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Siemens launches Siemens Xcelerator - an open digital business platform to accelerate digital transformation
Siemens and NVIDIA to enable industrial metaverse
Si2 Names Recipients of Annual Power of Partnerships Award
Primarius Unveils Custom Design Environment, Circuit Simulation and Design Enablement Solutions at D…
Keysight Launches New Design and Simulation Software for Radio Frequency and Microwave Designers
New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale…
Weebit Nano tapes out ReRAM demo chip to SkyWater foundry
Synopsys and Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs for Arm's Total Compute Solu…
Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success
Ansys Joins Intel Foundry Services Cloud Alliance to Advance Semiconductor Development
Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence…
New S2C Multi-FPGA Prototyping Software Eases the Pain
Analog/Mixed Signal Lunch Panel at the 59th DAC
Mouser Electronics Honored with Top Performance Awards from Manufacturer Partners
Court Lifts Final Injunction in Favor of Altair in World Programming Case
Accenture Announces Intent to Acquire XtremeEDA to Expand Silicon Design Capabilities in Canada and …
Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies
SEGGER announces Flasher support for Infineon TriCoreTM AURIX
Codasip adds Veridify secure boot to RISC-V processors
Interview with Michel Villeman, CEO, Presto Engineering
Silicon Catalyst welcomes EMD Electronics as Newest Strategic Partner
Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips
SEMI MEMS & Sensors Industry Group Invites Proposals for Funding of Positioning, Navigation and Timing…
Full RISC-V and CMake support added to powerful NECTO Studio 2.0 IDE from MIKROE
Siemens’ NX delivers greater cross-discipline collaboration and knowledge capture
Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications…
Sequans attracting attention of world leading MCU vendors
Codasip Studio Mac extends potential to design for differentiation with RISC-V
Autotalks announces immediate availability of ZooZ 2 safety device for bikes and scooters
Siemens extends support of multiple IC design solutions for TSMC’s latest processes
Nordic Thingy:53 brings dual-Arm Cortex-M33 processor power and embedded machine learning to rapid IoT…
SGET releases Open Standard Module specification 1.1 and OSM design guide1.0
SEGGER introduces emCompress-PRO software
"Automating UVM-Based IP and SoC Functional Verification" by Anupam Bakshi
"ESD Alliance Sponsors SEMICON West Smart MedTech Pavilion Panel, Hosts Wednesday Evening Reception"…
"New fab rumors; TSMC’s innovations; low-temperature 3D chip bonding; new optical microphone" by Roberto…
Altair Announces Sale of $230 Million Aggregate Principal Amount of Convertible Senior Notes
Cadence Announces $100 Million Accelerated Share Repurchase Agreement
Watch Ansys Simulation World 2022 Keynotes and Presentations
Interview with Manu Nair, CEO, Synthara
Synopsys Completes Acquisition of WhiteHat Security
Tortuga Logic Rebrands as Cycuity as It Addresses Evolving Needs in Product Security
Monozukuri Signs Strategic Investment Agreement with MARCAP
CV32E40P Core From OpenHW Group Sets the RISC-V Quality Standard For Open-Source Hardware IP (Imperas)
Mouser Electronics Receives TDK’s Top Global, Europe, North America Distribution Awards
Pulsic Enhances Unity Chip Planning Technology with Incremental Floor-planning Capability to Speed IP…
Michelle Clancy Receives Marie R. Pistilli Women in Engineering Achievement Award
Cadence Achieves PCIe 5.0 Specification Compliance for PHY and Controller IP in TSMC Advanced Techno…
OpenHW Group Announces RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware…
Weebit Nano to publicly demonstrate its ReRAM IP module for the first time
Si2 Forum Addresses Novel Approaches to Low-Power Semiconductor Design
SEMICON Southeast Asia 2022 Opens Tomorrow With Focus on Sustainability and Supply Chain Resilience
Xpeedic Releases Latest RF EDA/Filter Design Platform at IMS2022
IAR Systems enable Visual Studio Code extensions to meet developer demands
"Conquering 2.5D and 3D Chip Design Challenges with Monozukuri" by Bob Smith, Executive Director
"Backside power delivery; GaN-on-Si for 5G; Apple’s M2; new Fraunhofer center" by Roberto Frazzoli…
Embedded World Fair: Menta and Everspin Technologies will demonstrate an innovative collaboration with…
Interview with Barry Paterson, CEO, Agile Analog
Synopsys Boosts 5G SoC Development Productivity with New RF Design Flow for TSMC N6RF Process
Keysight, Synopsys Collaborate in TSMC’s N6RF Design Reference Flow
Cadence RFIC Solutions Support TSMC N6RF Design Reference Flow
Real Intent Elevates Ascent Lint Sign-Off with Targeted Debug & Multi-Policy Runs
Mouser Awarded Distributor of the Year Honors from Omron
Astera Labs on the Rise: Purpose-Built CXL/PCIe/Ethernet Connectivity Solutions for Intelligent Systems…
Cadence Design IP portfolio in TSMC’s N5 Process Gains Broad Adoption Among Leading Semiconductor …
Member Achievements, Contributions Recognized at Ninth Annual MIPI Alliance Awards Ceremony
Think Silicon to Unveil Industry’s First RISC-V 3D GPU at Embedded World 2022
Four Exceptional Innovators Selected to Receive the Design Automation Conference Under-40 Innovators…
Samsung Foundry Adopts Primarius’ SDEP to Shorten SPICE Model Development Turnaround Time
Tempo Automation Requalifies for Class 3 IPC Qualified Manufacturer Listing
Mouser Wins Trio of Top Distributor Awards from Vishay
Weebit Nano Announces Participation in Leti Innovation Days 2022
Real Intent Advances Meridian CDC with Multimode Coverage & Unprecedented 10X Efficiency
Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022, SEMI Reports
Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Proce…
Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes
Altair Expands Electronic System Design Technology with Acquisition of Concept Engineering
AI/ML-based optimization; free GPU and DLA IPs; easier I3C adoption by "Roberto Frazzoli"
Maheen Hamid, Silicon Valley Influential Woman and ESD Alliance Governing Council Member by "Bob Smith,…
Mouser Wins Top NPI Distributor Award from Digi International
SEMICON West 2022 Hybrid to Spotlight Sustainability, Smart Technologies, Talent 
Arm introduces new image signal processor to advance vision systems for IoT and embedded markets
Altair Announces Pricing of Offering of $200 Million of Convertible Senior Notes
Mouser Electronics Examines Importance of Designing for Security in Third Empowering Innovation Together Episode
Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Desig…
Keysight Technologies to Highlight Millimeter-wave Innovations at IMS 2022
Second Annual Poster Gladiator Battle Returns to the 59th Design Automation Conference
Interview with Nathan Tracy, Technologist, TE Connectivity
DVCon U.S. 2023 Announces Call for Panel, Short Workshop and Tutorial Proposals for Upcoming In-person…
Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e‑Commerce Platfor…
PC Shipments to Feel the Effects of Global Headwinds with Shipment Volumes Expected to Decline 8.2% …
Cadence Revolutionizes System Design with Optimality Explorer for AI-Driven Optimization of Electronic…
Ansys Significantly Increases Speed and Capacity of Semiconductor Signoff with Massively Scalable SeaScape…
OIF Releases Common Electrical I/O (CEI) 5.0 Implementation Agreement Reinforcing Leadership in Next-Generation…
Keysight Technologies to Highlight Solutions that Accelerate Embedded Designs at embedded world 2022…
Mouser Electronics Named Molex Americas e-Catalog Distributor of the Year for Third Consecutive Year
Mouser Named 2021 RECOM High Service Distributor of the Year
Real Intent Extends Meridian RDC’s Low Noise Reporting & Debug Technology Leadership
GBT is Researching the Development of a Unified, Machine Learning-driven, Automated IC Design Enviro…
Interview with Simon Pereira, Lead Product Manager, Scala Computing
Cadence’s John Wall and Richard Gu to Present at Berenberg Conference in London
Cadence’s John Wall and Richard Gu to Present at Nasdaq Investor Conference in London
Altair To Present at Upcoming Investor Conferences
SiPearl Collaborates with NVIDIA on Enabling Accelerated Computing Solutions with European Microproc…
Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports
"Open Source EDA, IP, Cloud-Based Design, Extending Moore’s Law: Pedestal Research’s Laurie Balch…
"War impact on EVs; China’s AI chips investments; Meta-Broadcom deal; ORNL’s exaflop computer" by…
Interview with John Chawner, Senior Group Director, CFD Product Management, Cadence
CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and…
Mouser Electronics Recognized As Global Distributor of the Year by Littelfuse for Fifth Consecutive Year
Riviera-PRO Supports OpenCPI for Heterogeneous Embedded Computing of Mission-Critical Applications
OIF Releases New Common Management Interface Specification (CMIS) Implementation Agreement and Launches…
Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with…
Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology
June Conference in Grenoble, France, to Explore Pathways to 6G Applications, Including ‘Internet of…
HP Inc. Reports Fiscal 2022 Second Quarter Results
Intel Editorial: Accelerated Innovations for Sustainable, Open HPC
Nano Dimension’s Q1/22 Revenue Run-Rate Indicates Approximately 300% Growth Expected in Full Year …
SEMI Europe Urges Swift Adoption of European Chips Act
Barry Paterson is the new Agile Analog CEO
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