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Cadence Advances RF Design with the Latest AWR Design Environment Platform
ADLINK Releases CompactPCI® Serial Processor Blade Powered by 9th Gen Intel® Xeon®/Core™ i7 Pro…
New Semiconductor Fabs to Spur Surge in Equipment Spending, SEMI Reports
StarFive Adopts Valtrix STING for Verification of Next-generation RISC-V Processors
Xilinx Brings Breakthrough to Vivado Design Tools with State-of-the-Art Machine-Learning Optimization…
SiFive Performance P550 Core Sets New Standard as Highest Performance RISC-V Processor IP
Alphawave IP Adopts Diakopto's ParagonX™ EDA Platform and Methodology
Intel’s Silicon, Software Accelerate 5G, Edge
Intel Editorial: Intel is Foundational to Unleashing the Possibilities of 5G
Synopsys to Acquire Semiconductor and Flat Panel Display Solutions from BISTel
IAR Systems enables Advantech to innovate smart industrial IoT edge devices
"Intel reportedly interested in SiFive; Google’s AI-based chip floorplanning; TSMC roadmap; acquisitions"…
Silicon Labs and Wirepas Enable IoT for Asset Tracking and Building Automation
SEMI Urges U.S. and European Union Cooperation on Technology and Trade
Siemens announces new JEDEC industry standard for electronics cooling simulation
SEMI Supports Introduction of FABS Act in the U.S. Senate to Spur Semiconductor Manufacturing Growth…
How To Shrink Place and Route Design Cycle by Weeks (Siemens On-Demand Webinar)
Interview with Kent McLeroth, CEO, Zuken
New Cadence Tensilica FloatingPoint DSP Family Delivers Scalable Performance for a Broad Range of Compute-Intensive…
Keysight Partners with 800 Gigabit Ethernet Ecosystem to Demonstrate Physical Design Validation Solu…
Advantest Developing Innovative Methodologies for High-Speed Scan and Software-Based Functional Test…
Synopsys Replenishes Repurchase Authorization up to $500 Million
Mouser Electronics Earns E-Catalog Distributor of the Year Award from Omron Electronic Components
Rambus to Acquire PLDA, Extending Leadership with Cutting-Edge CXL™ and PCI Express® Digital IP
Rambus Advances New Era of Data Center Architecture with CXL™ Memory Interconnect Initiative
Mouser Receives Top High Service Distribution Honors from Vishay
Diakopto Unleashes Breakthrough ParagonX™ EDA Tool, Platform and Methodology to Dramatically Accelerate…
Ansys Multiphysics Solutions Achieve Certification for TSMC's N3 and N4 Process Technologies
NVIDIA Executive Keynote at COMPUTEX 2021
"System-level challenges, machine learning in the spotlight at CadenceLIVE Americas 2021" by Roberto…
AMD CEO Dr. Lisa Su speaks on the future of high-performance computing and technology ecosystems at …
Worldwide Server Market Revenue Grew 12.0% Year Over Year in the First Quarter of 2021, According to…
SEMI Digital Transformation Conference to Help Microelectronics Industry Seize New Market Opportunit…
Independent ASIC design house ICsense sustains continuous growth and invests in ATE platform to support…
The 2021 Symposia on VLSI Technology & Circuits Presents Overview Videos for Virtual Symposia Program…
Synopsys to Speak at Berenberg Thematic Software Days Conference
Creonic to Offer End-to-end IP-over-Satellite Solutions
Cadence’s Anirudh Devgan and John Wall to Present at the 44th Nasdaq Investor Conference
Cadence’s Nimish Modi to Present at Berenberg Conference
COMPUTEX Opening Keynote by Intel – Innovation Unleashed
sureCore & Intrinsic Announce Collaboration to Bring Novel RRAM Technology to Market
AI Hardware Summit: Must-Attend AI Event Releases Agenda Ahead of its Return to Face-to-Face in Silicon…
Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform
"You’re Invited! SEMI’s Innovation for a Transforming World" by Bob Smith, Executive Director
MIPI Alliance Recognizes Members at 8th Annual Awards Ceremony
AndesBoardFarm Enables SoC Designers to Explore RISC-V Processors in Online FPGA Board Collection
Arm CEO Keynote - Sparking the World’s Post-Pandemic Recovery
SEMI Applauds Senate Passage of USICA Semiconductor Funding, Urges House Action
Interview with Jeff DiCorpo, SVP Business Development, Efabless
New Cadence Allegro X Design Platform Revolutionizes System Design
Siemens acquires proFPGA product family from PRO DESIGN to expand industry-leading IC verification p…
Synopsys Acquires Code Dx to Extend Application Security Portfolio
Apple Keynote: Here is what Apple announced at WWDC21
Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI…
MACOM Announces Availability of GaN Design Models to Accelerate Customer Design Cycle Time
OIF Thought Leaders to Provide Updates on Co-Packaging, 400ZR, Electrical Data Rates and Transport SDN…
Autodesk Confirms Proposal to Acquire Altium
"Moore’s Law extension a key theme at the 2021 VLSI Symposia" by Roberto Frazzoli
IEEE International Electron Devices Meeting Announces 2021 Call for Papers
"Accellera and ESD Alliance Co-Host Panel of Experts who Designed and Verified Chips During a Pandemic"…
"The Long Game: Product and Security Assurance" by intel
Dolphin Design joins Arm Approved Design Partner Program
Jacobs, Peachtree Corners, and Qualcomm Collaborate to Deploy Cellular Vehicle-to-Everything Technology…
Arm empowers MCU software developers to capitalize on IoT potential
Siemens enhances Nucleus ReadyStart for Arm platforms with enhanced debug, security and stability fe…
Jim F. Anderson Joins Altair Board of Directors
Cadence’s Anirudh Devgan and John Wall to Present at the Baird 2021 Global Consumer, Technology & …
Synopsys CFO Trac Pham to Speak at Baird Global Consumer, Technology and Services Conference
Altair to Virtually Present at the Berenberg 2021 Design Software Conference
Siemens acquires Nextflow Software to speed simulations with advanced meshless technology
Samtec Joins Altium's Nexar Partner Program
Synopsys Expands Multi-Die Solution Leadership with Industry's Lowest Latency Die-to-Die Controller …
IAR Systems enables powerful innovations based on Raspberry Pi Pico
Silicon Catalyst Launches UK-based Accelerator
Siemens announces EDA milestones and tool certifications for TSMC’s latest process technologies
Aldec Launches HES-DVM Proto ‘Cloud Edition’ - Giving Engineers Easier Access to FPGA-based ASIC…
First Quarter 2021 Global Semiconductor Equipment Billings Increase 51% Year-Over-Year, SEMI Reports…
Keysight Technologies Expands Cellular Vehicle to Everything (C-V2X) Test Solutions Across the Automotive…
EdgeCortix Collaborates With Cadence To Accelerate AI Chip Design
PLDA and AnalogX Announce Market-leading CXL 2.0 Solution featuring Ultra-low Latency and Power
Synopsys DesignWare IP Achieves Broad Industry Adoption with Multiple First-Pass Customer Silicon Successes…
Tachyum Prodigy has Successfully Transitioned to 5 Nanometer Process
RS Components extends features of DesignSpark PCB PRO
"Setting a High Standard for Standards-Based IP" by Anupam Bakshi
Synopsys Named a Leader in the 2021 Gartner Magic Quadrant for Application Security Testing for Fifth…
CEA-Leti Unveils World’s First Autonomous Imager For Smartphones, Smart-Home Appliances and Automo…
"Higher density DRAM alternative; faster simulations; new chip prototyping program" by Roberto Frazz…
SEGGER Introduces Flasher PRO XL — The Almost-Anything-Programmer with Extra-Large Memory
Silicon Labs Expands Isolated Gate Driver Product Family with Si828x Version 2
SEGGER’s emRun Runtime Library Licensed by SiFive for Superior Code Size and Performance Improveme…
congatec to expand its business in Korea
Cadence’s John Wall to Present at Cowen Conference
Future-of-Work Solutions Power Dell Technologies' Record First Quarter Fiscal 2022 Financial Results…
HP Inc. Reports Fiscal 2021 Second Quarter Results
SEGGER’s emRun Runtime Library Licensed by SiFive for Superior Code Size and Performance Improveme…
IAR Systems and Secure Thingz present embedded security compliance solution for Renesas RX
Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development…
Synopsys DesignWare PVT Subsystem Drives Performance, Power and Silicon Lifecycle Management on TSMC's…
Matta Sur Complex in Santiago, Chile, Wins Prestigious International Design Award from ‘Rethinking…
"The ESD Alliance’s Governing Council Chaired by Arm’s Simon Segars; Remote Work, Remote Chip Design:…
"Reinventing Chip Design from the Outside In" by intel
SEMIFIVE collaborates with Arm to accelerate its custom SoC designs
Arm partners are shipping more than 900 Arm-based chips per second based on latest results
North American Semiconductor Equipment Industry Posts April 2021 Billings, Logs Fifth Consecutive Month…
Arm Total Compute solutions bring performance, security and Armv9 to the broadest range of Client de…
Mouser Electronics Examines Power Management in Latest Series From Empowering Innovation Together Program
Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic…
Synopsys Digital and Custom Design Platforms Certified for TSMC's Latest 3nm Process Technology
MacroFab Announces a $15M Series B round led by Edison Partners, Including Strategic Investment from…
OIF Reveals Three Innovative Projects – External Laser Small Form Factor Pluggable Module for Co-Packaged…
Altair Announces Latest Release of Simulation Solutions
Fortify and Rogers Corporation Partner to Develop 3D Printed Dielectric Material Systems for Radio Frequency…
Denali 3.0 Soft ISP for Xilinx Kria K26 SOM Vision AI - Interview with John Omvik, VP of Marketing, …
7th International Conference on Sensors & Electronic Instrumentation Advances (SEIA' 2021)
Synopsys Enables First-Pass Silicon Success for Early Adopters of Next-Generation Armv9 Architecture-based…
Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage,…
Cadence Collaboration With Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile…
Edison Partners Leads $15M Growth Investment in MacroFab
Despite the Global Semiconductor Shortage, the PC Market Continues to Surge with Expected Growth of …
PLDA Announces XpressRICH™ PCI Express® 6.0 Controller IP for Next Generation SoC Designs
Cadence Announces New Low-Power IP for PCI Express 5.0 Specification on TSMC N5 Process
Keysight Technologies Expands Relationship with Ansys to Deliver Wireless Design Workflow Solutions
Cadence Accelerates Cloud Hyperscale Infrastructure with Third-Generation 112G-LR SerDes IP on TSMC’s…
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