Reveals Significant Security Concerns in Popular Mobile Apps Amid Pandemic
GUC and Ansys Expedite Advanced-IC Designs for Next-Generation Applications with State-of-the-Art Simulation…
"Automating IP and SoC Development" by Anupam Bakshi
"Intel announces two new U.S. fabs and launches its own foundry business" by Roberto Frazzoli
Interview with Sanjeev Kumar, CEO, Logic Fruit Technologies
Intel AI-Powered Backpack Helps Visually Impaired Navigate World
Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias…
Synopsys Collaborates with Keysight Technologies to Deliver Integrated Custom Design Flow for 5G Des…
Valtrix and Codasip Cooperate on Verification of RISC-V Systems
OneSpin Escalates Growth Addressing the Need for Assuring IC Integrity
Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy for Manufacturing, Innovation and Product L…
The Design Automation Conference Offers Opportunities for Students to Engage in the Annual Event Focused…
GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF’s Most Advanced…
Achronix Adopts Movellus Maestro Clock Network for Its Speedster7t FPGAs
Tachyum Unveils Prodigy Universal Processor FPGA Emulation Prototype
Interview with Graham Curren, CEO, Sondrel - Specialists in large complex digital ASICs
Teledyne e2v HiRel Unveils Two New High-Power PIN Diode Limiter Modules
Global Semiconductor Materials Market Sets New High of $55.3 Billion With 5% Expansion in 2020, SEMI…
Ansys Receives TSMC OIP Ecosystem Forum Customers' Choice Award for 5G Millimeter Wave Chip Analysis…
"China news; Cadence Sigrity X; DARPA initiatives; AI in process control; Northvolt-Volkswagen deal"…
X-FAB Enters into Collaboration with IHP to Progress SiGe BiCMOS Technology
Ron Black Joins Codasip as Executive Chairman
Airborne System Design Assurance: Aldec Adds 60+ New HDL Rules to ALINT-PRO’s DO-254 Plug-In
Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
Riviera-PRO™: OSVVM 2020.08 inclusion, enhanced language support, and new debugging features aim to…
Inventhub Unveils New Collaboration Tools for the Electronics Hardware Industry
Deca collaborates with ASE and Siemens to launch APDK™ design methodology
GBT Seeking to Develop New EDA Technology to Achieve Improved IC DFM (Design for Manufacturing)
SEGGER J-Link, Flasher, and Embedded Studio Now Support Raspberry Pi RP2040
Mouser and Molex Sponsor Dale Coyne Racing with Vasser Sullivan for 2021 IndyCar Season
Arasan announces its next generation of C-PHY / D-PHY Combo IP core compliant with the latest MIPI S…
Synopsys Launches Industry's First Complete IP Solution for PCI Express 6.0
SMTC Corporation Announces Fourth Quarter and Full Year 2020 Financial Results
AWS Announces General Availability of Amazon EC2 X2gd Instances Powered by AWS-designed Graviton2 Pr…
Cloud Spectator Cloud CPU Benchmarking Report Finds AMD Ahead Of Intel
Global Fab Equipment Spending Poised to Log Three Straight Years of Record Highs, SEMI Reports
Introducing 11th Gen Intel Core: Unmatched Overclocking, Game Performance
Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis
MathWorks Introduces Release 2021a of MATLAB and Simulink
Lenovo Delivers Edge-to-Cloud Solutions With AMD EPYC™ 7003 Processors, Setting a New Standard for…
"Take a break – the break statement in" by Colin Walls
"Performing cross spectrum video processing on a TySOM-3 board" by Igor Tsapenko
Mouser Electronics Recognized As Global Distributor of the Year by Littelfuse for Tenth Year
Ansys Appoints Jim Frankola to the Board of Directors
Rockley Selects Synopsys for Silicon Photonics Design Solutions
Frontline's new PCB process planning solution accelerates time to market and dramatically increases …
SEMICON China 2021 Opens Tomorrow with Chip Industry Innovation, Growth, Talent in Focus
Maven Silicon offers cloud-based online VLSI courses worldwide for the electrical engineers who aspire…
Worldwide Server Market Revenue Grew 1.5% Year Over Year in the Fourth Quarter of 2020, According to…
"SEMI Panel Touts Innovation from Electronic System Design Ecosystem" by Bob Smith, Executive Direct…
"Vitis HLS now open source; an OS to manage SoC test; advancements in FD-SOI, EUV litho and DSA; AI …
SEGGER’s Embedded Studio Receives Strong Feedback from German Electronic Engineering Community
CEA-Leti Envisions Widespread Use of LiDAR Systems Based on Integrated Optical Phased Arrays (OPAs)
Interview with Semir Haddad, Senior Director Product Marketing, Eta Compute
OIF Wraps Q1 2021 Member Meeting with New Co-Packaging Project; 3.2T Co-Packaged Module Project for …
Open RF Association and MIPI Alliance Sign Cooperation Framework (Liaison) Agreement
Napatech Software Optimized for Silicom's Latest Intel FPGA-Based SmartNICs
SiPearl: key milestone for Rhea’s launch by moving into an accelerated simulation phase with Siemens’…
SigmaTron International, Inc. Reports Third Quarter Financial Results for Fiscal 2021
The PC Shipment Wave Continues as Volumes Are Forecast to Grow 18.2% in 2021 with a 5-Year CAGR of 2.5%,…
DVCon U.S. 2021 Announces Stuart Sutherland Best Paper & Best Poster Winners, Attendance Numbers
Alphawave and PLDA Announce a Collaboration to Create Tightly-Integrated Controller and PHY IP Solutions…
Tortuga Logic Announces Expansion of Product Portfolio with Development of New Security Governance P…
Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer…
Ansys Named to Fast Company's Annual List of the World's Most Innovative Companies for 2021
Altix to exhibit Virtually at IPC APEX EXPO 2021
WEBINAR: Five Ways to Save Money by Bundling Fab & Assembly
Nominations for the 58th Design Automation Conference Innovators Under 40 Award Now Open
Cadence Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for N3 Collaboration
DATE 2021 conference – the DATE community gathered virtually in large numbers for another unique c…
Weebit Nano files two new patents optimising programming of ReRAM
eBook: Looking-out for Loops: Inductive Ground-bounce Basics
Silicon Labs Extends Award-Winning xG22 Platform to Deliver Optimized 32-Bit MCU for IoT Edge Applic…
Cadence’s Nimish Modi to Present at Berenberg Conference
Introducing Dolphin Design’s new Audio CODEC for TWS devices with ANC capabilities
Ansys to Present at Berenberg Design Software Conference 2021
Accelerating PCB Assembly Quoting with Valor BOM Connector - Interview with Oren Manor, Director of …
WHITEPAPER: Automated Optical Inspection 101
IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and …
"Special Report: Machine Learning" in EDA by Roberto Frazzoli
Participate in the PCB Manufacturing Trends Survey for a chance to win $100 Amazon Gift Card
The 58th Design Automation Conference Opens Call for Nominations for the Prestigious Marie R. Pistilli…
Synopsys Announces Euclide to Accelerate Design and Verification Productivity
"Remembering Jim Hogan" by Bob Smith, Executive Director
Mouser Sponsors 2021 Global Create the Future Design Contest
Special report: EDA requirements in the design of AI accelerator chips
Interview with Shahram Mossayebi, Founder and CEO, Crypto Quantique
Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices
Keysight Launches Test Solution for Electric Vehicle Charging and Grid-Edge Applications
Learn About the RISC-V ISA with Two Free Training Courses from The Linux Foundation and RISC-V Inter…
IAR Systems and Secure Thingz launch shrink-wrapped solution for organizations targeting EN 303645 compliance…
Infinite Electronics Announces Significant Growth Investment from Warburg Pincus
Sondrel launches family of reference designs that can reduce design costs and time by up to 30%
Breker Launches the Synthesizable VerificationOS to Simplify and Streamline the Composition of High-Coverage, Portable Test Content
Avishtech Introduces Latest Generation of its Revolutionary Gauss Stack PCB Stack-Up Tool
Multi-gigabit calls for Optical Connectivity in Vehicles - Interview with Carlos Pardo, CEO, KDPOF
SPARK Microsystems Announces CDN$17.5 Million Financing Led by Cycle Capital to drive commercializat…
Arasan announces the immediate availability of its MIPI C-PHY / D-PHY Combo IP for SoC Designs on TSMC…
Wave Computing and MIPS Emerge from Chapter 11 Bankruptcy
Lenovo Reveals New ThinkEdge Portfolio of Embedded Computers
IAR Systems adds Functional Safety certification for build tools for Linux
Virtual MSTC 2021 to Showcase Next Wave of Sensorization for Driving Medical and Mobility Advances
Siemens delivers next-generation, comprehensive hardware-assisted verification system
Wanxiang Blockchain Forms RISC-V International Blockchain SIG with Ecosystem Partners
SEMI Applauds President Biden, Bipartisan Congressional Leaders for Supporting Semiconductor Supply …
Royal Circuit Solutions Completes Manufacturing Expansion
Filo Leverages Silicon Labs Bluetooth Modules for Life-Saving Baby Car Seat Alarm
Qurv and Infineon Win for Leading MEMS and Image Sensors Innovations at SEMI Technology Showcase
Silicon Labs and Wolfspeed Partner to Deliver High-Performance Power Module Solution
SEMICON West Rescheduled to December 2021 for Inaugural Colocation with Design Automation Conference…
videantis passes milestone of enabling 10 million production vehicles
Octane and Silicon Catalyst Announce a Broad Collaboration to Support Semiconductor Innovation
Siemens and ASE introduce enablement technologies for next-generation high density advanced package …
SEGGER Introduces Flasher Compact – The Credit-Card-Size Almost-Anything-Programmer
Cadence’s Lip-Bu Tan to Present at Morgan Stanley Conference
Synopsys Co-CEO Aart de Geus to Speak at Virtual Morgan Stanley Technology, Media & Telecom Conferen…
CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces…
Altair Announces Fourth Quarter 2020 Financial Results
HP Inc. Reports Fiscal 2021 First Quarter Results
Altium and AWS Collaborate to Advance Electronic Design
The 22nd ISQED Conference Highlights AI/ML & Electronic Design, Autonomous Vehicles, and Security
Ansys Announces Financial Results With Record Q4 and FY 2020 Revenue, ACV and Operating Cash Flow
Keysight Delivers New Event-Based Power Analysis Software
Synopsys Delivers Breakthrough Performance with New ZeBu Empower Emulation System for Hardware-Software…
Cadence Completes Acquisition of NUMECA
Altair Acquires Flow Simulator; an Integrated Flow, Heat Transfer, and Combustion Design Software, from…
"Concerns over Nvidia-Arm deal; ISSCC innovations; DAC postponed to December" by Roberto Frazzoli
EMA Becomes Distribution Partner for SkillCAD Cadence Virtuoso Layout Automation Suite
Teledyne LeCroy Announces Industry-First Capability to Analyze PCI Express® Across Physical and Protocol…
Amkor Factory Intelligence Enables Industry 4.0
Matthew Ballance to Receive Accellera Systems Initiative Technical Excellence Award
Interactive Reference Designs are Now Available From Trinamic on Ultra Librarian
Teledyne LeCroy Enables First-Ever Full Picture of PCIe with Launch of CrossSync™ PHY
Cadence Reports Fourth Quarter and Fiscal Year 2020 Financial Results
Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies
Ansys Collaborates with Keysight Technologies to Help Engineers Tackle Significant System Design Challenges…
IAR Systems introduces 64-bit Arm core support in leading embedded development tools
North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for …
Scalable IoT Security Enabled by EPS Global and Crypto Quantique
Virtual FLEX Conference 2021 Opens with Leading-Edge Innovations to Make the World Safer
Ansys Launches Moxie to Enhance System Model Validation Processes
Apple M1-Optimized Build of SEGGER Embedded Studio Now Available
Synopsys CFO Trac Pham to Speak at Virtual KeyBanc Conference
Keysight Technologies Reports First Quarter 2021 Results
PLDA Announces a Unique CXL™ Verification IP Ecosystem, Delivering Robust Verification That Reduces…
IAR Systems strengthens functional safety offering with extended standards coverage
SEMI and 16 Industry Groups Send Letter to President Biden Urging Support for CHIPS Act Funding and …
IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust
Synopsys Posts Financial Results for First Quarter Fiscal Year 2021
Arteris IP Adds a Record 28 New Licensees in 2020
"SIA letter to Biden; TSMC expansion; processor updates; CEA-Leti quantum computing news" by Roberto…
Industry's First MIPI M-PHY® GEAR 5 UFS 4.0 Protocol Analyzer and Exerciser
The 58th Design Automation Conference Has Been Rescheduled for December 2021
Ultra Librarian Adds STMicroelectronics Reference Designs in Cadence System Design Formats
IPC Releases IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components…
Interview with Matt Commens, Lead Product Manager for HFSS, Ansys
SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and…
"Variable declarations in C – plenty of pitfalls" by Colin Walls
Silex Insight partners with Crypto Quantique to deliver end-to-end IoT security
Keysight Introduces Massively Parallel Board Test System to Enable Higher Throughput in a Smaller Fo…
Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-v Core
X-FAB Makes Major Enhancements to its 180 nm APD and SPAD Devices with Boosted Photon Detection Performance…
"AUGER: Celebrating Our Users" by Anupam Bakshi
"Atmosic Technologies Electronics Design Industry Predictions" by 2021 EDACafe Predictions
Allterco Robotics Delivers Next Gen Shelly Motion Sensor Optimized with Silicon Labs Wi-Fi Technolog…
IOTech edge software platform now supports Computer Vision and AI at the IoT edge
CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Suprem…
Altair to Announce Fourth Quarter and Full Year 2020 Financial Results on Thursday, February 25, 202…
Intel Fuels RAN Innovation for 5G Network Transformation
Phil Kaufman Hall of Fame Announced by ESD Alliance and IEEE CEDA Posthumous Recognition for Individuals…
French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very…
Keysight and Transphorm Create Power Supply Reference Design That Lowers Product Costs; Speeds Time …
Arteris IP Adds Two Veteran Executives to its Board of Directors
"A quick look at DATE Conference 2021" by Roberto Frazzoli
"Nominations Now Being Accepted for the Inaugural Phil Kaufman Hall of Fame Honor" by Bob Smith, Executive…
New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale…
Mouser Stocks Industry’s Widest Selection of Products
Keysight’s O-RAN Test Solutions Enable Xilinx to Accelerate Development of Massive MIMO Radio Reference…
Customers Experience Speed Increases of up to 80% on PCB Designs Using Pulsonix 11.0
Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform …
"EDA updates; Indy Autonomous Challenge; Qualcomm-Nuvia deal; RRAM-based edge learning; robomorphic …
CEA Is the First Research Center to Acquire A Cryogenic Prober for Testing Quantum Bits
TEC – Timing Equivalence Checking; a modern design flow necessity
Video: IPC APEX EXPO 2021 is the place to be...from wherever you are!
"EMA Electronic Industry Predictions" by 2021 EDACafe Predictions
IC’Alps joins X-FAB design & supply chain partner network to better support X-FAB’s customers with…
Synopsys Announces Earnings Release Date for First Quarter Fiscal Year 2021
Altair to Virtually Present at the Goldman Sachs 2021 Technology & Internet Conference
Synopsys Selected for Rapid Assured Microelectronics Prototypes Program
Arteris® IP FlexNoC® Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip …
11th Gen H35 Processors: Fastest Single-Threaded Laptop Performance
SEGGER Ecosystem Available for the Renesas RE MCU Family
Pulsic Delivers Real-Time, Accurate, Layout Previews to Analog Circuits Designers with the new Animate Preview
Mouser Electronics Releases New Intelligent Revolution eBook Examining AI in Humanitarian Applications
Interview with Brian Faith, President & CEO, QuickLogic
Qualcomm Announces First Quarter Fiscal 2021 Results
TTM Technologies, Inc. Reports Fiscal Fourth Quarter and 2020 Results
"Chip shortage; EDA updates; Qualcomm’s automotive offering; rumors of a Texas Samsung fab; AI updates"…
"Menta Predictions – Disrupting Adaptive Compute at The Edge" by 2021 EDACafe Predictions
Sondrel builds on 7nm design work to offer 5nm
Excellicon’s end-to-end timing constraints solution is now ISO-26262 Certified according to Automotive Safety Integrity Levels, for Road Vehicle Functional Safety standard
Interview with Aparna Dey, DVCon U.S. General Chair
2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disrupti…
Altium Empowers High School STEM Teachers with a Virtual Electronic Design Curriculum and Tools
Cadence Announces $5M Endowment at Massachusetts Institute of Technology
Worldwide Semiconductor Revenue Grew 5.4% in 2020 Despite COVID-19 and Further Growth Is Forecast in…
OIF Validates Maturity of Transport SDN APIs in 2020 Multi-Vendor
Rescale Raises $50 Million in Series C Funding
SEMICON Korea 2021 Opens Tomorrow With AI, Sensors, Smart Manufacturing and Talent in the Spotlight
Rambus Reports Fourth Quarter and Fiscal Year 2020 Financial Results
Global Semiconductor Sales Increase 6.5% to $439 billion in 2020
Aparna Dey of Cadence Joins Si2 Board of Directors
Velodyne Lidar Licenses TSN IP Core from CAST
Mouser Partners with DRAGON / PENSKE AUTOSPORT Formula E Racing for 7th Year
Interview with Rick O'Connor, Founder, CEO, OpenHW Group
Silicon Labs Expands Automotive Timing Portfolio with New SmartClockTM Technology
Apple and Energetiq Executives Appointed to SEMI Foundation Board of Trustees
North American Semiconductor Equipment Industry Posts December 2020 Billings
ANSYS to Release Fourth Quarter and FY 2020 Earnings on February 24, 2021
NI Reports Record Quarterly Revenue
TE Connectivity's new board-to-board stacking connectors offer an economic way to upgrade COM Express…
Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance…
"Innovating for the Future! Electronic System Design –– Where Microelectronics Begin" by Bob Smith,…
Synopsys Delivers Industry's First Integrity and Data Encryption Security IP Modules for PCI Express…
GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability
"IAR Systems Embedded Development Trends 2021" by 2021 EDACafe Predictions
"Why Users Care about EDA Partnerships" by Anupam Bakshi
Andes Technology Corp. Announces EdgeQ to Deliver Converged 5G and AI Silicon Platform with AndesCore™…
Ansys 2021 R1 Unlocks Unlimited Possibilities for Engineering Teams
SEMICON Southeast Asia Postponed to August 2021 with Smart Technologies in Focus
CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial A…
"System Verilog UVM Callbacks: Development and Usage" by Ankit Gopani
"System Verilog Array Randomization" by Ankit Gopani
ARCS 2021 CfP: A Cambrian Explosion of Novel Computer Architectures?
"Poem: California poet Amanda Gorman’s ‘The Hills We Climb’" by Administrator
"KDPOF EDACafe Predictions" by 2021 EDACafe Predictions
"PRFI- Predictions for 2021 – EDA Café" by 2021 EDACafe Predictions
Avery Design Announces CXL™ 2.0 VIP
"Semtech -EDACafé 2021 Predictions" by 2021 EDACafe Predictions
Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA …
SEGGER's J-Link OB plays crucial role in new BBC ‘HiFive Inventor’ educational kit
High Density Packaging User Group Announces Nippon Denkai Membership
DVCon U.S. 2021 Provides Outstanding Technical Program on Virtual Platform
Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
Ansys Launches HFSS Mesh Fusion, Redefines Product Development by Enabling Design of Entire Systems
"Embedded Innovation / EDA Café – Covid – digitalization" by Predictions 2021
"Ansys Elecronic Design Industry Predictions" by Predictions 2021
"Electronic Design Industry Predictions for EDACafe.Com – Lanza techVentures" by 2021 EDACafe Pred…
"SmartDV – Electronic Design Industry Predictions" by 2021 EDACafe Predictions
Interview with Calista Redmond, CEO, RISC-V
Cadence to Acquire NUMECA to Expand System Analysis Capabilities With Computational Fluid Dynamics
"The Semiconductor Industry will Persevere in 2021" by 2021 EDACafe Predictions
"Libraries – a good way to promote embedded code reuse?" by Colin Walls
"Electronics Industry Predictions – Quicklogic" by 2021 EDACafe Predictions
"Intel’s new CEO: comments from media and analysts" by Roberto Frazzoli
"Synopsys: 2021 Predictions for EDA Innovation" by 2021 EDACafe Predictions
Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
PLDA Announces XpressLINK-SOC™ CXL Controller IP with Support for the AMBA CXS Issue B Protocol
Annual Outlooks at Virtual ISS 2021 Point to Global Economic and Chip Industry Growth
CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning
MIPI Specifications and Testing
Sondrel reduces lead times in SOC development via an early assignment of bumps in BGA packages
SEGGER's complete J-Link software now available for Linux on ARM
SOI Industry Consortium Joins SEMI as Strategic Association Partner
Weebit Nano appoints industry veteran Ishai Naveh as CTO
Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process…
Virtual FLEX 2021 to Showcase Leading-Edge Innovations to Make the World Safer
Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
BeagleBoard.org® and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
"EDA Q3 figures; Achronix to list on Nasdaq; automotive chip shortage; SMIC added to Entity List; AI…
"Electronic System Design Reports 15% Q3 Revenue Growth; IP, Asia Pacific Surpass $1B" by Paul Cohen…
"Xilinx 2021 CEO Outlook" by 2021 EDACafe Predictions
Kinetic Vision Improves PCB Workflow by 500% with Altium 365
Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance…
GENIO™ IC/Package Co-Design EDA Tool First to Offer End-to-End Optimization
Intel Announces Four New Processor Families
Indy Autonomous Challenge Unveils Racecar for World’s First Head-to-head, High-speed Autonomous Race…
PC Sales Remain on Fire as Fourth Quarter Shipments Grow 26.1% Over the Previous Year, According to …
Cadence Announces Fourth Quarter and Fiscal Year 2020 Financial Results Webcast
Altair to Virtually Present at the 23rd Annual Needham Growth Conference
Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management
Teledyne to Acquire FLIR Systems
Teledyne e2v HiRel Unveils Two High Power GaN HEMTs to its 650 V Family
Teledyne Announces Improved Preliminary Fourth Quarter and Full Year Results
SEGGER Flasher PRO – Progamming QSPI Flashes at Maximum Speed
Synopsys CFO Trac Pham to Speak at Virtual Needham Growth Conference
Mouser Electronics Adds Over 70 New Manufacturers in 2020 to Its Industry-Leading Line Card
Andes Technology Provides RISC-V CPU Core to SK Telecom
 Si2 Workshop Explores Global Effort to Measure AI Compute Capacity and Infrastructure
Synopsys-Sponsored CISQ Research Estimates Cost of Poor Software Quality in the US $2.08 Trillion in…
Resonant Customer Shipment Volumes Accelerate and Grow 200% Year-Over-Year in Fourth Quarter 2020
Industry Veterans Cathal Phelan, John Kent, and Michael Reiha Join Silvaco Technical Advisory Board
"Electronic Design Industry Predictions 2021" by Predictions 2021
"Opportunities and Challenges for Semiconductor Industry Awaits in 2021" by Predictions 2021
Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet…
Ansys Announces Winners of 2020 Art of Simulation Competition
Global Semiconductor Sales Increase 7 Percent Year-to-Year in November
Semiconductor Industry Applauds NDAA Enactment, Urges Full Funding for Semiconductor Manufacturing and…
proteanTecs to Host Live Webinar with Siemens on Multi-Layer Performance Monitoring in Advanced SoCs…
ITRI's VLSI-TSA and VLSI-DAT Symposia will Kick Off in April 2021
Graphcore raises $222 million in Series E Funding Round
Wave Computing and MIPS Technologies Reach Agreement to Exit Bankruptcy
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures…
TeamEDA, Inc. Continues to Grow with the Launch of LAMUM 9.3
CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving,…
"2020 year in review" by Roberto Frazzoli
Intel Editorial: Building the Industry’s Best PC Experiences
Tortuga Logic Expands Government Sponsored Program to Address Rapid Growth in Hardware Security
DENSO Adopts SDK SiC Epi-wafers for Next-Generation Booster Power Modules for FCEVs
SEMI Technology Unites Global Summit to Spotlight Digital Transformation, Microelectronics Industry …
Industry Strategy Symposium to Lead Microelectronics Into New Era of Innovation
North American Semiconductor Equipment Industry Posts November 2020 Billings
ACM Research Launches Furnace Tool for Power Device Industry to Address IGBT Process Challenges
Interview with John Coonrod & Mahyar Vahabzadeh, Rogers Corporation
AWS Deploys Synopsys VCS on Arm-based AWS Graviton2 to Accelerate SoC Development
Resonant Customers Surpass Shipment Milestone of 50 Million RF Filters Designed with Proprietary ISN®…
IAR Systems enables Linux-based Continuous Integration and automated workflows for RISC-V
"Questions on data representation" by Colin Walls
"Risc-V Summit 2020 showcases a growing ecosystem and a wider application spectrum" by Roberto Frazz…
Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA So…
UVM Reference Implementation Aligned with IEEE 1800.2-2020 Standard
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D…
Synopsys Initiates $250 Million Accelerated Share Repurchase Agreement
vayyar 4D imaging radar sensor set to revolutionise automotive safety by cutting complexity and cost…
Aledia, French Developer of Next-Generation MicroLED Displays For High-Volume Consumer Markets, Announces…
CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors…
Synopsys Introduces Improved Illumination Optics Design with New LightTools Version
Microchip Adds 64 Mbit Parallel SuperFlash® Memory to its Family of Radiation-Tolerant COTS-Based Devices…
Sofics and Hardent Join Mixel’s MIPI® Ecosystem to Provide Designers a Complete MIPI Solution
Semiconductor Equipment Consensus Forecast - Record Growth Ahead, SEMI Reports
"A Unified Development Flow for Embedded Systems" by Anupam Bakshi
SEGGER Embedded Studio – New linker significantly shrinks RISC-V application size
SEMICON Japan 2020 Virtual Set to Open with Sustainable Industry Growth, Smart Technology in the Spo…
IPC APEX EXPO 2021 Goes Virtual
eMemory & PUFsecurity Announce with UMC the World’s First PUF-based Secure Embedded Flash Solution…
Intel, Microsoft, IBM Technologists Elected to Si2 OpenAccess Coalition Leadership Posts
Spin Memory Joins Semiconductor Industry Association as First MRAM-focused Member
S2C Raises the Bar for High Capacity, High-Performance FPGA Prototyping with New Prodigy Logic Matrix…
AWS and Arm Demonstrate Production-Scale Electronic Design Automation in the Cloud
Worldwide Server Market Revenue Grew 2.2% Year Over Year in the Third Quarter of 2020, According to …
AImotive Deploys Synopsys VCS to Verify Next-Generation Automated Driving Technologies
Green Hills Software Adds RTOS Support to Its Extensive Product Portfolio for RISC-V-based SoCs
Silvaco and OPENEDGES Announce Availability of Integrated DDR Controller and PHY IP Solutions
Axiomise Presents a Unique Coverage-Driven RISC-v Formal Verification Solution
"Research in electronic devices takes center stage at 2020 IEDM event" by Roberto Frazzoli
Cutting-Edge Automation Plays Key Role in Mouser Electronics’ Distribution Success
SystemVerilog P1800 Working Group Kick-Off Meeting
Seagate Designs RISC-V Cores to Power Data Mobility and Trustworthiness
Valtrix Broadens Support For RISC-V Design Verification With Latest Updates To STING
Synopsys Study Shows Open Source Security Top-of-Mind but Patching Too Slow
OIF Launches 800G Coherent and Co-Packaging Framework IA Projects, Elects New Board Members/Positions,…
Ansys Announces Leadership Appointments
OneSpin Contributes to the OpenHW Ecosystem to Achieve Processor Integrity for the CORE-V CVE4 Open-Source RISC-V Cores
FORTUNE Adds Ansys to 2020 Future 50 List
Sondrel cuts verification time with new, enhanced, work flow modelling tools
"#DAC58, 2: Countdown to the Designer, IP and Embedded Track Submission Deadline for DAC 2021" by Ambar…
Interview with Geir Eide, Director, Mentor, a Siemens business
NexLogic Technologies, Inc. Adds a New 3,000 Square Foot Clean Room to Its PCB SMT and Microelectronics…
EIB Group provides €150 million to support artificial intelligence companies
SEMI Issues Statement Supporting Microelectronics Industry Incentive Provisions in U.S. National Defense…
Synopsys CFO Trac Pham to Speak at UBS Global TMT Virtual Conference
Mouser Electronics’ New Intelligent Revolution eBook Explores Role of AI in Public Safety
Global Semiconductor Sales Increase 6 Percent Year-to-Year in October; Annual Sales Projected to Increase…
Blue Pearl Software and Japan's CM Engineering Collaborate to Improve FPGA/SoC Design Quality
Avast and Borsetta Join Intel in Launching the Private AI Collaborative Research Institute
QuickLogic On Keynote Panel at RISC-V Summit
Intel Machine Programming Tool Detects Bugs in Code
Intel Debuts 2nd-Gen Horse Ridge Cryogenic Quantum Control Chip
Intel Advances Progress in Integrated Photonics for Data Centers
Keysight’s High-Speed Digital Test Solutions Selected by Allion Labs to Validate SerDes* Devices in…
Synopsys and Samsung Foundry Collaborate to Deliver Fastest Design Closure and Signoff for Process Nodes…
IAR Systems and GigaDevice extend partnership with powerful Arm solutions
Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2020
Andes RISC-V Vector Processor NX27V Is Upgraded to RVV 1.0
Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports
DVCon U.S. 2021 Advance Program Available & Early Registration Open
Mobiveil Announces Compute Express Link (CXL) 2.0 Design IP, Successful Completion of CXL 1.1 Validation…
Dr. Leigh Anne Clevenger Named Si2 Director, OpenStandards
OIF Completes Successful 2020 Joint Network Operator, Multi-Vendor Transport SDN API Interoperability…
Micro Magic, Inc. Delivers World's Highest Performance/Power RISC-V Core
"IC market forecasts; new edge AI chips; automotive software" by Roberto Frazzoli
"Focus a Global Reseller Channel on Your Product" by Modesto (Mo) Casas
Mouser Electronics Named Bourns 2019 North American e-Commerce Distributor of the Year
HPE Reports Fiscal 2020 Fourth Quarter
Cadence Appoints Julia Liuson to Board of Directors
IAR Systems delivers extended optimization and trace capabilities for RISC-V development
PLDA Announces the Successful CXL™ Interoperability with Pre-Production Intel Xeon CPU, Code Named…
The Surge in PC Shipments Is Not Over with Solid Growth Expected During the Holiday Quarter and into…
Arteris® IP Completes Acquisition of Magillem Design Services Assets, Creating World's Premier System-on-Chip…
Andes Announces New RISC-V Processors: Superscalar 45-Series with Multi-core Support and 27-Series with…
Cadence’s John Wall to Present at Nasdaq 43rd Investor Conference
Cadence’s John Wall to Present at Nasdaq 43rd Investor Conference
IAR Systems delivers extended optimization and trace capabilities for RISC-V development
North American Semiconductor Equipment Industry Posts October 2020 Billings
proteanTecs CEO to present Universal Chip Telemetry™ at the Taiwan Semiconductor Executive Summit …
HP Inc. Reports Fiscal 2020 Full Year and Fourth Quarter Results
Vishay Intertechnology Announces the Availability of Modelithics Broadband Microwave Global Models™,…
IRIS Switzerland Adopts Silvaco TCAD Software for the Development of Photodiodes for Autonomous Driving…
"Intel FPGA news; Ferroelectric Memory; Micron’s 176-layer NAND; TSMC’s Phoenix fab; Tesla security…
CEVA's Bluetooth® Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
Interview with Michael Munsey and Brad Hart, Perforce
Silicon Catalyst Partners with OnScale to provide Cloud Engineering Simulation capability to early-stage…
SigmaSense Announces David French, Semiconductor Luminary, as new Board Member
Cadence’s Lip-Bu Tan to Present at Credit Suisse Technology Conference
UL’s Modelling and Simulation Services for Certification Advance Product Safety in Industrial Auto…
Synopsys Acquires Precision Optical Measurements Provider LIGHT TEC
DownStream Technologies Announces Support for Flex, Rigid Flex and Embedded Component Designs in New…
SEGGER’s embOS RTOS transforms 64-bit SoCs into single chip computers
SolidRun Unveils New i.MX 8M Plus Portfolio of Embedded Modules and Carrier Options
First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced
New Intel Open FPGA Stack Eases Development of Custom Platforms
Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification
Qorvo CEO Bob Bruggeworth Elected Chair of Semiconductor Industry Association
Keysight Technologies Reports Fourth Quarter 2020 Results
Draft of Accellera Portable Test and Stimulus Standard 2.0 Now Available for Public Review
Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products
LG Electronics Drives Company-wide Remote Learning and Speeds Product Development with Ansys Learning…
Weebit Nano and CEA-Leti broaden strategic partnership to address market needs
Synopsys Software Security Solutions Now Available Through Sterling's GSA Contract
PDF Solutions to Acquire Smart Manufacturing and Factory Connectivity Expert Cimetrix
"Why develop embedded software bottom up?" by Colin Walls
"Phil Kaufman Award Goes on Hiatus for 2020" by Bob Smith, Executive Director
"Reactions to AMD-Xilinx deal; more acquisitions; upcoming events" by Roberto Frazzoli
"Functional Safety and Security in Embedded Systems" by Anupam Bakshi
Mouser Honored with Global Sales Achievement Award from Harwin
Weebit Nano appoints Ilan Sever to drive R&D
AMI Announces Support for Intel Memory Failure Prediction Capabilities in Aptio V UEFI Firmware and …
IAR Systems delivers efficient building and testing in Linux-based environments for Renesas RX MCUs
Ansys Executives to Present at Upcoming Investor Conferences
Phil Kaufman Award for Distinguished Contributions to Electronic System Design Goes on Hiatus for 20…
Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform
Synopsys Announces Earnings Release Date for Fourth Quarter and Fiscal Year 2020
Cadence’s John Wall and Nimish Modi to Present at RBC Capital Markets Global Technology, Internet,…
Mouser Electronics Expands Headquarters with New Building Dedicated to Customer Service
Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS
"New testing challenges take center stage at the International Test Conference 2020" by Roberto Fraz…
Synopsys Acquires In-chip Monitoring Solutions Leader Moortec
Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator
IAR Systems accelerates development of smart factory applications based on Renesas' R-IN32M4
congatec premiers AMD Ryzen Embedded V2000 processor on COM Express Compact
Avery Design Debuts QEMU Virtual Host to SystemVerilog PCIe VIP HW-SW Co-simulation Solution for Pre-silicon…
Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance
OIF Launches Co-Packaging Framework Implementation Agreement Project
PLDA Announces CXL™ 2.0 Support in their XpressLINK™ Family of CXL Controller IP
Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X…
CEA-Leti to Present Latest Results & Insights on 3D Technologies, Power Electronics & Quantum Comput…
Valtrix Broadens Support For RISC-V Design Verification With Latest Updates To STING
C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors
Learn the Latest on RISC-V and Vector Processing at All Six Andes Technology’s Presentations at the…
PLDA XpressSWITCH IP for PCIe® Technology First Ever Switch soft IP to Pass PCI-SIG®’s PCIe 4.0 …
Mentor’s High Density Advanced Packaging solution certified for Samsung Foundry’s most advanced …
New Tessent Streaming Scan Network helps slash test costs, reduce implementation effort for complex …
Altair Announces Third Quarter 2020 Financial Results
The I/O Buffer Information Specification (IBIS) Open Forum to Hold Virtual Asian IBIS Summit Meeting…
Amlogic's Revolutionary A113X SoC Powers New Lenovo™ Smart Clock Essential
System Integration Key to First IC/Package Co-Design Tool Success
Cadence Expands Computational Software Development With Opening of New European R&D Centre of Excellence…
Untether AI Ushers in the PetaOps Era with At-Memory Computation for AI Inference Workloads
Arm provides updates for Project Triffid and the Morello Program
Synopsys Wins Multiple 2020 World Electronics Achievement Awards
Ansys Announces Financial Results With Record Q3 Revenue and ACV
SMTC Corporation Announces Third Quarter Results
Aldec Introduces Hardware Assisted RTL Simulation Acceleration for Microchip FPGA Designs
300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
Arteris® IP FlexNoC® Interconnect Products Licensed by Bosch for Multiple Automotive Chips
Lenovo Delivers Record Results, Fueled by Strong Q2 Growth Across All Business Groups
"Linley Fall Processor Conference 2020 – Part Two" by Roberto Frazzoli
"Automotive cockpit software consolidation" by Colin Walls
"The Electronic System Design Ecosystem is more than EDA" by Bob Smith, Executive Director
Telink and Andes Announce the TLSR9 SoC with RISC-V Processor
Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2
Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year
Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
SEMICON Japan 2020 Goes Virtual to Highlight Electronics Innovations Powering a Smarter World
UNISOC Completes Multi-vendor 5G SA Chip Interoperability Testing
Sondrel announces tape-out of its largest chip design
Unique Prototyping Platform from X-FAB Brings Together the Distinct Worlds of Microelectronics and Fluid…
Analog Bits Announces Analog IP Availability on Samsung Technologies
CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging…
CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense…
Ultra Librarian and Zuken Work Together to Create a Seamless User Experience for PCB Design
Samsung Reclaims the Top Spot as Smartphone Market Performs Better Than Expected with 353.6 Million …
NI Reports Third Quarter Results
Ansys collaborates with Microsoft to enhance cloud engineering productivity for customers
"A Unified Flow for Embedded Systems Development" by Anupam Bakshi
Sundance launches PolarBerry, a RISC-V enabled SoM for highly secure, low power and thermally efficient…
Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early …
Samsung Foundry Adopts Real Intent Meridian CDC for Clock Domain Crossing Sign-off
Synopsys and Samsung Foundry Collaboration Delivers Optimized Reference Methodology for High-Performance…
Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design…
"Linley Fall Processor Conference 2020 – part one" by Roberto Frazzoli
LoRa Alliance® Releases LoRaWAN® TS1-1.0.4 Specification; Simplifies Development, Deployment and I…
AMD to Acquire Xilinx, Creating the Industry’s High Performance Computing Leader
Truechip Adds New Customer Shipments Of Verification IPS For RISC-V Family Including Tilelink
Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller…
Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor
Ansys Multiphysics Solutions Certified for Samsung Foundry's Entire Line of FinFET Process Technolog…
PLDA® Demonstrates Successful PCIe® 5.0 Link Training at 32 GT/s With Its PCIe 5.0 Controller And …
Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for…
RISC-V International Announces Agenda for the Third Annual RISC-V Summit
Ansys Receives Two TSMC Open Innovation Platform Partner of the Year Awards
Intel Reports Third-Quarter 2020 Financial Results
Mentor partners with Arm to help customers optimize the functional verification of sophisticated, next-generation…
E-PEAS Power Management ICs Designed into Air Pollution Monitoring Hardware
Imperas RISC-V reference simulator and model extended for coverage analysis, plus test suite for latest…
North American Semiconductor Equipment Industry Posts September 2020 Billings
Latest NPU adds to Arm’s AI Platform performance, applicability, and efficiency
Tom Friedman to Deliver Keynote Address at 2020 SIA Leadership Forum & Award Celebration
Multi-Camera MIPI Switch from Diodes Incorporated Enables Smaller Product Profiles
Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories…
IAR Systems adds functionality to functional safety certified Renesas RH850 development tools
S2C Accelerates Billion Gate FPGA Prototyping with Xilinx Virtex UltraScale+ VU19P Based Systems
OneSpin Contributes Processor Integrity Solution for ZuSE-Scale4Edge Government-Funded Project to Assure Integrity of Edge Computing Processors
Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the …
Aldec’s TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity…
Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC…
Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
Interview: Cadence Tempus Timing Signoff Solution Reduces Time to Market while Providing Best Optimization…
TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solut…
IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262
Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
Micron Readies World’s First Multichip Package With LPDDR5 DRAM for Mass Production
Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling
SK hynix to Acquire Intel NAND Memory Business
"PLM; Ru interconnect; CNT pellicles; Intel-Sandia collaboration; 10Mbps Ethernet on a twisted pair"…
"#58DAC, #1: Building a Great Conference with a Strong Foundation" by Harry Foster
Cadence Reports Third Quarter 2020 Financial Results
Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
"Time for a new programming paradigm?" by Colin Walls
"Globalizing Sales in a COVID-19 Environment" by Modesto (Mo) Casas
Ansys to Release Third Quarter 2020 Earnings Results After Market Close on November 4, 2020
Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
Semiconductor Industry Announces Research and Funding Priorities to Sustain U.S. Leadership in Chip …
GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX…
Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge
Cadence Named One of the 2020 World’s Best Workplaces™ by Great Place to Work® and Fortune
MathWorks Enhances Rapid Control Prototyping and Hardware-in-the-Loop Testing Capabilities with QNX …
Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC…
Intel Xeon Scalable Platform Built for Most Sensitive Workloads
Tower Semiconductor Announces 2020 Annual Technical Global Symposium Online Event
"Cylynt Summit Guest Blog: Combatting Software Piracy Through Industry Trade Organizations" by Bob Smith,…
"Nvidia-Arm deal: the CEOs’ perspective" by Roberto Frazzoli
Mouser Debuts Technical Resource Center, a Searchable Collection of Tech Content and Product Information
Silexica Extends Collaboration With Mentor for High-Level Synthesis
Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
Keysight Technologies Enhances PathWave Software Suite with Cloud Processing to Eliminate Design Workflow…
Arteris® IP FlexNoC® Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging So…
Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon …
Ansys Startup Program Gains Global Momentum with Triple-Digit Growth
MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem
Cadence Brings Verification IP to the Chip Level with New System VIP Solution
New Cadence Clarity 3D Transient Solver Delivers up to 10X Faster System-Level EMI Simulation
Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group
Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon …
Traditional PC Market Delivers Another Quarter of Double-Digit Growth in Q3 2020, According to IDC
Attend Andes Technology Principal Engineer, Thang Tran’s, Presentation "A RISC-V Out-of-Order Processor"…
TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre…
Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Pr…
AMD is planning to buy Xilinx according to Wall Street Journal
IPC APEX EXPO 2021 Rescheduled for March 6-11 In-person event to include virtual exhibition options
DVCon Europe Announces two extra Keynotes and full Technical Program
ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020
High Reliability FPGA Design Webinar Hosted by Blue Pearl Software
Arm and RISC-V Software Development Solution from Ashling: RiscFree™ for Arm & RISC-V
Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies
Keysight Technologies and ROHM Semiconductor Enable Designers to Rapidly Modify SMPS Reference Design…
Synopsys' Digital Design Technology Symposium to Showcase Latest Innovations for AI, Automotive, HPC…
Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
"Electronic System Design Industry Reports 12.6% Revenue Growth for Q2 2020" by Paul Cohen
"A closer look at Mentor’s Calibre nmLVS-Recon" by Roberto Frazzoli
Weebit Nano moves ReRAM closer to production after successfully completing stabilisation process
Cadence GDDR6 IP Family Is Silicon Proven for TSMC N6 and Immediately Available for Both N6 and N7 Process…
Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology
North American PCB Industry Sales Down 2.5 Percent in August
SEMI Virtual Conference Aims to Speed Smart Manufacturing Adoption Across Global Microelectronics Supply…
Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August
IAR Systems extends online training program with Master Programming & Debugging course
Cadence Announces Third Quarter Financial Results Webcast
Intel and Sandia National Labs Collaborate on Neuromorphic Computing
OmniVision Introduces World’s First Medical RGB-IR Image Sensor; Reduces Endoscope Size, Cost, Power…
Moortec’s In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom’s…
TEMPO adopts videantis for edge AI chip, Stephan Janouch joins, and cool AI chips are green
Nordic Semiconductor to ship its billionth Arm Cortex-M based wireless SoC in October
Influence Tomorrow's Innovations Today: Contribute to the 58th Design Automation Conference
Arteris® IP to Acquire Assets of Magillem Design Services, Creating World's Premier System-on-Chip …
IAR Systems facilitates building and testing of automotive applications in Linux-based environments …
Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs
Ansys Releases On-Demand Content From Its IDEAS Digital Forum
"October Events: VSDOpen2020, Cylynt Software Monetization and Anti-Piracy Summit" by Bob Smith, Executive…
Sondrel explains the secret of big digital chip design is all in the NoC
Toshiba Information Systems Adopts Blue Pearl Software Visual Verification Suite by to Improve Quality…
Si2 Compact Model Coalition Releases Vital Updates to Industry Workhorse BSIM-Bulk
Synopsys Delivers Industry's First Processor IP Certified for Full ISO 26262 ASIL D Compliance
Arteris® IP FlexNoC® Interconnect Products Again Licensed by Samsung Foundry for Worldwide Use
New MIPI Debug and Trace Solution Available for Mobile, IoT and Automotive
New Arm Technologies Enable Safety-capable Computing Solutions for an Autonomous Future
Alpha and Omega Semiconductor Introduces 4-Channel Ultra-Low Capacitance Ultra-Low Clamping Voltage …
Dassault Systèmes Unveils 3DEXPERIENCE Edu, Driving a New Era of Experience-Based Learning for the …
Interview with Stephen Douglas, Head of 5G Strategy, Spirent
Synopsys to Host Panel on AI for Chip Design at AI Hardware Summit 2020
OmniVision Expands Medical Image Signal Processor Family for Endoscopes and Catheters With Cost-Effective…
HP Unveils New Innovations for Businesses Adapting to Rapidly Evolving Workstyles and Workforces
Interview with Yoan Dupret, Managing Director, Menta
"Specification-Driven UVM Testbench Generation" by Anupam Bakshi
Analog Bits Announces Foundation Analog IP Availability on GLOBALFOUNDRIES 12LP FinFET Platform
Scaling New Safety Heights with Fixed-Wing Drone Technology
Interview with Richard DePoto, Business Development Manager, Uyemura International
Efabless Expands support for Cloud-based Design Platform
GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with…
Cadence Announces Broad IP Collaboration With GLOBALFOUNDRIES on 12LP/12LP+ Solutions
GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform…
Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP+ FinFET…
Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms
Altium Accelerates IoT Hardware Development with Modular Design and Toradex Collaboration
Mouser Electronics’ New Intelligent Revolution Series Explores Cutting-Edge Applications in Artificial Intelligence
Interview with Zach Dismukes, West Coast Regional Manager, Bowman XRF
Blue Pearl Software Appoints Industry Luminary Jim Hogan To Its Advisory Board
58th Design Automation Conference Names Executive Committee for the 2021 Conference and Exhibition
SEMI-NBMC Invites White Paper Proposals for Funding of Human Monitoring Innovations
Intel Introduces IoT-Enhanced Processors to Increase Performance, AI, Security
Intel Editorial: Intel Fuels the Edge Today With Expanded Tech, Customer Deployments
Altium To Host PCB Industry's Premier Virtual Event
ACM Student Research Competition at ICCAD 2020 (SRC@ICCAD’20) - Deadline Extended September 28
Interview with Loris Valenti, VP Microcontrollers and Digital Products, STMicroelectronics
Altair Accelerates Use of Oracle Cloud Infrastructure
Introspect Technology Announces the World's First MIPI C-PHY Version 2.0 and D-PHY Version 3.0 Combo…
SmartDV Delivers First-to-Market MIPI A-PHY v1.0 Verification IP
Arteris IP FlexNoC® & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production
MathWorks Introduces Release 2020b of MATLAB and Simulink
HP Unveils New Innovations for Businesses Adapting to Rapidly Evolving Workstyles and Workforces
World’s First USB PD E-Marker Transmission Line Control IC, EJ903, Now Certified by USB-IF for USB4™…
OIF to Lead “Co-Packaged Optics – Why, What and How” Live Webinar Event; Industry Experts to Provide…
Keysight Technologies Expands Automotive Portfolio with New Radar Multi-Target Simulator and Advanced…
GOWIN Semiconductor Launches GoAI 2.0 for Embedded Machine Learning Inference
"malloc() – just say no" by Colin Walls
SEMICON Taiwan 2020 Hybrid Opens Tomorrow With Advanced, Smart and Green Manufacturing in Spotlight
Siemens and VSI Labs partner to advance autonomous vehicle development
North American Semiconductor Equipment Industry Posts August 2020 Billings
WIMI Hologram's layout in Core Technology of Semiconductor Business
Cadence Wins Gold Stevie® Awards in the 2020 International Business Awards® Program
Altium TASKING Automotive Development Tools Now Support Embedded IT Security From ESCRYPT
Symbiotic EDA Selects Verific Parser Platform as Front End to SoC Synthesis, Formal Verification, FPGA…
NSITEXE Successfully Develops Multiple Custom Processors for Automotive Applications in Half the Time…
Study Finds Federal Incentives for Domestic Semiconductor Manufacturing Would Strengthen America's Chip…
New Release of Easy-PC PCB Design Suite Includes Over 50 New Customer Requested Features and Is Part…
Altair Acquires Ellexus
The Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture is …
PRO DESIGN Unveils New Xilinx® Virtex® UltraScale+™ VU19P-Based Product Family of Prototyping Pl…
"Invitation to Participate in VSDOpen2020" by Bob Smith, Executive Director
"Nvidia to acquire Arm; photonic design; 300M gate prototyping system; 4Gbps memory interface; wire …
AMD CEO Dr. Lisa Su to Receive Semiconductor Industry's Top Honor
QuickLogic Joins OpenHW Group Further Extends Commitment to Open Source Ecosystem
Arteris IP FlexNoC® Interconnect Licensed by VITEC for High Resolution Video Encoder and Decoder Ch…
nTopology Announces $40M Series C Funding Led by Insight Partners
Synopsys Publishes BSIMM11 Study Highlighting Fundamental Shifts in Software Security Initiatives in…
Mixel Announces Availability of the World’s First MIPI C-PHY/D-PHY Combo IP Supporting 30 Gbps
MIPI Alliance Releases A-PHY SerDes Interface for Automotive
New PSpice® for TI tool helps engineers speed time to market with system-level circuit simulation and…
Weebit Nano appoints Eran Briman as VP Marketing & Business Development
Altair Acquires Univa
ventureLAB and Silicon Catalyst Partner to Expand Hardware and Silicon Ecosystem in Canada
SiFive To Introduce New RISC-V Processor Architecture and RISC-V PC at Linley Fall Virtual Processor…
27th IEEE EDPS a Virtual Experience Ramond Rodríguez General Chair, EDPS 2020 (Sept. 30th and Oct. …
ACM Student Research Competition at ICCAD 2020 (SRC@ICCAD’20)
NVIDIA to Acquire Arm for $40 Billion, Creating World’s Premier Computing Company for the Age of …
CAST and Fraunhofer IPMS Introduce CAN XL Bus Controller IP Core
Call for Nominations: EDAA Outstanding Dissertations Award 2020
COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports
SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era
Silicon Catalyst Expands Ecosystem with 4 Additional In-Kind Partners
DesignCon Outgrows Current Space and Expands Offerings for Engineers Beyond In-Person Event
DSP Group Selects Synopsys' ARC EM Processor IP for Adaptive Processing Smart Codecs
Mouser Electronics’ “Engineering Big Ideas” Campaign Continues Win Streak with Ad Age Gold
Advanced Assembly Earns AS9100D Certification
Interview with Manny Marcano, President and CEO, EMA
Si2 Publishes White Paper on Expanding Use of AI/ML in Semiconductor Electronic Design
EMA Design Automation Sponsors and Supports the PCEA with their Common Mission to Educate Engineers …
Synopsys Introduces the Industry's First Unified Electronic and Photonic Design Platform
HP Launches The World's Easiest Plotters for Architect, Engineer, Construction and Home Offices
SigmaTron International, Inc. Reports First Quarter Financial Results for Fiscal 2021
Silvaco Acquires the Assets of Coupling Wave Solutions S.A.
Worldwide Server Market Revenue Grew 19.8% Year Over Year in the Second Quarter of 2020, According to…
Interview with Paul Cunningham, Corporate VP and GM, System & Verification Group, Cadence
Arasan Announces MIPI I3C IP Cores compliant to the MIPI I3C Specifications v1.1
Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports
IAR Systems supports ultra-low-power Renesas RE MCU Family in industry-leading Arm tools
Altair Announces 2020 Global Technology Conference to Explore “The Future Of…”
"SMIC news; 16Gb LPDDR5 DRAM; new approach to AI acceleration; artificial iris; VPN adoption ranking"…
Cadence’s Sandhya Venkateshan and Alan Lindstrom to Present at D.A. Davidson Software & Internet Services…
S2C Announces 300 Million Gate Prototyping System with Intel® Stratix® 10 GX 10M FPGAs
Virtual MSEC 2020 to Spotlight MEMS and Sensor Innovations for Medical, Smart Cities, Other Growth M…
Eta Compute at 2020 Virtual Embedded Vision Summit
Mentor achieves certifications for TSMC’s leading-edge 3nm process technology
Synopsys to Present at D.A. Davidson Technology Conference
Altair to Virtually Present at the Deutsche Bank Technology Conference
Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in July
DVCon U.S. 2021 Announces Call for Panel, Short Workshop and Tutorial Proposals
SiFive and Barcelona Supercomputing Center Advance Industry Adoption of RISC-V Vector Extension
Synopsys and Nestwave Collaborate to Develop a Low-Power Geolocation IP Solution for IoT Modems
Altair Extends Strategic OEM Agreement with Hewlett Packard Enterprise (HPE) to Optimize High Performance…
Highest performance Arm Cortex-R processor to power the future of computational storage
SOLiD and Intel Alliance Leverages Intel mDR and FPGA Technology to Develop 5G mmWave Repeaters
Intel Editorial: Sparking the Next Era for the Intel Brand
Intel Launches World’s Best Processor for Thin-and-Light Laptops: 11th Gen Intel Core
Synopsys Appoints Jeannine Sargent to Board of Directors
IAR Systems streamlines Continuous Integration workflows and adds static code analysis in build tools…
Kneron Boosts On-Device Edge AI Computing Performance With Cadence Tensilica IP
HP Drives Performance and Remote Collaboration, Powering Computing and Creative Breakthroughs with Z…
IDC Forecasts PC and Tablet Shipments to Grow 3.3% in 2020 Before Resuming Their Long-Term Decline in…
Altium Empowering the New Generation of Electronics Designers
Synopsys and Elektrobit Announce Availability of EB tresos Classic AUTOSAR Software for ARC Functional…
North American PCB Industry Sales up 10.1 Percent in July
"TSMC’s roadmap; AI-based video upscaling; mobility startups" by Roberto Frazzoli
Mouser’s New Customer Resource Center Provides Easy-to-Use Hub for Services & Tools
GOWIN SEMICONDUCTOR To Present Using Bluetooth Low Energy with MIPI standards at MIPI DevCon 2020
"The Next Generation of Register, Sequence, and SoC Automation" by Anupam Bakshi
Weebit Nano and Leti file joint patent for multi-level programming
CiViQ partner VLC Photonics designs a new Indium Phosphide photonic integrated circuit (PIC) for secure…
SEMI Statement on New U.S. Export Control Regulations
Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity…
Mentor helps SimpleMachines dramatically speed development of its first AI processor (Mentor announc…
HP Inc. Reports Fiscal 2020 Third Quarter Results
Chelsio Adopts Synopsys DesignWare 56G Ethernet PHY IP to Accelerate Development of High-Performance…
Ansys Honored As Gold Stevie® Award Winner In 2020 Stevie Awards For Great Employers
Sondrel innovating Verification
Cadence’s Sandhya Venkateshan and Alan Lindstrom to Present at D.A. Davidson Software & Internet Services…
Mobile, Automotive, 5G and IoT Developers Invited to MIPI DevCon 2020
SemiQ Switches to Silvaco TCAD for Design of Power Devices
OIF Approves CEI-224G Development Project, Reviews Co-packaging of Optics with ASICs Workshop, Announces…
Ansys Multiphysics Solutions Certified By TSMC For High-Speed Next-Generation 3D-IC Packaging Techno…
Remcom Announces XFdtd Electromagnetic Simulation Software Update with Advancements for Millimeter Wave…
Intel Collaborates with Argonne National Laboratory, DOE in Q-NEXT Quantum Computing Research
HPE Reports Q3 Results
Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out…
Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design
Cadence Digital and Custom Flows Achieve Certification for TSMC N3 Process
Ansys Achieves Certification of its Multiphysics Solutions for TSMC's 3nm Process Technology
"PROSTEP OpenPDM 9 Ready for Use in Hybrid Cloud Scenarios" by Joseph Lopez
"GPT-3; TSMC 5nm customers; ML-enhanced simulation; processor updates" by Roberto Frazzoli
Silicon Creations’ Achieves ISO 9001 Certification for World-Class Silicon IP Development Process
Mouser Electronics Names Its 2020 Best-in-Class Award Winners
Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes
Monzukuri Unveils First Commercially-Available IC/Package Co-Design Tool
"Methodics’ Next Phase" by Bob Smith, Executive Director
Silicon Catalyst Expands its In-Kind Partner Ecosystem to Israel
UnitedSiC Signs Distribution Agreement with Macnica - Japan
North American Semiconductor Equipment Industry Posts July 2020 Billings
Keysight Technologies Reports Third Quarter 2020 Results
SkyWater President Thomas Sonderman to Deliver Keynote at 2020 Virtual Advanced Semiconductor Manufacturing…
Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon…
Cadence's John Wall to Present at KeyBanc Future of Technology Series
Interview with Vic Kulkarni, VP, Ansys
NSITEXE Adopts Synopsys HAPS Prototyping to Validate Data Flow Processor IP
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2020
AAEON and Aotu.ai Announce the Release of a Smart Vision AI Developers Kit on an Intel AI Platform for…
Nuvoton Accelerates the Development of Its MCU Designs With the Cadence Palladium Z1 Enterprise Emulation…
Mixel’s Patented D-PHY RX+ IP Extends Market Share with Automotive Microcontrollers
Introspect Technology Sponsors MIPI DevCon 2020 - the World's Foremost Conference on MIPI® Alliance…
S2C and Mirabilis Design Teamup to Deliver a Heterogeneous Solution for SoC Architecture Exploration…
SEMI Launches World's First Flexible Hybrid Electronics Standards Technical Committee to Promote Industry…
Rahul Goyal of Intel Re-elected Board Chair of Silicon Integration Initiative
"Automating IP Design and Verification" by Anupam Bakshi
Media Alert: Intel at Hot Chips 2020
SEGGER Embedded Studio V5 minimizes code size
"Webinar Outlining Mobility Disruptions on the Semiconductor Design Ecosystem Slated for Next Week" …
Lenovo Delivers Outstanding Q1 Performance and Strong Growth, Overcoming Challenging Global Environment…
"SynthHESer – Aldec’s New Synthesis Tool" by Sunil Sahoo
Cadence Delivers Machine Learning-Optimized Xcelium Logic Simulation With up to 5X Faster Regression…
DVCon U.S. 2021 Announces Call for Extended Abstracts
Synopsys Introduces Integrated Electric Vehicle Virtual Prototyping Solution
SigmaTron International, Inc. Reports Year End Financial Results for Fiscal Year 2020
GOWIN Semiconductor Adds Korea Certification for Their Bluetooth Low Energy Enabled µSOC FPGA Modul…
Big Data Exchange (BDx) Nanjing Data Center First to Receive Uptime Institute’s Tier III Certification…
"Enabling TySOM Zynq-based Embedded Development Board for AWS IoT Greengrass" by Lucky Chen
Cadence’s Lip-Bu Tan and John Wall to Present at Needham Virtual SemiCap and EDA Conference
Advanced Assembly Adds a New, High-Tech Selective Solder Line to Its Capabilities and Expands Manufacturing…
Weebit Nano completes key milestone ahead of technology transfer to production fab
SEMI Partners with GLOBALFOUNDRIES to Offer Apprenticeship Program Aimed at Building the Electronics…
Heilind Electronics Introduces Amphenol ICC's FCI Basics BergStak 0.8 mm Shielded Board-to-Board Con…
Tachyum Demo Shows Prodigy Will Be Faster Than NVIDIA and Intel Chips
Latest Release of Altair® PBS Professional® Offers Up to Tenfold Faster Performance for More Diverse…
The 57th Design Automation Conference Best Paper Awards
Mentor extends industry-leading EDA software support for Samsung Foundry’s 5/4nm process technolog…
Todd Younkin Appointed President and CEO of Semiconductor Research Corporation (SRC)
Cadence’s Lip-Bu Tan and John Wall to Present at Needham Virtual SemiCap and EDA Conference
SEMI and EDA Industry Leaders Unite to Combat Software Piracy
Synopsys Announces Earnings Release Date for Third Quarter Fiscal Year 2020
Codasip and Metrics Design Automation Announce the Integration of the Metrics Cloud Simulation Platform…
Altair Announces Second Quarter 2020 Financial Results
MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs
Frost & Sullivan Presents Top Sensor Technologies Impacting the Future of Smart Cities
Aldec’s TySOM Embedded Development Kits are Now Qualified for AWS IoT Greengrass
Ansys Announces Q2 Financial Results With Q2 Record Revenue, ACV and Operating Cash Flow
Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella’s CVflow Architecture for Automotive…
Engineering for Change and Siemens Announce Finalists in Innovate for Impact: Siemens Design Challen…
"ESD Alliance to Lead Joint Effort with Cadence, Mentor, a Siemens Business, and Synopsys to Create …
"Pilot Projects Ease New Software Buying Decisions" by Modesto (Mo) Casas
Mouser-Sponsored Formula E Team Preps for Nine-Day Berlin Showdown
Picocom Embeds 32 Andes N25F RISC-V Cores into Its 5G NR Small Cell Baseband SoC
Altair Announces Winners of 8th Annual Altair Enlighten Awards
Global Semiconductor Sales Increase 5.1 Percent Year-to-Year in June; Q2 Sales Down Slightly Compared…
TDK Ventures adds AI accelerator Groq to its investment portfolio
"Intent-driven programming; Glow MCU support; Mac MPU die size; TV LCD market; AI-optimized process"…
"A Quick Look Back at a Virtual DAC" by Anupam Bakshi
Synopsys Taps Veteran Security Leader Jason Schmitt as GM of its Software Integrity Group
Interview with Hend Wagieh, Senior Calibre Product Manager, Mentor Graphics
Analog Devices Collaborates with Intel on Radio Platform for Addressing 5G Network Design Challenges…
MaxLinear Completes Acquisition of and Raises Revenue Expectations from Intel's Home Gateway Platform…
Interview with Onn Haran, CTO, Autotalks
Summit Interconnect, Inc. Acquires Integrated Technology Ltd. - ITL Circuits
Pickering Electronics’ miniature HV reed relay at the heart of IC test system for On Semiconductor…
Synaptics Announces Industry’s Most Advanced Video Interface ICs for Docking Stations and Protocol…
OpenHW Ecosystem Implements Imperas RISC-V reference models for Coverage Driven Verification of Open…
3D Printing Electronics Packaging For Harsh Environments
Hua Hong Semiconductor Relies on '8-inch + 12-inch' Strategy to Accelerate Development in IGBT…
Soaring Attendance at the 57th Design Automation Conference, as Premier Event for the Electronic Design…
Ansys Named To Fast Company's Second Annual List Of The 100 Best Workplaces For Innovators
TTM Technologies, Inc. Reports Fiscal Second Quarter 2020 Results
Sondrel looking for electronic designers who can use both left and right brain halves to become Chip…
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024, SEMI and TechSearch …
Industry’s First MCU-based Implementation of Glow Neural Network Compiler for Machine Learning at …
Ansys Innovation Courses Drive Remote Learning To Educate The Next Generation Of Engineers
"Analog verification; new Arm rumors; Intel roadmap; analog neural networks" by Roberto Frazzoli
Interview with Daniel Hansson, Founder, Verifyter
Intel Makes Changes to Technology Organization
Keysight, IPG Automotive and Nordsys Collaborate to Accelerate Validation of Advanced Driver Systems…
Analog Devices Acquires HDMI Business From INVECAS, Expanding High Performance Audiovisual Capabilit…
LDRA Celebrates 10 Years in South East Asia
Interview with Ellis Smith, CEO, Blue Pearl Software
New Analog FastSPICE eXTreme technology boosts verification performance by up to 10X
North American Semiconductor Equipment Industry Posts June 2020 Billings
Intel's Pandemic Response Technology Initiative: 100-Day Report
Altair to Announce Second Quarter 2020 Financial Results on Thursday, August 6, 2020
Carlos Mazure, EVP of Soitec and Chairman of the SOI Industry Consortium, Joins Silvaco Board of Dir…
Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs
Ivanti and Intel Enter Strategic Partnership to Offer Self-Healing of Endpoints for Remote Workers with…
Intel Reports Second-Quarter 2020 Financial Results
Aldec Provides Static Verification for RISC-V Designs with the latest release of ALINT-PRO
Tempo Automation Welcomes Jeff Kowalski to Board of Directors
Tortuga Logic's Dr. Jason Oberg Appointed to the CWE/CAPEC Board
European Space Agency, Blue Pearl Software and ADIUVO Engineering Contract to Improve the Usability …
"Latest MSS Report: Our Sector Remains Strong" by Paul Cohen
Mouser Electronics Honored by Top Electronic Component Manufacturers for Distribution Excellence
True Circuits Participates in First Virtual DAC! Showcases Silicon Proven PLLs, DLLs and DDR 4/3 PHY…
Interview with Mark Gilbert, President, EDA Careers
Weebit Nano and Polimi present paper on novel AI self-learning ReRAM hardware at VLSI Symposia
GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit (iPDK)…
Flex Logix Announces EFLX eFPGA And nnMAX AI Inference IP Model Support For The Veloce Strato Emulation…
Synopsys Co-CEO Aart de Geus to Speak at SEMICON West 2020
Intel Editorial: The Pandemic Drives New Era of Tech Collaboration
Ansys Accelerates Passive Safety System Development
Resilience of Chip Manufacturing Facilities During COVID-19 Rooted in SEMI Standards
Chip Manufacturing Equipment Spending to Hit Record High $70 Billion in 2021 After Strong 2020, SEMI…
Autotalks and Applied Information partner to help emergency vehicles arrive faster to save lives
A method to eliminate the need for functional Gate Level Simulations (Excellicon)
Concept Engineering Celebrates 30 Years of Innovations At DAC
Interview with Lu Dai, Chairman, Accellera
Cadence Reports Second Quarter 2020 Financial Results
PLDA® Announces Robust Verification Toolset, Increasing Design Accuracy And Reducing Time-to-production…
Keysight Technologies Accelerates 5G Design, Simulation and Verification Workflows with PathWave Design…
Synopsys VCS Used by Graphcore to Verify Next-Generation Colossus GC200 IPU
Perforce Software Acquires Methodics, Expanding DevOps Portfolio
SEMI Announces Election and Re-Election of Board Members
Virtual SEMICON West 2020 Opens with Keynote Speakers, Smart Tech, Workforce Development in Spotligh…
"Mentor’s nmLVS; Siemens buys Avatar; Analog Devices buys Maxim; Arm rumors" by Roberto Frazzoli
"DAC May Be Virtual, but Our New Products Are Not" by Anupam Bakshi
"Here’s a Preview of Next Week’s SEMICON West" by Bob Smith, Executive Director
"Medical embedded applications – big challenges and opportunities" by Colin Walls
SmartDV, Aldec Partner to Link SmartDV’s Verification IP with Aldec’s Riviera-PRO Simulator
Interview with Hassan Triqui, CEO, Secure-IC
Mentor introduces Calibre nmLVS-Recon technology to dramatically streamline overall IC circuit verif…
Mentor collaborates with Samsung Foundry to boost product yield and streamline in-fab memory testing…
VITEC Licenses Codasip Bk5 Core for Multi-purpose Use in Video Products
ANSYS to Release Second Quarter 2020 Earnings Results After Market Close on August 5, 2020
Interview with Craig Shirley, CEO, Oski Technology
Digi-Key Electronics To Host Free Digital Transformation Webinar
ProPlus Electronics Will Demonstrate The Fastest EDA Software Tools And AI-Driven Test & Measurement…
Altair Releases New Version of Altair® Knowledge Studio® Market-leading Machine Learning and Predictive…
Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology
Aldec @ DAC 2020: Presenting RISC-V Verification Methodologies and Solutions
Interview with Chris Shore, Product Marketing Director, ARM
Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology
Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys'…
HP Introduces Remote Work Solutions for Rapidly Changing Work Environments
MathWorks Partners with NVIDIA’s Deep Learning Institute to Offer New Deep Learning with MATLAB Co…
Ansys 2020 R2 Accelerates Innovation For Engineering Teams
"Defacto interview: addressing the challenges of SoC integration" by Roberto Frazzoli
Interview with Chouki Aktouf, CEO, DEFACTO Technologies
OneSpin Solutions to Participate at the 57th Design Automation Conference Highlighting Certified IC …
Synopsys Announces Industry's First JEDEC DDR5 Verification IP for Next-Generation DRAM/DIMM Designs…
AMD Announce World’s First 64-Core PRO Workstation, the Lenovo™ ThinkStation™ P620, the Pinnacle…
Keysight Expands Scienlab Charging Discovery Systems Portfolio
Mixel MIPI D-PHY IP Integrated into the Perceive Ergo Edge Inference Processor
Axiomise Announces the Release of the Next-Generation RISC-V® App
Mouser Wins Vishay 2019 EMEA High Service Distribution Award
Interview with Felipe Schneider, Director, Field Operations, Fractal Technologies
The 57th Design Automation Conference Virtual Experience Filled with Deep Technology Insights and In…
Keysight Delivers USB4 Test Solutions to Optimize Design Performance and Ensure Standard Compliance
Flex Logix Announces EFLX eFPGA Emulation Models For The Cadence Palladium Z1 Platform
SEMICON Taiwan 2020 on Schedule as First Comprehensive Virtual and On-Site Event
"The Contingent Purchase Order Reassures Buyer and Seller" by Modesto (Mo) Casas
ASSET InterTech’s ISO 9000 certification ensures quality of ScanWorks and SourcePoint platforms
Traditional PC Shipments Continue to Grow Amid Global Economic Slowdown, According to IDC
Ansys Recognized as 2020 Bay Area Best Place to Work
S2C Launches Prodigy(TM) S7 Series Logic Systems Based on Xilinx UltraScale+ FPGAs
Virtual SEMICON West 2020 to Gather Industry Leaders, Visionaries to Highlight Opportunities for Stronger…
Three Exceptional Innovators Selected to Receive the Design Automation Conference Under-40 Innovators…
IAR Systems Launches Support for Flagship Renesas MCUs Across Security Development Framework
S2C Launches Prodigy(TM) S7 Series Logic Systems Based on Xilinx UltraScale+ FPGAs
JLQ Technology Selects Synopsys DesignWare IP to Accelerate Development of Next-Generation SoCs
Si2 Announces 2020 Power of Partnerships Award Winners
"Small-size low-power FPGAs; open source self-driving platform; AI-powered robots" by Roberto Frazzo…
DVCon Europe Transforms to Virtual Event and Announces Keynotes from Industry Luminaries
Cadence Announces Second Quarter Financial Results Webcast
Creonic joins partnership with the University of Bremen to expand the development of Artificial Inte…
Altium Launches the #MyAltiumStories Showcase Contest Celebrating the Passion of PCB Designers Every…
Sigasi Introduces Software Development Kit for Electronic Design Automation Tools
Mighty “Mouser Machine” Makes 2020 Debut at Indianapolis Speedway
OIF Launches Optical Module Management Interface Survey, Solicits Industry Input
Project ASLAN steers a new course for autonomous urban mobility
Aldec Adds Customizable Tool Qualification Data Package to ALINT-PRO™ for DO-254 Projects
Altium 365: Rapidly Gaining Traction throughout the Electronics Industry Solving PCB Design Collaboration…
Dr. Alessandra Nardi Receives Marie R. Pistilli Women in Engineering Achievement Award
Microchip Delivers the Smallest Automotive maXTouch(R) Controllers for Smart Surfaces and Multi-function…
Soft Robotics, Sensor Design, Foldable Microdisplay – SEMI FlexTech Launches Three New Projects to…
"Smart Assembly of SoC Designs" by Anupam Bakshi
Mouser Electronics Named 2019 High Service Distributor of the Year by KEMET
Synopsys and Arm Extend Strategic Partnership to Deliver Superior Full-Flow Quality-of-Results and T…
Microchip Delivers the Smallest Automotive maXTouch® Controllers for Smart Surfaces and Multi-function…
"Samsung Cloud Design Platform; Siemens-UltraSoC acquisition; 500°C CMOS fabrication; Arm-based fastest…
"D2S Brings GPU Acceleration to Semiconductor Design and Manufacturing" by Bob Smith, Executive Dire…
Galaxy Semiconductor Acquires Quantix Business from Siemens
Synopsys Broadens Collaboration with EPFL
Ambarella’s AI vision processor meets automotive safety goals with Mentor’s Tessent Safety ecosy…
ASSET ScanWorks streamlines interconnect testing of chiplets in multi-die packages and accelerates device…
New to Riviera-PRO™: VHDL-2019 Support and a Versatile UVM Registers Window
Arrow Electronics Joins Forces with Semiconductor Industry Association to Drive Global Technology Co…
Executives from Siemens, Qualcomm and Samsung Join Si2 Board of Directors
Worldwide Services Market Growth Disrupted by Economic Impact of COVID-19, According to IDC
Synopsys Awarded DARPA Contract for Automatic Implementation of Secure Silicon Program
Siemens acquires UltraSoC to drive design for silicon lifecycle management
Percepio Closes Series A Funding Round with Fairpoint Capital
Mouser Electronics Named Global Distributor of the Year by Bel Fuse, Inc.
Mouser Electronics’ “Engineering Big Ideas” Videos Win Series of Prestigious Awards
UltraSoC to become part of Siemens
IAR Systems Delivers Advanced Trace for RISC-V Based Applications
Siemens acquires UltraSoC to drive design for silicon lifecycle management
Keysight Technologies to Showcase Data Center Interconnect Test Solutions at Optical Networking Innovations…
Synopsys Sets Target for 25 Percent Greenhouse Gas Emissions Reduction by 2024
TEVET Announces Flexible, Cost-Effective RF Switching from Keysight Technologies
Ansys Spurs Innovation Through Student Competition For Autonomous Vehicle Technology Design
Interview with Natasha Baker, CEO, SnapEDA
TiE Silicon Valley Launches ‘Road to TiEcon’ with Luminaries Indra Nooyi, Deepak Chopra, Vinod …
New SEMI-NBMC, GE Research Project to Advance Vital Signs Monitoring of Patients During Emergency Air…
CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance…
"Cloud timing signoff; open source FPGA tools; GAA FETs; buried power rails; MRAMs; low Rdson SiC MOSFETs"…
Interview with Andrew Farrugia, VP Marketing, Agile Analog
"Real time operating systems: black box or open source?" by Colin Walls
"Three Steps to Set Up a RISC-V SoC UVM Testbench" by Anupam Bakshi
Synopsys Replenishes Repurchase Authorization to $500 Million
Mouser Electronics Earns Two Top Distribution Awards from Vishay
OLogic Drives Next Generation Robotics with EMA Design Automation and Allegro® SigrityTM Technology…
Isola Opens Expanded R&D and Analytical Laboratory at New Global Headquarters and Manufacturing Faci…
Intel Announces Unmatched AI and Analytics Platform with New Processor, Memory, Storage and FPGA Sol…
Samsung Provides One-Stop Foundry Design Environment with the Launch of 'SAFE™ Cloud Design Platform'…
Synopsys Collaboration with Samsung Foundry Enables Rollout of Samsung SAFE Cloud Design Platform
Keysight’s New Regenerative Power Supplies Reduce Cooling and Electricity Costs with an Eco-friendly…
OIF Announces Participants in 2020 Joint Network Operator, Multi-vendor Transport SDN API Interoperability…
Interview with Steven Lewis, Product Management Director, Cadence
HP Unveils Its Best Family Printer
Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud
Cadence Collaborates With TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules…
IAR Systems Enables Secure Code With Updated MISRA C Compliance in Leading Development Tools
Intel Editorial: Intel CET Answers Call to Protect Against Common Malware Threats
Ansys' Simulation World Attracts Massive Global Engineering Audience
SEMI Announces Support of CHIPS for America Act to Increase Semiconductor Manufacturing in the U.S.
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication…
Patrick Macdonald is ESCATEC’s New CEO
"EDA and MEMS updates; Europe’s data sovereignty; future unicorns; acquisitions" by Roberto Frazzo…
NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform
Mouser Electronics Named Molex Global e-Catalog Distributor of the Year
Keysight Technologies to Showcase Tools for Design, Simulation and Test at Millimeter Wave Innovations…
Altium and IHS Markit Partner to Solve Component End-of-Life Issues for PCB Design
ANSYS And Electro Magnetic Applications Partner To Deliver Design-To-Validation Workflow For Cable H…
CEA-Leti Researchers Break Throughput Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting…
Interview with Frank Schirrmeister, Senior Group Director, Solution Marketing, Cadence
Synopsys Acquires Semiconductor Analytics Innovator Qualtera
The 2020 Design Automation Conference Unveils Keynotes and SKYtalk Speakers
Synopsys Delivers the Industry's Only Complete Workflow for Automotive Lighting Design and Visualization…
Ansys Launches "Art of Simulation" Image Competition
Microchip Introduces 3kW Transient Voltage Suppressor Diode Array Family for Superior Circuit Protection…
SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements
"3 actions a small EDA Company can take to save 2020" by Modesto (Mo) Casas
"CEMWorks –– The Right Place at the Right Time Solving Real-World Problems" by Bob Smith, Executive…
Interview with Brian Rautio, VP Operations, Sonnet Software
Worldwide Server Market Revenue Declined 6.0% Year Over Year in the First Quarter of 2020, According…
ADLINK Teams with Intel to Launch ROScube-I ROS 2 Controller to Realize AI Robotics at the Edge
Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Report…
Efinix Completes Trion FPGA Family for Edge Computing, AI/ML and Vision Processing Applications Using…
Arteris® IP Advances onto List of Top 15 Semiconductor IP Vendors
Nimbix Expands Hybrid Cloud HPC Software Platform
Real Intent Announces Verix Multimode DFT Static Sign-Off Tool
Cadence Appoints Alinka Flaminia as Chief Legal Officer
Interview with Guy Haas, President, TeamEDA
Andes Technology Steps Up to Premier Membership in RISC-V International; Greatly Expanding its U.S.…
"AV standards and simulation; carbon nanotube transistors; gallium oxide MOSFETs; RISC-V IP in FPGA …
Interview with Leigh Gawne, Chief Software Architect, Altium
Altium Launches Initiatives to Help Electronics Industry Get “Back to Work”
Interview with Sammy Cheung, CEO, Efinix
Interview with Frederic Leens, CEO, Exostiv Labs
SigmaTron and Wagz Announce Letter of Intent for Merger Transaction
Synopsys Accelerates FIPS 140-3 Certification with NIST-Validated True Random Number Generator IP
OIF Announces 224 Gbps Project Preview, Election Results, Upcoming Webinars and Integrated Packet Optical…
IAR Systems Launches Support for the RISC-V P Extension for Packed-SIMD Instructions
Mouser Electronics Receives Best Digital Performance Award from Amphenol Corporation
SiliconExpert Celebrates 20th Anniversary with Launch of new SaaS Platform and Services for Parts, Bill-of-Materials,…
Synopsys Introduces Industry's First Complete USB4 IP Solution
IDC Expects Worldwide Smartphone Shipments to Plummet 11.9% in 2020 Fueled by Ongoing COVID-19 Chall…
Altair Announces Most Significant Software Update Release in Company History
MIPI Alliance Completes Development of A-PHY v1.0, an Industry-Standard Long-Reach SerDes Physical Layer…
Tech Visionaries to Explore the Future of Innovation at Virtual SEMICON West 2020
MIPI Alliance Recognizes Members at Annual Awards Ceremony
First-Quarter 2020 Global Semiconductor Equipment Billings Up 13 Percent Year-Over-Year
Digi-Key Electronics Launches PCB Builder to Streamline Ordering Experience
China IC Industry on the Rebound with SEMICON China Leading the Way
OmniVision Unveils World’s First Automotive Wafer-Level Camera Module, Enabling Better Driver Monitoring…
Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technol…
Green Hills Software Adds Industry-Leading Advanced Software Development Tools Support for RISC-V
IAR Systems and GigaDevice Collaborate to Bring Powerful RISC-V Solutions to the Market
Efinix® Announces Availability of Three RISC-V® SoCs
OIF to Present “Cu (see you) Beyond 112 Gbps” Webinar to Debate Requirements for Next Generation…
Global Semiconductor Sales Decrease 1.2 Percent Month-to-Month in April
Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development
Synopsys Fusion Design Platform and DesignWare IP Selected by Baikal Electronics to Deliver Latest High-Performance…
Samsung Foundry Certifies Synopsys Design Compiler NXT for 5/4nm FinFET Process Technologies
"Mobileye’s approach to AV safety; new Arm IP; security-aware EDA tools; backscattering" by Roberto…
"Automation of the UVM Register Abstraction Layer" by Anupam Bakshi
Synopsys CFO Trac Pham to Speak at Bank of America Global Technology Conference
Synopsys CFO Trac Pham to Speak at Baird Global Consumer, Technology and Services Conference
Altair to Virtually Present at the William Blair 2020 Growth Stock Conference
Synopsys' Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected…
HP Inc. Reports Fiscal 2020 Second Quarter Results
Synopsys Announces Support of TensorFlow Lite for Microcontrollers on Energy-Efficient ARC EM and ARC…
SEMICON Southeast Asia 2020 Goes Virtual to Highlight Industry Innovation and Growth Opportunities
Digilent Introduces an FPGA-based signal processing system
Keysight Technologies Reports Second Quarter 2020 Results
Synopsys Enables Tapeout Success for Early Adopters of Arm's Next Generation of Mobile IP
Cadence Optimizes Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile…
IAR Systems Delivers Efficient Embedded Software Building on Linux
HaiLa Technologies Inc. Raises $5 Million in Seed Financing to Commercialize Low Power IoT Solution
GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator
New Arm IP delivers true digital immersion for the 5G era
Interview with Markku-Juhani O. Saarinen, Senior Cryptography Engineer, PQShield
Panasonic Adopts Synopsys Custom Design Platform to Accelerate Next-Generation Automotive and Industrial…
"EDA updates; new generation Nvidia GPU; research on AI energy savings; future Tesla batteries" by Roberto…
"Virtual 2020 CEO Outlook Set for June 17" by Bob Smith, Executive Director
Cadence’s John Wall to Present at Cowen Virtual Conference
HPE Reports Q2 Results
MEDIA ALERT: ESD Alliance Presents Virtual 2020 CEO Outlook
Fuji Xerox Adopts Synopsys ZeBu Server for Multi-Function Printer SoC
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2020
North American Semiconductor Equipment Industry Posts April 2020 Billings
RS Components and BARTH Elektronik unveil “People Counter” maker project to help social distancing…
eMemory Provides Intellectual Property for Secure NB-IoT Products
HENSOLDT and Nano Dimension Achieve Breakthrough in Electronics 3D Printing
S2C Announces New Prodigy Cloud System for Next Generation SoC Prototyping
Ansys, Microsoft, Dell and Lendlease Unite to Expedite Digital Twin Adoption
Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Appl…
Arteris® IP FlexNoC® Interconnect and AI Package Licensed by Blue Ocean Smart System for AI Chips
Broadcom Delivers Innovative Software to Silicon Integration with Industry’s First AI-Driven Network…
TeamEDA, Inc. Establishes Worldwide Channel Partner Program
HENSOLDT and Nano Dimension Achieve Breakthrough in Electronics 3D Printing
ESD Alliance Announces D2S as a New Member of its Community
Sundance launches the VF370 Intel-based 3U OpenVPX SBC module for SWaP applications
Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes on TSMC N7 and N6 Processes
Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions…
IAR Systems Enables Security Compliance for Embedded Applications Based on Mainstream MCUs From NXP …
"Multiple constructors in C++" by Colin Walls
Mentor’s Calibre and Analog FastSPICE platforms achieve certification for TSMC’s newest processe…
"Intel investments; binary neural networks; Q1 VC deals; social distancing wearables" by Roberto Fra…
Altair to Virtually Present at the Needham Technology & Media Conference
Intel Editorial: Closing Out a Decade of Corporate Responsibility Accomplishments and Creating Greater…
Intel Launches First Global Challenges, Marks a New Era of Shared Corporate Responsibility
Electronics Manufacturing Supports More Than 5.3 Million U.S. Jobs and Almost 4% of U.S. GDP, Says I…
New Intel vPro Platform Enables Uncompromised Productivity and Performance for the Modern Workforce
Perceptia Devices Offers Research License
Open Compute Project Foundation (OCP) Announces New Board Seat for Google and New Board Member
Manage Disruption Through Collaboration at Virtual SEMICON West 2020
SmartDV Ships First Design and Verification IP for MIPI RFFE v3.0 Specification
Mentor Graphics and the University of Basel Join the OpenMP® Effort
Synopsys Study Shows that Ninety-One Percent of Commercial Applications Contain Outdated or Abandoned…
Arteris® IP FlexNoC® Interconnect Licensed by Picocom for 5G New Radio Infrastructure Baseband SoC…
SiMa.ai Raises $30 Million in Series A Investment Round Led by Dell Technologies Capital
Intel Capital Invests $132 Million in 11 Disruptive Technology Startups
Arasan Announces the Availability of MIPI D-PHY IP for TSMC 22nm Process Technology
Keysight Delivers New Electrical-Optical-Electrical System Design Workflow with VPI Optical Link
Synopsys Accelerates High-Performance Computing SoC Designs with Industry's Broadest IP Portfolio for…
"Arm’s startup program; new x86 processors; innovative flash chip from China; recent acquisitions;…
"Doing What We Can in Challenging Times" by Anupam Bakshi
More than Moore with Domain-Specific Processors
Cadence’s Lip-Bu Tan to Present at J.P. Morgan Virtual Conference
Altair Announces First Quarter 2020 Financial Results
MIPI RFFE v3.0 Delivers Tighter Timing Precision and Reduced Latencies Needed for Successful 5G Roll…
X-FAB and EUROPRACTICE Choose Innovative Solution to Help the Visually Impaired as 2020 MEMS Design …
"First ESD Alliance Webcast Told Feel-Good Story of Bootstrapped Startup to Profitability Company" by…
Synopsys Announces Earnings Release Date for Second Quarter Fiscal Year 2020
Ansys Announces Q1 2020 Financial Results
Keysight Establishes New Testing Lab in Malaysia
Altium Takes PCB Design and Realization to the Next Dimension
MathWorks Delivers Additional AI Capabilities to Engineers and Scientists with Release 2020a of MATLAB…
Ansys RedHawk-SC Multiphysics Signoff Solution Achieves Certification On All TSMC Advanced Process T…
"Connecting Emulated Design to External PCI Express Device" by Krzysztof Szczur
New Functional Safety Ready AVR® DA Microcontroller Family Enables Real-Time Control, Connectivity …
57th Design Automation Conference To Be a Virtual Experience for 2020
Power and Compound Fab Spending to Rebound in Second Half of 2020, Set New Record in 2021, SEMI Repo…
Keysight Unveils Advanced Analytics Software to Speed Semiconductor Design Validation without Sacrificing…
IPC Provides Online Proctored Exams for CIT, CIS and CSE Certification
North American PCB Industry Sales up 3.7 Percent in March IPC Releases PCB Industry Results for March…
Aldec’s New HES FPGA Accelerator Board Targets HPC, HFT and Prototyping Applications plus Hits the…
Global Semiconductor Sales Decrease 3.6 Percent in First Quarter of 2020
In Response To The COVID-19 Pandemic, Private Sector Groups And Industry Associations, Scientific Societies…
Intel Acquires Moovit to Accelerate Mobileye’s Mobility-as-a-Service Offering
Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds
PLDA Announce Complete Support for CXL™ and Gen-Z™ protocols
"Freakonomics take on “How Do You Reopen a Country?”" by Sanjay Gangal
Freakonomics take on “How Do You Reopen a Country?”
"AI chips in the spotlight at the Linley Spring Processor Conference 2020" by Roberto Frazzoli
Synopsys Named a Leader in the Gartner Magic Quadrant for Application Security Testing for Fourth Consecutive…
Altair to Virtually Present at the J.P. Morgan 48th Annual Global Technology, Media, and Communications…
Altair to Announce First Quarter 2020 Financial Results on Thursday, May 7, 2020
Intel Delivers World’s Fastest Gaming Processor
Samsung Foundry Certifies Ansys RaptorH For Countering Electromagnetic Effects In 2.5D/3D Integrated…
TTM Technologies, Inc. Reports Fiscal First Quarter 2020 Results
Worldwide Tablet Shipments Continue to Decline in Q1 2020, According to IDC
Keysight Launches First Emulation Software for Validating O-RAN Compliant Radio Units
Arm Offers Silicon Startups Zero-cost Access to the World’s Most Widely Used Chip Designs​
Intel and MIC Announce Scale to Serve Program to Rapidly Expand Remote ICUs to 100 US Hospitals
OIF Publishes Implementation Agreement for 400ZR Coherent Optical Interface Spec addresses 400ZR multi-vendor…
Flexible Circuit Technologies appoints Johnson Company to handle Midwest sales
AMD Reports First Quarter 2020 Financial Results
Synopsys Introduces 3DIC Compiler, Industry's First Unified Platform to Accelerate Multi-die System …
Mixel’s MIPI D-PHY IP Integrated into the Lattice CrossLink-NX FPGA
IAR Systems Opens Office in India
Altair Launches Brand Refresh
InterDigital’s Alan Stein Presented IEEE Award for Exploration of Next Generation Video Coding Sta…
"Simberian interview: signal integrity and power integrity challenges in high-speed PCB design" by Roberto…
SNUG Silicon Valley Announces 2020 Best Paper Award Winners and On-Demand Content
Intel Reports First-Quarter 2020 Financial Results
North American Semiconductor Equipment Industry Posts March 2020 Billings
"Correct-By-Construction SystemVerilog UVM Testbenches" by Anupam Bakshi
Free Printed Circuit Boards, Parts and Assembly for Environment-Focused Organizations
Keysight’s 5G Solutions Enable Hisense Communication to Accelerate Development of High-Quality 5G …
Altair Accelerates Simulation-Driven Design in Latest Release of Altair Inspire™
New York Institute of Technology -Vancouver Develops Secure Boot Application for GOWIN SecureFPGA
Sponsorship of Women Helps Address Talent Gap and Increase Profitability in Semiconductor Companies,…
Mouser Electronics Honored with Third Consecutive Distributor of the Year Award by Neutrik
Cadence Reports First Quarter 2020 Financial Results
Enabling next-gen architectures: TE Connectivity showcases data and power connectivity solutions virtually…
"Keysight interview: signal integrity and power integrity challenges in high-speed PCB design" by Roberto…
"Join us for Jim Hogan and Methodics’ Simon Butler Webcast on Bootstrapping a Startup to Profitability"…
"A hypervisor on a multicore system" by Colin Walls
Aurora Circuits Offers PCBs for Ventilators at No Cost
Cadence to Hold Virtual 2020 Annual Meeting of Stockholders
ANSYS to Release First Quarter 2020 Earnings Results After Market Close on May 6, 2020
GLOBALFOUNDRIES Qualifies Synopsys' IC Validator for Signoff Verification on 22FDX Platform
DownStream Technologies Announces 25% Year-to-Year Sales Growth
Digi-Key Electronics Announces North American Distribution Partnership with Rigol Technologies
Intuiface Introduces Computer Vision Capabilities Using Intel® Distribution of the OpenVINO™ Tool…
MEDIA ALERT: ESD Alliance Hosts Webcast Featuring Jim Hogan and Methodics’ Simon Butler on Bootstrapping…
Si2 Launches Survey on Artificial Intelligence and Machine Learning in EDA
IAR Systems and The Qt Company Collaborate to Deliver Streamlined Development of UI Applications
2019 Global Semiconductor Equipment Sales Slip 7 Percent to $59.8 Billion, SEMI Reports
Gradual Rebound or Slight Dip – Two Scenarios for COVID-19 Impact to 2020 Global Silicon Wafer Market…
Intel Ignite Selects Next 10 Game-Changing Companies for Startup Growth Program, Moves Program Onlin…
Gradual Rebound or Slight Dip - Two Scenarios for COVID-19 Impact to 2020 Global Silicon Wafer Market…
ADLINK Joins Intel and Arrow Electronics to Launch Vizi-AI™ Development Starter Kit for Industrial…
HP Launches Free Print, Play & Learn Platform
New 2nd Gen AMD EPYC™ Processors Redefine Performance for Database, Commercial HPC and Hyperconverged…
San Francisco’s First Non-profit Food Truck Mobilize Love Launches Campaign to Provide Tens of Thousands…
Mouser Electronics Named Distributor of the Year by Littelfuse
Sanjay Gangal interviews Dave Kelf, Chief Marketing Officer at Breker Verification Systems
Traditional PC Shipments Saw a Sharp Decline in Q1 2020 Despite Increased Demand to Meet Remote Work…
Groq Adopts Synopsys ZeBu Server 4 to Develop Breakthrough AI Chip
"Ansys interview: signal integrity and power integrity challenges in high-speed PCB design" by Roberto…
Flexible Circuit Technologies (FCT) continues its operations as an “Essential Supplier” of electronics…
Flex Logix Discloses Real-World Edge AI Inference Benchmarks Showing Superior Price/Performance For …
OmniSci and Z by HP Accelerate Data-Driven Workflows
"Enhance Your Design and Verification Knowledge with Extensive Webinar Series" by Anupam Bakshi
Mouser’s New Price and Availability Assistant Makes Quoting and Purchasing Easier than Ever
The 2020.3 release of Aldec’s Spec-TRACER™ bridges the communication gap between system and hardware…
EMA Design Automation Announces Partnership with Dassault Systèmes to Deliver Business Transformation…
"How to Develop a 4K Ultra High Definition Image/Video Processing Application Using Zynq® MPSoC FPGA"…
Transtector Releases New USB Surge Protectors to Safeguard Sensitive Computer Ports
COVID-19: Economic and Microelectronics Industry Impacts – Insights from McKinsey & Company
Infinite Electronics Produces & Donates 3D-Printed Reusable Face Shields for Healthcare Workers Battling…
Synopsys Introduces New 64-bit ARC Processor IP Delivering Up to 3x Performance Increase for High-End…
Faraday Adopts Synopsys' Platform Architect and Hybrid Prototyping Solutions to Expand Design Servic…
MaxLinear to acquire Intel’s Home Gateway Platform Division
"Perceive’s AI processor; tactile sensors; Tbit/s on a twisted pair; FPGA acceleration of legacy programs"…
Global Semiconductor Sales in February Down 2.4 Percent Month-to-Month
Cadence Announces First Quarter 2020 Financial Results Webcast
AV1 Encoder and Decoder Hardware IPs Available from Allegro DVT and Embedded in Products by End of 2…
Lattice Semiconductor Joins Silicon Catalyst In-Kind Partner Ecosystem to Foster Broader Use of FPGA…
ANSYS ISSUES LETTER TO INVESTORS
Synopsys Expands Collaboration with Broadcom for 7nm and 5nm Designs
Trixell Adopts Silvaco TCAD-based Parasitic Extraction Solution for Development of New Display Techn…
Mouser Electronics Wins Digilent’s Distributor of the Year Award for 2019
ESD Alliance Announces AMEDAC as a New Member of its Community
IAR Systems Enables Secure Applications Based on NXP's LPC55S6x Arm Cortex-M33 MCUs
2nd Gen AMD EPYC™ Processors Power New IBM Cloud Bare Metal Servers
Sanjay Gangal interviews Moshik Rubin, Product Management Group Director at Cadence Design Systems.
Altium Launches Altium Stories
SEMI Urges ‘Essential Business’ Designation of Semiconductor Companies Worldwide to Help Ensure …
An IPC Policy Roadmap to Economic Recovery
Global Semiconductor Materials Market Revenues Slip 1.1 Percent in 2019, SEMI Reports
Keysight Technologies Launches Innovate Anywhere Program
Synopsys Expands DesignWare MIPI IP Portfolio with Silicon-Proven, Integrated C-PHY/D-PHY IP Solution…
Ansys Wins Prestigious Industrial Internet of Things Award
GOWIN Semiconductor Adds VHDL Support to their GOWIN Synthesis FPGA Software for Complete RTL Language…
"MSS Report Helps Guide Businesses in the Electronic System Design Ecosystem" by Paul Cohen
Sanjay Gangal interviews Frank Schirrmeister, Senior Group Director, Solution Marketing from Cadence Design Systems, Inc.
Photonic Solutions From Synopsys Support Advancements in Nanoscale Optics
Silvaco Delivers New Generation of MIPI I3C® Sensor Connectivity IP
SMIT Announces 2019 Annual Results
Dassault Systèmes Solutions Supporting Simulation and Prevention of Contamination Dispersal in Wuhan’s…
"EDA 2019 results; EUV-based DRAMs; supercomputers; fast charging batteries; image sensors" by Roberto…
Sanjay Gangal interviews Mark Christiaens, Head of Engineering from Sigasi
Covid Near You - Participate in a Harvard Medical School Citizen Science Project
Worldwide Server and Enterprise Storage Systems Markets Will Decline in 2020, Impacted by the COVID-19…
Synopsys Changes 2020 Annual Meeting of Stockholders to Virtual Format
Sanjay Gangal interviews Srinivasan Venkataramanan, CEO from VerifWorks
DVCon Europe Announces 2020 Dates and Calls For Papers, Tutorials And Panels
Software-Based Encryption at Hardware Level for IoT Security delivered by IKV, based on Intrinsic ID’s…
Keysight Accelerates Development of Flexible Virtualized Networks and High-Value Mobile Services with…
Achronix Selects Synopsys' Leading DesignWare IP Solutions to Accelerate Development of High-Performance…
Dassault Systèmes’ Initiatives with its Partners and Clients to Face COVID-19 Challenges
Sanjay Gangal interviews Mark Gilbert, EDA Careers President
Southern California PCB Manufacturer Working Hard to Support Production of Ventilators
InterMotion Technology Boosts IP Verification Productivity for Lattice Semiconductor’s CrossLink FPGA…
IPC Welcomes U.S. Economic Stabilization Package, Proposes Agenda for Economic Recovery and Resiliency…
The Coronavirus Outbreak Will Likely Impact New Product Introductions
SiFive Selects Synopsys Fusion Design Platform and Verification Continuum Platform to Enable Rapid SoC…
ESD ALLIANCE REPORTS EDA INDUSTRY REVENUE INCREASE FOR Q4 2019
Ansys Names Boston Engineering its Simulation Engineering Reseller and Solutions Provider for New England…
Sanjay Gangal interviews Moshik Rubin, Product Management Group Director at Cadence Design Systems
Mentor’s flagship PADS Professional software for PCB design now available for free to students and…
Reno Sub-Systems First to Market with Multi-Level RF Match for Advanced Semiconductor Manufacturing
Mentor is the Newest In-Kind Partner of Silicon Catalyst’s Incubator for Chip Startups
NVIDIA Supports Remote Workers with Expanded Free Virtual GPU Software
Arteris IP FlexNoC® Interconnect Again Licensed by NETINT Technologies for Codensity Enterprise SSD…
Latest Release of LightTools From Synopsys Offers New Modeling and Analysis Features for Illumination…
Tower Semiconductor releases design kits for a novel 0.18um high-performance power management technology…
Digi-Key Launches New Video Series with Arduino, Supplyframe and Microchip
Synopsys Delivers Industry's First Ethernet 800G Verification IP for Next-Generation Networking and …
APCT Now Offers Quick-turn Capabilities for Their Rigid Flex Product
"Updates from Cadence and Synopsys; Intel’s 100 million neurons system; IoT cross-technology wireless…
IAR Systems Updates Functional Safety Tools for Renesas RL78 MCUs
North American Semiconductor Equipment Industry Posts February 2020 Billings
Digi-Key Electronics Announces North American Distribution Partnership with Pololu Robotics and Elec…
X-FAB Further Expands its SiC Capacity and Adds New In-House Epitaxy Capabilities
Inomize Selects Synopsys' Silicon-Proven 56G Ethernet PHY IP for High-Performance Computing and Communications…
IAR Systems Extends Capabilities for Safety-critical Applications Based on Renesas RX MCUs
ACM Research Announces Advanced Packaging Stress-Free Polishing Tool
COVID-19 To Have Significant Effect on Worldwide Semiconductor Market in 2020, According to IDC
Intel Scales Neuromorphic Research System to 100 Million Neurons
Keysight Technologies Provides Business Update For Fiscal Second Quarter
"CEMWorks and Avery Welcomed into the ESD Alliance Member Community; Event Recordings Available" by …
Sanjay Gangal interviews Roger Levinson, BrainChip's Chief Operating Officer
Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Thro…
New SEMI Job Skills Model for Growing Microelectronics Industry Talent Pipeline Released by U.S. Department…
Efficient Power Conversion (EPC) Redefines Power Conversion with the Release of ePower™ Stage IC Family…
Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements…
"Questions on multicore Linux, DO-178B and RTOS performance" by Colin Walls
UnitedSiC Announces New Global Distribution Partnership with Digi-Key
eMemory Launches Reprogrammable NVM Solution on TSMC Platform
Cadence Elects Ita Brennan and Lewis Chew to Board of Directors
Sanjay Gangal interviews Inan Erdem, ANKASYS CEO
Computers That Smell: Intel’s Neuromorphic Chip Can Sniff Out Hazardous Chemicals
Digi-Key Announces Global Distribution Partnership with UnitedSiC
Keysight Technologies Enables Designers to Save Time and Cost of Iterative Build and Test of Physical…
Synopsys Unveils RTL Architect To Accelerate Design Closure
Physical Optics Corporation And Ansys Streamline Avionics Development For U.S. Military Aircraft
Blue Pearl Software's Continued Commitment to Customers
Investing in Industry 4.0: IPC Launches IPC CFX Industry Support Programs
IPC Calls for Participation in Electronics Materials Forum
IPC Announces European Hand Soldering Competition Calendar Thanks, regional competition and world championship…
IPC Issues Call for Participation for IPC E-TEXTILES 2020
Coronavirus Expected to Cause Five-Week Product Shipment Delays, Says Electronics Manufacturing Indu…
"AI-optimized chip design; image sensor with neural network capability; nanoelectromechanical relays;…
Sanjay Gangal interviews Mark Christiaens, Head of Engineering at Sigasi
WHO Coronavirus disease 2019 (COVID-19) Situation Report & Maps – 52
Coronavirus COVID-19 Global Cases by the Center for Systems Science and Engineering (CSSE) at Johns …
SEGGER Announces Support for Nuclei RISC-V Processors
Electronics Manufacturers Feel Impact of Coronavirus Disruptions But Majority Expect Business to Return…
Xerox Releases Statement Related to COVID-19 and its Proposal to Acquire HP
Worldwide Server Market Revenue Grew 7.5% Year Over Year in the Fourth Quarter of 2019, According to…
North American PCB Industry Sales Decrease 5.2 Percent in January IPC Releases PCB Industry Results …
"U.S. EPA Fees for Toxic Substances May Apply to Your Company This Year" By Kelly Scanlon, director …
"Electronics Supply Chain in Flux Due to Tariffs, Epidemic, Other Factors" by Shawn DuBravac, IPC chief…
Taiwan Union Technology Corporation is First to Pass Recertification Under IPC-4101 Qualified Products…
IPC Releases New Standards Revisions
IPC Issues Call for Participation for IPC E-TEXTILES 2020
Leica Geosystems, Liebherr cooperate to integrate machine control solutions
"Make an Impact and Get Involved in Standards Development and Evolution" by Lu Dai
"Postponed: Jim Hogan and Methodics’ Simon Butler Lunch Event" by Bob Smith, Executive Director
ESD Alliance Adds CEMWorks to Member Community
Mouser and Molex Team Up to Sponsor Dale Coyne Racing with Vasser-Sullivan for 2020 IndyCar Season
Sanjay Gangal interviews Mark Gilbert, EDA Careers President
DVCon U.S. 2020 Announces Stuart Sutherland Best Paper & Best Poster Winners
Remcom Announces Advanced Phased Array Design Capabilities in XFdtd Including Superposition Simulation…
Sanjay Gangal interviews Srinivasan Venkataramanan, VerifWorks CEO
Synopsys Advances State-of-the-Art in Electronic Design with Revolutionary Artificial Intelligence T…
Cadence Tensilica HiFi IP Accelerates AI Deployment with Support for TensorFlow Lite for Microcontro…
Keysight’s Test Solutions Selected by Vanchip to Accelerate Performance Validation of 5G Radio Frequency…
Ultra Librarian Announces UltraBOM for Digi-Key, Enabling Part Research Within OrCAD Capture
Synopsys Introduces Machine Learning-Based Auto Segmentation Module for 3D Image Processing
Andes to Presents Andes Custom Extensions to the RISC-V V5 CPU Core for Creating Highly Competitive …
Cadence’s John Wall to Present at Berenberg Conference in New York
Ventec Re-Certified to AS9100 Revision D in UK
HSIO Technologies and Flexible Circuit Technologies sign comprehensive state of the art flex and rigid…
Global Fab Equipment Spending Poised for 2021 Record High
Sanjay Gangal interviews Frank Schirrmeister, Senior Group Director, Solution Marketing from Cadence Design Systems, Inc.
Mouser Electronics Named Global High Service Distributor of the Year by TE Connectivity
Lumerical Partners with Key Photonics Ecosystem Players to Host Online Tech Day
Verific Celebrates 20 Years of Exceptional Support with Tributes from Customers
Si2 Compact Model Coalition to Support CEA-Leti SPICE Simulation Model
Synopsys Custom Design Platform Secures Full-flow Displacement of Legacy Design Tools at Alphawave
Altair to Virtually Present at the Berenberg Design Software Conference
Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics
TASKING expands strategic Infineon partnership with multi-core development environment for next generation…
Ansys and Photonic Simulation Leader Lumerical Sign Definitive Acquisition Agreement
Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for …
Going Virtual: OCP Announces Rebirth of 2020 OCP Global Summit
SEMICON Southeast Asia 2020 Postponed to 11-13 August 2020
Electronics Industry Elevates its Excellence at IPC APEX EXPO 2020
UMC certifies Mentor product lines for its new 22nm ultra-low-power process technology
Mouser Sponsors 2020 Global Create the Future Design Contest
Defacto Announces STAR 8.0 and Provides a Unified “All-in-One” SoC Design Solution to Help Conciliating Between RTL, IP-XACT, UPF, SDC, and Physical Design Information
Sanjay Gangal interviews Christopher Cain, Vice president and general manager of Keysight's Electronic Industrial Products from Keysight Technologies at the IPC/Apex Expo
Samsung Adopts Synopsys' Machine Learning-Driven IC Compiler II for its Next-Generation 5nm Mobile SoC…
Samsung Executive Joins Si2 Board of Directors
Women in Semiconductors to Highlight Workplace Diversity at ASMC 2020
7layers certified the first IoT chipset acc. to GCF rules
Sanjay Gangal interviews Sharon Cohen, President of Orbotech West from Orbotech Inc at the IPC/Apex Expo
Aldec to Present at Certification Together International Conference
HPE Reports Q1 Results
ROHM's Cutting-Edge Web Simulation Tool Capable of Complete circuit Verification for Power Devices and…
MEDIA ALERT: ESD Alliance’s Paul Cohen Presents “Connecting Design, Manufacturing and Assembly in…
OIF Completes Coherent Common Management Interface Specification (C-CMIS) Implementation Agreement for…
Keysight Unveils Ultra-High-Density, Multi-Terabit Test Solution for Data Center Operators and Network…
DVCon U.S. 2020 Compresses Program to Three Days
SEGGER AppWizard Enabling Advanced GUI Design in Next Generation Embedded Applications
Sanjay Gangal interviews John Mitchell, President and CEO from IPC at the IPC/Apex Expo
Agnisys Speeds up SoC Verification with Launch of IDesignSpec NG at DVCON USA
Global Semiconductor Sales Down Slightly Year-to-Year in January
Keysight Technologies Drives Advancements in Quantum Technology that Enable Companies and Institutions…
SEMI-FlexTech Announces 2020 FLEXI Awards Winners for Outstanding Achievements in Flexible Hybrid El…
IEEE Future Networks Releases the International Network Generations Roadmap, Helping Developers Identify…
Synopsys Co-CEO Aart de Geus to Speak at Morgan Stanley Technology, Media & Telecom Conference
Sanjay Gangal interviews Michelle Martin , Head of North America CDP from Clariant at the IPC/Apex Expo
Dell Technologies Reports Fiscal Year 2020 Fourth Quarter and Full Year Financial Results
Altair Announces Fourth Quarter 2019 Financial Results
Synopsys Announces Next-Generation VC SpyGlass RTL Static Signoff Platform
Introspect Technology Adds MIPI C-PHY and D-PHY Frame Grabber Solutions for CSI-2 Image Sensors
PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth…
Ansys Announces Fourth Quarter and Fiscal Year 2019 Financial Results With Record Revenue, EPS, ACV…
Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement
Sanjay Gangal interviews Henk Biemans, Managing Director from Mek Americas LLC at the IPC/Apex Expo
MEDIA ALERT: ESD Alliance to Highlight Membership Benefits at DVCon U.S.
Cadence Announces Industry’s First Verification IP for PHY Covering Multiple Protocols
MathWorks Automates Vision Systems Design for Implementation on FPGAs and ASICs
Intel Highlights Latest Security Investments at RSA 2020
Dassault Systèmes Launches “The Only Progress is Human” to Inspire Solutions to Major Global Ch…
OpenHW Group celebrates rapid growth to 40+ members and new open-source processor implementations less…
OneSpin’s Focus on Assuring IC Integrity Across Multiple Sectors Leads to 37% CAGR Over Five Years
Sanjay Gangal interviews Michael Ford, Sr. Director Emerging Industry Strategy from Aegis Software at the IPC/Apex Expo
Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps
Philipp A. Hartmann to Receive Accellera Systems Initiative Technical Excellence Award
ESD Alliance Welcomes Avery Design Systems to Member Community
Si2 Launches Special Interest Group for AI and ML in Electronic Design Automation
Ansys Accelerates 5G, High-Performance Computing And Artificial Intelligence Design
Altium Accelerates IoT and AI Hardware Development through Geppetto and Seeed Collaboration
UltraSoC launches CAN Sentinel to boost automotive cybersecurity
CAMtek Receives AS 9100D 2016 Certification
Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020
FLEX and MSTC 2020 Open Today as Flexible Hybrid Electronics Drive Next Wave of Smart MEMS and Senso…
Altium Accelerates IoT and AI Hardware Development through Geppetto and Seeed Collaboration
Clang on steroids! SEGGER releases optimized Compiler for ARM
Sanjay Gangal interviews Mike Konrad, President and CEO from Aqueous Technologies at the IPC/Apex Expo
Weebit Nano and SiEn to investigate opportunities to use Weebit technology in SiEn products
HP Inc. Reports Fiscal 2020 First Quarter Results
Keysight Technologies Reports First Quarter 2020 Results
DVCon U.S. 2020 – Don’t Miss It!
IAR Systems Extends Industry-leading Arm Tools Offering With Support for Renesas Electronics' RA Fam…
Intel Announces Unmatched Portfolio for 5G Network Infrastructure
Sanjay Gangal interviews Ranjan Chatterjee, VP & GM Smart Factory Business Unit from Cimetrix, Inc at the IPC/Apex Expo
Keysight Technologies’ Test Solutions Leveraged in Automobile Battery Cell Competence Center
X-FAB’s Automotive 180nm BCD-on-SOI Technology Platform Further Optimized for Smart Actuators and …