Open Menu
Embedded, IP Subscribe

Last 180 days.  Older
Achronix and Mobiveil Announce Partnership to Deliver High-Speed Controller IP and FPGA Engineering Services
Microchip Releases the First IEEE 802.3bt Power over Ethernet to USB Type-C® Power and Data Adapter…
BOXX Introduces AMD Ryzen™ Threadripper™ PRO Workstation
Aspinity Joins STMicroelectronics Partner Program to Deliver Complete AnalogML Solutions for Always-on…
Alpha and Omega Semiconductor Releases Automotive Qualified 1200VαSiC MOSFETs for Electric Vehicle …
Motional Selects Ambarella CVflow® AI Vision Processors for its Driverless Vehicles
IQuAn – Combining High Performance Computing and Quantum Computing
Lattice Sentry Solutions Stack 2.0 Enhances Cyber Resiliency with New Expanded Capabilities
Lattice Expands mVision Solutions Stack Capabilities
Flex Logix And DARPA Expand Partnership With The Addition Of Silicon Proven EFLX eFPGA In 12 And 16 …
Optimized MOSFETs for Industrial Motor Control and Battery Powered Tool Applications
STMicroelectronics Speeds Smart Devices to Market with Extra Software for Microsoft® Azure RTOS Projects…
LDRA Optimizes Functional Safety Software Development with Synopsys ARC Processors
VeriSilicon High-Performance and High-Quality AI Video Processor Powers Leading Datacenters
Frank Riemenschneider joins SEGGER as Marketing and PR Manager
Data I/O Reports Fourth Quarter 2020 Results
STMicroelectronics Reveals Extreme Low-Power STM32U5 Microcontrollers with Advanced Performance and …
Renesas’ Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval…
Kioxia Commences Construction of New Fabrication Facility at Yokkaichi Plant to Support Sixth-Generation…
Toshiba Launches Silicon Carbide MOSFET Module That Contributes to Higher Efficiency and Miniaturization…
Silexica to Co-Present With Xilinx at the ISFPGA Conference 2021
Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
ROHM’s Wi-SUN FAN Module Solution: Empowering the Infrastructure of Smart Cities
NVIDIA Announces Financial Results for Fourth Quarter and Fiscal 2021
Lattice and Future Electronics Collaborate on Virtual Technology Sessions for Machine Learning/AI, Embedded…
IAR Systems introduces 64-bit Arm core support in leading embedded development tools
Micron Launches Low-Power Memory Qualified for Automotive Safety Applications
Renesas and LUPA Accelerate Automotive Smart Camera Development With Open Platform Turnkey Solutions…
Secure Thingz announces significant enhancements to protect critical IoT assets and aid companies in…
Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
Achronix Announces 2020 Financial Results and Business Highlights
Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor
Microchip Announces Space-Qualified COTS-Based Radiation-Hardened Power Converters
MaxLinear and NI Collaborate to Simplify Validation of Wideband Power Amplifiers for 5G Networks
Xilinx Revolutionizes the Modern Data Center with Software-Defined, Hardware Accelerated Alveo SmartNICs…
Alpha and Omega Semiconductor Introduces Application-Specific EZBuck™ Regulator to Power Intel Tiger…
SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing…
Keysight Technologies Acquires Sanjole
Maxim's Precision Measurement ICs Achieve Double Battery Life for IoT, Industrial and Healthcare App…
NexLogic Technologies, Inc. Announces Installation of Finetech FINEPLACER® lambda Sub-Micron Die Bonder…
CEVA Moves to Standardize DSP-enabled Bluetooth® Audio IP with New Bluebud™ Wireless Audio Platform…
Lattice Semiconductor to Highlight Need for Cyber Resilient Systems and Supply Chain Security at Embedded…
Kioxia and Western Digital Announce 6th-Generation 3D Flash Memory
Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications
QuickLogic's Amazon-Qualified Reference Design Brings Alexa to Hearables
Magnachip Enters Full-Scale Mass Production of High Frame Rate OLED DDIC for 5G Smartphones with QHD…
Quantum-Si, a Pioneer in Semiconductor Chip-Based Proteomics, to Combine with HighCape Capital Acquisition…
QuickLogic Reports Fiscal 2020 Fourth Quarter Results
Ultra-Low IQ PMIC from ROHM Selected to Power NXP iMX8M Nano for High Performance Embedded Artists Industrial…
ON Semiconductor Announces New 650V Silicon Carbide MOSFETs
Analog Devices Reports First Quarter Fiscal 2021 Results at the High End of Guidance
Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D …
Maxim Integrated Enables OMRON to Extend its NXR-Series IO-Link Product Line with I/O Hub Solutions …
Tower Semiconductor Reports Double Digit Revenue Growth for the Fourth Quarter of 2020
Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Lattice Semiconductor Reports Fourth Quarter and Full Year 2020 Results
Diodes Incorporated Reports Fourth Quarter and Fiscal 2020 Financial Results
Flex Logix EFLX eFPGA In Design For GLOBALFOUNDRIES 22FDX®
Microchip Delivers Accuracy and Energy-efficiency of Current Monitoring in High-temperature Automotive…
U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate…
Court Dismisses ROHM Semiconductor USA's Lawsuit for Declaratory Judgment of Noninfringement of MaxPower…
Sondrel launching a recruitment drive to find over a hundred engineers
CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
Latest Higher Resolution EVE ICs from Bridgetek Now Designed into High-End Riverdi Displays
New Family of Ethernet Switches Provides the Industry’s Most Complete Time Sensitive Networking Feature…
Pixelworks Reports Fourth Quarter and Full Year 2020 Financial Results
Digi-Key Electronics Announces New Marketplace Distribution Partnership with 2FA/MFA Hardware Authentication…
Nano Dimension to Establish AME ACADEMY with Other Industry Leading Suppliers to Educate Professionals…
Sequans Opens New R&D Facility in Finland
Digitaltest integrates FlashRunner from SMH Technologies into their Flying Probe Tester
ROHM’s New 5th Generation P-Channel MOSFETs Deliver Class-Leading Low ON Resistance
Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge…
QuickLogic Launches Qomu - an Open Source SoC Dev Kit That Fits in Your USB Port
eTopus Technology Announces Innovative SerDes Technology for Data Center, Cloud, Edge, and 5G Base S…
World's First PMOLED TDDI IC Revolutionises Smart Home Appliance Manufacturing with Enhanced "Touch …
Adapdix announces SoftBank funding for next-generation edge AI platform
Renesas Electronics Announces Consolidated Forecasts
Renesas Electronics Reports Financial Results for the Year Ended December 31, 2020
Richardson Electronics, Ltd. Continues Expansion of Power Management Capabilities with SemiQ Third Generation…
Microchip Unveils First Fully Integrated Solution for Vehicle Ethernet Audio Video Bridging (AVB)
Renesas Updates Popular R-Car V3H with Improved Deep Learning Performance for Latest NCAP Requirements…
Key Foundry Offers Gen3 0.18 micron BCD Process Enhanced for Mobile and Automotive Power Semiconduct…
Camtek Announces Record Results For The Fourth Quarter And Full Year Of 2020
Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2020
Alliance Memory Now Offering Micron Parallel and Serial NOR Flash Products
Mobix Labs Receives $10M in New Funding
Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development…
Avnet and ON Semiconductor Accelerate IoT Innovation with New Development Framework
RSL10 Smart Shot Camera from ON Semiconductor Enables Event Triggered Imaging with AI
Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions
UMC Reports Sales for January 2021
Palma Ceia SemiDesign Expands Asia Team, Names Bo Liu Senior Director of Engineering in China
EDGECORTIX partners with PALTEK to bring Edge AI Hardware Acceleration Solutions to Market
Monolithic Power Systems Announces Results for the Fourth Quarter and Year Ended December 31, 2020, and…
Microchip Technology Announces Financial Results for Third Quarter of Fiscal Year 2021
Alpha and Omega Semiconductor Reports Financial Results for the Fiscal Second Quarter of 2021 Ended …
Onto Innovation Reports 2020 Fourth Quarter and Full Year Results
Fornetix and Micron Collaborate to Simplify the Deployment of IoT Services
Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive …
Renesas Expands Data Center Solutions Portfolio with Industry’s First CK440Q-Compliant Clock Generator…
Getting a Good Signal: StratEdge’s High-Performance Power Amplifier Packages on the Red Planet
Xilinx Collaborates with Fujitsu to Support 5G Deployments in the US
Criteria Labs Expands Capabilities, Introduces High Reliability RF Space and Defense Solutions
SMIC Reports 2020 Fourth Quarter Results
High Performance Computing Demand Puts Premium on Backend Engineering Expertise
Qualcomm Earnings Release Available on Company's Investor Relations Website
ROHM SiC MOSFETs Solve Design Challenges for Leading Solar Energy Company Midnite Solar
FormFactor, Inc. Reports 2020 Fourth Quarter Results
Silicon Motion Announces Results for the Period Ended December 31, 2020
MaxLinear, Inc. Announces Fourth Quarter 2020 Financial Results
SmartDV 2020 Revenue Increases by 51%
Renesas Expands Low-Power Industrial and IoT Applications Reach With New RA4M2 MCU Group in Arm Cortex-Based…
SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding…
Allegro MicroSystems Announces Results for the Third Fiscal Quarter Ended December 25, 2020
Power Integrations Reports Fourth-Quarter and Full-Year Financial Results
JEDEC Wide Bandgap Power Semiconductor Committee Publishes its First Guideline for Silicon Carbide (SiC)…
Maxim Integrated Unveils Industry's First Data Acquisition System to Achieve ASIL-D Compliance for Voltage,…
Microchip Accelerates Machine Learning and Hyperscale Computing Infrastructure with the World’s First…
Renesas Simplifies 5G Networks with Industry’s First IEEE 1588 Synchronization Software in Clear Source…
Alpha and Omega Semiconductor Announces Type-C Power Delivery High Voltage Source Switch
Toshiba Adds New eFuse IC, an Electronic Fuse for Repeated Use That Offers Adjustable Overvoltage Protection…
NXP Semiconductors Reports Fourth Quarter and Full-year 2020 Results
Synapse Design and Flex Logix Tape Out Mutual Customer ASIC on a New Process in Less Than a Year Using…
ON Semiconductor Reports Fourth Quarter and 2020 Annual Results
Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X …
InterDigital Update Guidance for Fourth Quarter 2020
ROHM Expands Miniature PICOLED™ Lineup with Power-Saving Infrared LED for VR/MR/AR Applications
Richardson Electronics, Ltd. Continues Expansion of RF/Microwave with Quantum Microwave
QuickLogic Announces CFO Resignation; Anthony Contos named Interim Chief Accounting Officer
Renesas Expands Inductive Position Sensing Portfolio to Automotive Motor Commutation with IPS2550 Se…
STMicroelectronics Reports Q4 and FY 2020 Financial Results
SiMa.ai Expands Engineering Team With New Design Center in Bengaluru, India
Teradyne Reports Fourth Quarter and Fiscal Year 2020 Results
Xilinx Reports Third Quarter Fiscal Year 2021 Results
Silicon Labs and Edge Impulse Partner to Accelerate Machine Learning Applications
Molex Unveils Major Sensor Innovations in Automotive Active Noise Cancellation to Improve Safety and…
Renesas Adds New Entry-Line RA2E1 MCU Group to RA Family to Address Cost-Sensitive and Space-Constrained…
Teledyne Technologies Reports Fourth Quarter Results
UMC Reports Fourth Quarter 2020 Results
Atlazo Launches the World's First Edge AI System-On-Chip (SoC) for Tiny Devices
TI reports Q4 2020 and 2020 financial results and shareholder returns
Maxim Integrated Reports Results For The Second Quarter Of Fiscal 2021
AMD Reports Fourth Quarter and Full Year 2020 Financial Results
Celera Motion Announces AuraTM Absolute Chip Encoder Series
STMicroelectronics Joins ZETA Alliance to Promote Emerging Long-Range IoT Connectivity Standard
Synaptics Expands Family of AI-enriched, High-Performance Multimedia SoCs for Mainstream Set-Top Boxes,…
Micron Delivers Industry’s First 1α DRAM Technology
Synaptics’ AI SoC for Video, Vision and Voice Wins Best Embedded Processor Award
Pasternack Unveils New Line of Bi-Directional Amplifiers
ROHM Completes Construction of a New Environmentally Friendly Building at its Apollo Chikugo Plant to…
Silanna Semiconductor Powers the Highest Performance Fast Charging AC/DC Power Adapters
VAST Data Unveils Joint Reference Architecture with NVIDIA Designed to Significantly Increase Storage…
EPC Releases Physics-Based Models That Project eGaN® Device Lifetime in New Reliability Report
Renesas Introduces Innovative New “Lab on the Cloud” Environment That Provides Instant Access to…
Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Proces…
Lattice Announces Training Center for Award-Winning FPGAs and Solution Stacks
QuickLogic's Talk on Open Source FPGA Tooling
Renesas Expands RF Portfolio to Cover Complete Signal Chain for Macro Base Stations
MediaTek Launches 6nm Dimensity 1200 Premium 5G SoC with Unrivaled AI and Multimedia for Powerful 5G…
Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs With Latest Arm Cortex-A55 for Improved…
ON Semiconductor Enhances IoT Asset Management with Angle of Arrival (AoA) Location Technology
NXP Unlocks the 6GHz Spectrum with a Wi-Fi 6E Tri-Band Chipset for Access Devices
ROHM's New Faster 125°C Operation Compatible EEPROMs Extend Service Life
Samsung’s Newest 108Mp Mobile Image Sensor with Advanced Features Captures More Details and Produces…
OmniVision and Nextchip Partner on Automotive Viewing Camera Solution, Simultaneously Providing 120dB…
Qualcomm to Acquire NUVIA
Toshiba Introduces 5 New Groups of TXZ+™ Family Advanced Class Microcontrollers That Realize Low Power…
NVIDIA Introduces GeForce RTX 3060, Next Generation of the World’s Most Popular GPU
AMD Announces World’s Best Mobile Processors¹ In CES 2021 Keynote
AMD President and CEO Lisa Su Showcases a Digital-First World at Consumer Technology Association’s…
Orbbec Debuts New 3D Cameras for Wide Range of Uses, Including Pitch Black Environments, at CES 2021…
Maxim Integrated's Automotive-Grade Secure Authenticator for Genuine Parts Enhances Vehicle Safety and…
Silicon Labs and Yeelight Deliver Smart Lighting Compatible with Seamless Setup in the Google Home A…
Teradyne and Syntiant Collaborate to Significantly Shorten Time to Market for Innovative Artificial …
Microchip Releases Industry’s First 24G SAS/PCIe Gen 4 Tri-mode Storage Controllers into Producti…
Samsung Sets New Standard for Flagship Mobile Processors With Exynos 2100
Renesas Collaborates With Microsoft to Accelerate Connected Vehicle Development
CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro…
GigaIO Collaborates with Microchip to Power Industry’s Only Native PCI Express Network Fabric for …
Syntiant Surpasses Milestone of 10 Million Processors Shipped
Increase the Runtime of Space-Constrained Wearable and IoT Applications with Industry's Smallest Solar…
DMS leaders join forces as OmniVision and Seeing Machines formally collaborate
Sequans and e-peas Demonstrate Energy Harvesting LTE-M/NB-IoT Connectivity Solution
Silexica's New SLX FPGA 2020.4 Ushers in a New Level of Usability
Ambarella Introduces CV5 High Performance AI Vision Processor for Single 8K and Multi-Imager AI Came…
NIO Partners with NVIDIA to Develop a New Generation of Automated Driving Electric Vehicles
ChipMOS REPORTS 20.1% YoY INCREASE IN DECEMBER 2020 REVENUE; 13.3% YoY INCREASE IN 4Q20 REVENUE; 13.1%…
UMC Reports Sales for December 2020
SMIC Announces Fourth Quarter 2020 Webcast Conference Call
MaxLinear’s New WAV664 Wi-Fi SoC Selected for Wi-Fi Alliance® Wi-Fi 6E Certification Test Bed
Aehr Test Systems Reports Second Quarter Fiscal 2021 Financial Results
Micron Technology, Inc. Reports Results for the First Quarter of Fiscal 2021
Achronix to List on Nasdaq Through Merger With ACE Convergence
TI revolutionizes EV battery management with the industry's best-performing wireless BMS solution, the…
The Zephyr Project Leverages New Member Tools to Improve Automation on the Road to Safety Certificat…
NI Reports Preliminary Financial Results for Q4 2020
Renesas Unveils Industry’s First 60W Wireless Power Receiver IC
Renesas and Sequans Expand Their 5G Collaboration
Richardson Electronics Reports Second Quarter Fiscal 2021 Net Income and Declares Quarterly Cash Div…
Two New Gen 3 PXI Express (PXIe) Chassis from Pickering Interfaces Ensure Maximum PXI Application Fl…
Molex Releases Results of Global Automotive Survey on the 'Car of the Future'
Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications…
OmniVision Announces Best in Class 4MP, 2 Micron Image Sensor for IoT Security Cameras With Nyxel® …
IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors
Pasternack Unveils New Line of Bi-Directional Amplifiers
STMicroelectronics Boosts IoT Design Productivity with First STM32 Wireless Microcontroller Module
OmniVision Brings 32MP Resolution to Selfie Cameras in Compact 1/3” Optical Format With New 0.7 Micron…
CEVA and DARPA Establish Partnership for Technology Innovation
Tower Semiconductor Announces Program Creating an Integrated-Laser-on-Silicon Photonics Foundry Proc…
Teledyne to Acquire FLIR Systems
Teledyne Announces Improved Preliminary Fourth Quarter and Full Year Results
NANO DIMENSION CLOSES $250 MILLION REGISTERED DIRECT OFFERING
Tachyum Closes Milestone Year for Development of Prodigy Universal Processor
Alpine Optoelectronics Produces 400G PAM4 nCP4™ SiPho Optical Engine on Tower Semiconductor Techn…
Foundry Revenue Expected to Reach New High in 2021 with Close to 6% YoY Growth as Capacities Remain …
IPValue Management Licenses Patent Portfolio to NVIDIA
RT-Thread IoT OS Joins STMicroelectronics Partner Program to Deliver One-Stop & Free-to-Use IDE RT-Thread…
Heilind Electronics Introduces WAGO's PCB Terminal Blocks for Power Applications
France awards Soitec-led European consortium for semiconductor innovation
Silanna Semiconductor Delivers Highest Power Density 30W USB-PD Charger Design at Reduced BoM Costs
Tower Semiconductor and GMEMS Announce the Ramp to Mass Production of MEMS Microphones Products
Lattice Low Power FPGAs Inspire Innovative Development Boards from Open Source Community
Silicon Labs Drives IoT Industry Forward in 2020
ROHM Introduces New EMARMOUR(TM) Two-Channel, High-Speed Op Amp
Latest Release of Lattice sensAI Solutions Stack Delivers up to 6X Performance Boost on Award-Winning…
Molex Acquires Fiberguide Industries to Extend Optical Fiber Industry Leadership and Drive Delivery …
MagnaChip Introduces First Power Management IC for Laptops with UHD Display Panels
Renesas Accelerates ADAS and Automated Driving Development with Best-in-Class R-Car V3U ASIL D System…
VisIC unveils new 8mOhm power switch for EV Inverters
Renesas and FAW Establish Joint Laboratory to Accelerate Development of Next-Generation Smart Vehicles…
VisIC unveils new 8mOhm power switch for EV Inverters
QuantalRF secures CHF17M / $19M Series B funding to develop and commercialize disruptive RF front-end…
Semiconductor Equipment Consensus Forecast - Record Growth Ahead, SEMI Reports
Primarius Will Present an Invited Paper on Spec-Driven Extraction Flow and Exhibit at IEDM 2020
Data I/O Announces Support for NXP EdgeLock™ SE050 on SentriX Product Creator Software Tool Suite
Alpha and Omega Semiconductor Announces New High SOA MOSFETs for 48V Hot Swap Telecom Applications
Eta Compute Closes $12.5 Million Series C Funding Led By Synaptics
MaxLinear Transceiver Chipset Enables MTI’s 5G Open RAN Radio Platform
Renesas Expands ZMOD4410 Indoor Air Quality Family With Industry’s First IP67 Waterproof Sensor for…
SiTime Continues Leadership in MEMS Timing Market with 2 Billion Units Shipped
Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time
Tower Semiconductor and OPIX Announce the Successful Development of a World Class iToF Technology Platform…
UAES and ROHM Hold Opening Ceremony for a Joint Laboratory on SiC Technology
Omni Design Augments Partnership to Accelerate Product Development
Hyundai Mobis to Develop Automotive Semiconductors by Acquisition of Hyundai Autron's Division
Packetcraft's Bluetooth LE Audio Solution Supports the Nordic Semiconductor nRF5340 Wireless SoC
FormFactor and T.I.P.S. Partner to Deliver Test Solutions for Power Semiconductor Devices
OPENEDGES Signs Semiconductor Design IP License Agreement With Top-Tier Global Semiconductor Company…
Navitas Wins Prestigious "Semiconductor Design Innovation Excellence Award" at SemiExpo 2020
BISTel Announces BISTelligence Japan 2020
Broadcom Inc. Announces Fourth Quarter and Fiscal Year 2020 Financial Results and Quarterly Dividend…
Lattice Diamond Software Tool Delivers New Enhancements for FPGA Design, Simulation, and Verificatio…
Lattice Propel Accelerates Time-to-Market for Embedded Processor-based Designs on Latest Nexus Platform…
SigmaTron International, Inc. Reports Second Quarter Financial Results for Fiscal 2021
Automotive-Compliant USB Type-C Port Protector from Diodes Incorporated Offers Overvoltage and Short…
STMicroelectronics Teams with Microsoft® to Boost Development of Smart, Connected Devices Leveraging…
Renesas Strengthens IP License Portfolio with IP Utilities to Facilitate Device Development
New Inventec FPGA SmartNIC C5020X Offers Next-Generation Customization Solutions
Advantest Debuts Two New Advantest Cloud Solutions to Boost Production Efficiencies for New IC Desig…
Toshiba Launches 5A 2ch H-Bridge Motor Drivers for Automotive Applications
Pixelworks Announces Proposed Public Offering of Common Stock
BrainChip Chief Development Officer Presents at the Edge AI and Vision Alliance Spotlight Webinar
SmartDV Announces New Line of Design IP Controllers for High-Speed Communications
Silexica Launches First Commercially Available High-Level Synthesis (HLS) Plugin
STMicroelectronics Announces Mass-Market Availability of STM32WL LoRa®-Compatible Wireless System-on-Chip…
Xsight Labs Announces Sampling of Industry’s First 25.6T Data Center Switch with 100G SerDes
Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications…
emotion3D and Ambarella Collaborate on AI-Based Edge Camera Systems for Driver and Occupant Monitori…
Advantest Announces New Module to Enhance T2000 Platform’s Testing of D-PHY and C-PHY Imaging ICs …
Lattice Launches 2nd Generation Security Solution with New Mach-NX FPGA for Next Generation, Cyber-Resilient…
Tachyum Opens Pre-Orders for Prodigy Prototype FPGA Emulation Systems
Marvell and Analog Devices Announce 5G Massive MIMO Radio Unit Solutions
Marvell Expands 5G Technology Leadership with End-to-End Open RAN and Virtualized RAN Platform Solut…
Marvell Introduces Carrier-Optimized Ethernet Access and Edge Switches
Pickering Interfaces announces Partner Program with System Integrators to collaboratively optimize customer…
UMC Reports Sales for November 2020
C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors
ON Semiconductor Names Hassane El-Khoury as Next CEO
Laird Connectivity Announces New Bluetooth 5.2 Module for Advanced Applications Requiring High Performance…
Menta and Andes Announce Partnership Enabling Hardware Reconfiguring for ISA Extension
OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFP…
Magewell Ships New AV-over-IP and Live Streaming Decoders with SDI Outputs
Advantest Launches Two New General-Purpose Hardware Units Compatible with T2000 Air-Cooled Test Plat…
Global Semiconductor Alliance (GSA) Announces its 2020 Award Recipients
intoPIX Delivers Its New Full Stack of TICO-RAW Solutions Improving RAW Image Workflows and Camera D…
Marvell Technology Group Ltd. Reports Third Quarter of Fiscal Year 2021 Financial Results
Rogers Corporation Appoints Megan Faust and Keith Larson to its Board of Directors
proteanTecs to Host Live Webinar on SoC Quality and Time-to-Revenue
Richardson Electronics Announces Availability of UnitedSiC’s New Generation 4 SiC FETs
Imperas Simulator Supports Andes Custom Extension™ to Accelerate Software Development in Domain Specific…
MagnaChip Launches New High-Voltage 700V/800V Super Junction MOSFETs
Broadcom Delivers 7nm 8x100G PAM4 PHYs for Hyperscale Data Center and AI Networks
Renesas Highlights Optical Communications for Datacom and Telecom at the European Conference on Optical…
BrainChip Confirms Completion of the Akida™ Production Design
High-Performance AMD EPYC™ CPUs and Radeon™ Pro GPUs Power New AWS Instance for Graphics Optimized…
Broadcom Breaks New Ground with Trident SmartToR, Converging Switching, Routing, and L4-L7 Services
Broadcom Expands Tomahawk 4 Family, Increasing Leadership in the World’s Highest Bandwidth Switch/Routing…
Renesas RA Family Adds Ultra-Low Power RA2L1 MCU Group with Advanced Capacitive Touch Sensing for Cost-Effective,…
Ayar Labs Demonstrates First Ultra-Dense Optical Interconnect Solution on GLOBALFOUNDRIES’ Next Generation…
Transphorm’s SuperGaN Gen V FET Delivers World’s Lowest Packaged On-resistance, Targeting Electric…
Faster, smaller and more accurate Edge AI using Deeplite and Andes Technology software + hardware
New Orbotech Flex PCB Manufacturing Solutions Enable Future Generations of Advanced Electronics
Broadcom Unveils the Industry’s First Open AIOps Platform Delivering a New Level of Full-Stack Observability…
NVIDIA Debuts GeForce RTX 3060 Family for the Holidays
Micron Updates First Quarter Fiscal 2021 Guidance
MaxLinear Announces Three New High-Current DC/DC Power Modules that Simplify FPGA, DSP and SoC Power…
Renesas’ Intersil Brand 14-Bit, 1-MSPS ADC Delivers Best-in-Class Radiation-Hardened Performance for…
Xilinx Acquires Assets of Falcon Computing Solutions to Advance Software Programmability and Expand …
Semiconlight, a company with original technology for silver free-flip chip LED, signed a flip chip patent…
ROHM Announces New VCSEL Module Technology, Increasing the Output of Spatial Recognition and Ranging…
Nordic Semiconductor expands into Wi-Fi by acquiring the entire Wi-Fi development team, core Wi-Fi expertise,…
NexOptic Joins Arm AI Partner Program
Broadcom Debuts Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure
STMicroelectronics and Advantest Collaborate on Advanced Automated Test Cell for IC Testing
Diodes Incorporated Completes Acquisition of Lite-On Semiconductor Corporation
Veritone aiWARE Now Supports NVIDIA CUDA for GPU-based AI and Machine Learning
Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC
Richardson Electronics Delivers Power Conversion Solutions with Tamura Current Sensors and Gate Driv…
Elektrobit unveils industry-first software platform for next-gen vehicle electronics architectures
Analog Devices Reports Fourth Quarter Results Above the High-End of Outlook
Maxim Integrated Appoints Yu-A Sophie Han as Country Manager and Managing Director of Maxim Korea
Ambarella, Inc. Announces Third Quarter Fiscal Year 2021 Financial Results
Lattice Expands Radiant Software Tool Capabilities
Coventor and CMC Microsystems expand collaboration to further enable innovation in semiconductor and…
The collaborative project BELICIM aims to strengthen the French medical industry through ASIC techno…
AMI and Lattice Semiconductor Announce Joint Platform Firmware Resiliency Security Solution: AMI PlatFire…
Marvell Expands Borderless Enterprise Portfolio with Industry-Leading Octal Scalable mGig PHY Family…
ENSTA Bretagne selects IC’Alps for implementation of an Embedded Field-Programmable Gate Arrays (eFPGA)…
NVIDIA Announces Financial Results for Third Quarter Fiscal 2021
SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform…
Maxim Integrated Announces Industry's First Li+ Fuel Gauge IC Featuring Continuous Internal Self-Discharge…
Octonion Releases Expansion Package Dedicated to AI-Based Industrial Condition Monitoring on STMicroelectronics…
Microchip Delivers First 8-bit MCU Family for CAN FD Networks
Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
EMA Design Automation Expands Operations in North America
Arteris® IP Achieves Major Company Milestone: 150th Licensee
Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastruc…
Alpha Data Announces Xilinx Versal ACAP Accelerator Board
BittWare Launches IA-840F with Intel® Agilex™ FPGA and Support for oneAPI™ Unified Software Programming…
STMicroelectronics Simplifies Creation of Alexa Built-In Smart Home Devices with Amazon-Qualified Reference…
Lumissil introduces a Family of Industry-Leading Capacitive-Touch Sense Controllers
ROHM Introduces New High Side Switch ICs with User-Definable Protection Achieve Optimized Performance…
Pasternack Introduces New Highly Flexible VNA Cables Supporting Frequencies up to 70 GHz
Micron Solutions, Inc. Reports 2020 Third Quarter Results
Extend the Battery Life of Your Vehicle Tracker/Asset Tracker/IoT Device 10-Fold with Maxim Integrated's…
NVIDIA DGX Station A100 Offers Researchers AI Data-Center-in-a-Box
NVIDIA Announces Mellanox InfiniBand for Exascale AI Supercomputing
NVIDIA Doubles Down: Announces A100 80GB GPU, Supercharging World’s Most Powerful GPU for AI Super…
AMD EPYC™ Processors and New AMD Instinct™ MI100 Accelerator Redefine Performance for HPC and Scientific…
AMD Announces World’s Fastest HPC Accelerator for Scientific Research¹
VisIC and AB Mikroelektronik Collaborate on Battery Development for Electric Drive Systems
Alpha and Omega Semiconductor Announces Appointment of President and Retirement of Chief Operating O…
CAST Releases MIPI I3C Basic Slave Controller IP Core
ADLINK's COM Express Module to Support AMD Ryzen Octa-core V2000 APU
Richardson Electronics Announces New SiC Schottky Diodes from UnitedSiC
Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs
More Power, Less Space: New ABB DecaDLynx II Voltage Regulator Among Industry Leaders in Power Densi…
Renesas and Altran Team to Deploy First Social Distancing Wristwatch that uses Ultra-Wideband Chipset…
Semtech and Symmetry Electronics Collaborate to Focus on Pro AV Customers
Tower Semiconductor Reports Third Quarter 2020 Results and Guides Fourth Quarter Significant Revenue…
Renesas Launches New “Sustainability at Renesas” Website
Faraday’s 22nm Fundamental IP Adopted for Intelligent IoT Devices
Flash Memory Summit Announces 2020 Best of Show Award Winners
Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group
New Reverse Engineering Service Helps Chip Makers Remain Competitive and Monitors Patent Infringemen…
Pinnacle Imaging Systems™ Announces Denali™ 3.0 ISP
Renesas Introduces Scalable AI SMARC SoM Winning Combination Solution for Accelerating Time to Market…
CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
SMIC Reports 2020 Third Quarter Results
Efinix® Announces Trion® Titanium Tapeout at TSMC 16 nm Process Node
Apple Unleashes M1
MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones
Kameleon Security and Xilinx Collaborate on New Cybersecurity Solution for Servers, Cloud Computing …
Bidirectional Level Translator from Diodes Incorporated Connects SD 3.0 Memory with Low-Voltage Processing…
Industry's Smallest Quad-Output SIMO Power Management IC by Maxim Integrated Achieves 85 Percent Higher…
STMicroelectronics Collaborates with Qualcomm Technologies on Unique Sensor Solutions for Next-Gen Mobile,…
AMD Unveils AMD Ryzen™ Embedded V2000 Processors with Enhanced Performance and Power Efficiency
Microchip Extends Leadership in Data Center Connectivity with Industry’s Lowest Latency PCI Express®…
Broadcom Announces World’s First Automotive IEEE 802.3ch Multigigabit PHYs and Multilayer Switches with…
ON Semiconductor and Theta Power Systems International Establish Collaboration for Motor Control App…
Alpha and Omega Semiconductor Releases Fast Switching 600V αMOS5™ Super Junction MOSFETs in SMD-type…
inTEST Reports 2020 Third Quarter Financial Results
ChipMOS REPORTS THIRD QUARTER 2020 RESULTS
New Automotive Primary DC/DC Converters Offer Stable Output, Even with Fluctuating Input Voltage
Micron Ships World’s First 176-Layer NAND, Delivering A Breakthrough in Flash Memory Performance and…
Diodes Incorporated Reports Third Quarter 2020 Financial Results
Motor Development Kit from ON Semiconductor Prioritizes Energy Efficiency
SiPM dToF LiDAR Platform from ON Semiconductor Provides Ready-to-Use Design for Industrial Range Finding…
TI introduces industry's first automotive GaN FET with integrated driver, protection and active power…
UMC Reports Sales for October 2020
Lattice Highlights Low Power Certus-NX FPGAs and Participates in Autonomous Vehicle Panel in Upcoming…
eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications…
Microchip Technology Announces CEO Transition
Microchip Technology Announces Financial Results for Second Quarter of Fiscal Year 2021
Alpha and Omega Semiconductor Reports Financial Results for the Fiscal First Quarter of 2021 Ended September…
MACOM Reports Fiscal Fourth Quarter and Fiscal Year 2020 Financial Results
MaxLinear, Inc. Announces Third Quarter 2020 Financial Results
Richardson Electronics Strengthens RF Offering with Masach Tech™ EMI/RFI Shields
2020 Global Semiconductor Alliance Award Nominees Announced
Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI…
STMicroelectronics Unveils World’s Fastest 50W Qi Wireless-Charging IC
BOXX Introduces Workstation Featuring New AMD Ryzen™ 5000 Desktop Processors
CEVA, Inc. Announces Third Quarter 2020 Financial Results
Mitsubishi Electric to Launch 4-terminal N-series 1200V SIC-MOSFETs
QuickLogic Reports Fiscal 2020 Third Quarter Results
Qorvo® Announces Fiscal 2021 Second Quarter Financial Results
Maxim Integrated's Automotive Sequential LED Lighting IC Cuts Size in Half and Reduces Cost by 25 Pe…
New Wave Design and Verification Appoints New President
55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile…
Spectra7 Sets Sights on 56Gbps PAM4 Server Connectivity with Three New Reference Designs
Rambus Reports Third Quarter 2020 Financial Results
Allegro MicroSystems Announces Closing of Initial Public Offering and Exercise in Full of the Underwriters’…
Movellus Joins GLOBALFOUNDRIES Ecosystem Program, as Partner Providing Application-Optimized PLLs, DLLs,…
GLOBALFOUNDRIES Global Technology Conference 2020 China to Spotlight Innovations Accelerating the Digital…
Ambarella Introduces CV28M SoC With CVflow® to Enable New Categories of Intelligent Sensing Devices…
M2I Corporation Selects Avalanche Technology's Persistent-SRAM for Industrial Automation Human Machine…
ON Semiconductor Reports Third Quarter 2020 Results
UnitedSiC Expands Schottky Diode Portfolio
MagnaChip Reports Results for Third Quarter 2020
Monolithic Power Systems Announces Results for the Third Quarter Ended September 30, 2020
Pixelworks Reports Third Quarter 2020 Financial Results
Data I/O Reports Third Quarter 2020 Results
Power Integrations Reports Third-Quarter Financial Results
Omron releases new E3AS-HL Series CMOS photoelectric sensors with small spot or line beam sensing va…
Single-Gate Logic Devices from Diodes Incorporated Target Automotive Applications Including Infotainment…
intoPIX Releases a New Range of 8K TICO-XS IP-cores Supporting The JPEG XS Standard
GLOBALFOUNDRIES Global Technology Conference 2020 Asia to Spotlight Innovations Accelerating the Digital…
Realtek Semiconductor Selects Allegro DVT’s H.266/VVC Compliance Streams
Marvell to Acquire Inphi - Accelerating Growth and Leadership in Cloud and 5G Infrastructure
UMC Reports Third Quarter 2020 Results
Advantest to Sponsor and Participate in Virtual International Test Conference (ITC) Taking Place November…
Renesas Electronics Reports Financial Results for the Third Quarter Ended September 30, 2020
UMC and US Department of Justice reach Plea Agreement on Trade Secret Case
Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Proces…
AMD Unveils Next-Generation PC Gaming with AMD Radeon™ RX 6000 Series – Bringing Leadership 4K Resolution…
SparkFun Electronics Unveils New Point-and-Click Board Design App
QuickLogic Joins Samsung SAFE™ IP Partner Program
QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process
Microchip Releases Newest Generation of AEC-Q101 Qualified 700 and 1200V Silicon Carbide (SiC) Schottky…
SiTime Enters the $2B Precision Resonator Market with Third-Generation MEMS
Renesas Extends RA MCU Family with RA6T1 MCU Group for Motor Control and AI-based Endpoint Predictive…
Data I/O Simplifies IoT Security with the Release of Next Generation SentriX® Security Deployment as-a-Service…
Silicon Labs Announces Third Quarter 2020 Results
Tower Semiconductor to Present at SPI Forum Hosted by Semicon Portal Showcasing its Broad Range of Market-Leading…
STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric…
Power Integrations’ New MinE-CAP IC Reduces Volume of AC-DC Converters by Up to 40%
Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps
Maxim Integrated Reports Results For The First Quarter Of Fiscal 2021
Lattice Semiconductor Reports Third Quarter 2020 Results
STMicroelectronics Introduces World’s First All-in-One, Multi-Zone, Direct Time-of-Flight Module
Maxim Integrated's IO-Link Communications Technology Reduces Factory Downtime
Renesas Shifts Mobility System Development Into High Gear With Its New Online Market Place for R-Car…
Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments
Tachyum Sends Prodigy Chip FPGA Emulation Prototype to Manufacturing
Camtek Announces Results For The Third Quarter Of 2020
AMD Reports Third Quarter 2020 Financial Results
Ultra Low Power RGBW LED Driver with Color Crossfade and Automated Sequences
NXP Semiconductors Reports Third Quarter 2020 Results
Power Integrations Demonstrates Continued Industry Leadership as InnoSwitch IC Sales Surpass One Billion…
Amkor Technology Reports Financial Results for the Third Quarter 2020 and the Initiation of a Quarterly…
EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
InPlay Launches World's Smallest and Software-programming-free Bluetooth Low Energy SoC
STMicroelectronics and Sanken Announce Strategic Partnership to Develop Intelligent Power Modules for…
Imec begins developing SARS-CoV-2 test to identify positive cases and confirm whether someone is contagious…
New Semiconductor Chip from NS Nanotech Emits Far-UVC Disinfectant Ultraviolet Light to Neutralize C…
SmartDV Appoints Karthik Gopal as Asia General Manager
Heavy AC or DC load switching modules from Pickering Interfaces occupy one single PXI slot
ventureLAB Partners with Arm to Broaden Canada’s Hardware Catalyst Initiative
Digi-Key Electronics Participating in IoT Now Webinar for eSIM in IoT
POET and Sanan IC Sign Definitive Agreement to Form Joint Venture Company
Renesas and Sequans to Collaborate on 5G/4G Cellular IoT
STMicroelectronics Reports 2020 Third Quarter Financial Results
Applied Materials and BE Semiconductor Industries to Accelerate Chip Integration Technology for the …
Toshiba Launches Dual H-bridge Motor Driver IC With PWM Control for Mobile Devices and Home Applian…
Xilinx Reports Second Quarter Fiscal Year 2021 Results
SparkFun Releases MicroMod, a New Microcontroller Ecosystem to Enable Rapid Prototyping and Modular …
NVIDIA Smashes Performance Records on AI Inference
Allegro MicroSystems Announces Launch of Initial Public Offering
Silicon Labs and Teledyne e2v HiRel Partner on High Reliability Isolation
Industry's first low-noise buck converters with integrated ferrite-bead compensation simplify high-precision…
First Multi-Zone Time-of-Flight Sensor Headlines STMicroelectronics Technology Powering Samsung Flagship…
Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire® FPGA-based…
Renesas Unveils Industry’s Highest Performance 80V Bidirectional Buck-Boost and Dual-Phase Buck DC/DC…
Socionext Issues Comprehensive New Application Note Highlighting RADAR for Optimized Sensing Accuracy…
Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row
Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry
TI reports third quarter 2020 financial results and shareholder returns
Teradyne Reports Third Quarter 2020 Results
Foretellix Releases the World's First ALKS Regulation Verification Package for Automated Driving Sys…
VisIC Technologies raises Series E to support growing EV market
SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
Percepio Releases Tracealyzer Visual Trace Diagnostics Solution Version 4.4 with Support for Embedded…
Virtual Flash Memory Summit 2020 Spotlights Leading Storage Startups
Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip
STMicroelectronics Unveils Features of Multi-Application, Deterministic Automotive Microcontrollers…
Microchip Announces Microcontrollers that Solve Tough Analog System Design Challenges
Tachyum Prodigy Hits Milestone With 96 Percent of Silicon Designed
Cyient Collaborates with SR University to Help Advance the Field of Additive Manufacturing
New XGS CMOS Image Sensors Enhance ON Semiconductor Offerings for High-Resolution Industrial Imaging…
NXP Announces Expansion of its Scalable Machine Learning Portfolio and Capabilities 
Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX…
Toshiba Launches 1200V Silicon Carbide MOSFET That Contributes to High-efficiency Power Supply
Foretellix Releases the World's First ALKS Regulation Verification Package for Automated Driving Sys…
AMD to Report Fiscal Third Quarter 2020 Financial Results
STMicroelectronics Acquires Power Amplifier and RF Front-End-Module Specialist SOMOS Semiconductor
Industry’s First Automotive-Compliant 40V Dual MOSFET in 3.3mm x 3.3mm Package Introduced by Diodes…
GREENWAVES TECHNOLOGIES Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX…
AMD EPYC™ Processors Offer 30 Percent Better Performance on Data Analytics Workloads to Microsoft …
Renesas Releases 2nd Generation Digital Multiphase Controllers and Smart Power Stages for IoT Infrastructure…
Lantronix Brings Advanced AI and Machine Learning to Smart Cameras With New Open-Q 610 µSOM Based on…
China's chipmaking giant SMIC's N+1 process makes tape-out breakthrough
RS Components introduces SiC MOSFETs from ON Semiconductor ready to meet future efficiency and power…
OnePlus Extends Display Differentiation in Smartphone Lineup with Pixelworks Technology in the OnePlus…
Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
Pre-Registration Opens for 2020 Flash Memory Summit
Maxim Integrated's Automotive Buck-Boost Controller Enables Automotive USB Power Delivery Ports with…
Microchip Technology Introduces Its First Trust&GO Wi-Fi® 32-bit MCU Module with Advanced Peripheral…
Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
Renesas Announces Buck-Boost DC/DC Converter With Ultra-Low Quiescent Current for Powering Sensors, …
OmniVision Unveils World’s First 1.0 Micron 64MP Image Sensor With Large Optical Format for Best Low…
RS Components and Allied Electronics & Automation sponsor International Women’s Forum to highlight…
intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU Platforms to Speed up JPEG XS Workflows
Power Integrations to Release Third-Quarter Financial Results on October 29
Lattice Semiconductor Schedules Third Quarter 2020 Results Conference Call
CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core
NXP Semiconductors Updates View of Third Quarter 2020 Performance and Sets Date to Review Detailed …
Analog Devices and Maxim Integrated Shareholders Approve Combination
Lattice to Highlight Need for Hardware Security and Dynamic Trust in End-to-End Supply Chain at Linley…
AMD Launches AMD Ryzen 5000 Series Desktop Processors: The Fastest Gaming CPUs in the World
Instrumentation Technology Systems Adds intoPIX TICO-XS to their Upcoming NetVIDxs Products
ChipMOS REPORTS SEPTEMBER 2020 AND 3Q20 REVENUE, REPRESENTING A QUARTERLY SIX YEAR HIGH
UMC Reports Sales for September 2020
Foretellix Acquires Metamoto to Accelerate Development of its Simulator-Agnostic Scalable Verification…
Richardson Electronics Reports First Quarter Fiscal 2021 Results and Declares Quarterly Cash Dividen…
ON Semiconductor Introduces High-Performance CMOS Global Shutter Image Sensor for Machine Vision and…
Maxim Integrated's Neural Network Accelerator Chip Enables IoT Artificial Intelligence in Battery-Powered…
Marvell Unveils Industry's 1st Automotive Gigabit Ethernet PHY with MACsec Security
New single-pair Ethernet PHY extends reach of factory and building automation applications
Microchip Revs Up Motor Control Support with New Devices and an Expanded Design Ecosystem
LDRA First to Support Arm-Based Chips for Safety-Critical Aerospace and Automotive Applications
SmartDV Unveils SmartConf Testbench Generator
Marvell Launches Industry's First Native NVMe RAID Accelerator
Microchip Unveils First Low-Power Digital-to-Analog Converter (DAC) that Simplifies Handheld Designs…
Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security…
Eximius Design Joins TSMC Design Center Alliance Program
SK hynix Launches World's First DDR5 DRAM
Synopsys Outreach Foundation Science Project Package Application Period Open
Silexica's SLX FPGA 2020.3 Delivers 2x Performance Improvements for FinTech
NVIDIA Introduces New Family of BlueField DPUs to Bring Breakthrough Networking, Storage and Security…
NVIDIA Unveils Jetson Nano 2GB: The Ultimate AI and Robotics Starter Kit for Students, Educators, Robotics…
Linley Fall Processor Conference Showcases Advanced Innovations in AI Chips and IP
OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions
Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology
Microchip Acquires Tekron International Limited
Intel Wins US Government Advanced Packaging Project
Lattice CrossLink-NX FPGA Wins 2020 Electronics Industry Award
BrainChip Presents on AI in Edge Devices at Linley Fall Processor Conference 2020
Efabless Extends Partnerships for Rapid Development Solution of Custom ICs
IonQ Unveils World's Most Powerful Quantum Computer
STMicroelectronics Announces Third Quarter 2020 Preliminary Revenues and Timing for Third Quarter 2020…
Efinix® Announces Availability of Reconfigurable Acceleration Platform
Allegro DVT Extends Leadership in 8K Video Decoding IP
TigerGraph Highlights Next-Generation Graph and Machine Learning Partnerships at Graph + AI World 20…
High-Voltage Analog Multiplexers from Diodes Incorporated Provide Signal Distribution in Industrial …
Marvell Ships 1 Millionth OCTEON-Powered LiquidIO SmartNIC
STMicroelectronics Pioneers Smaller and Faster Chargers and Power Supplies with World’s First Driver…
AMD EPYC™ Processors Bring Advanced Security Features and High-Performance Capabilities to VMware …
Microchip Expands Solutions for Aerospace and Defense, Industrial and Automotive Applications with New…
Renesas I3C Bus Extension and SPD Hub Devices Qualified for ASPEED AST2600 Baseboard Management Controller…
AI Chipmaker Hailo Launches Top-Performing M.2 and Mini PCIe AI Acceleration Modules to Enhance Performance…
New Arm Technologies Enable Safety-Capable Computing Solutions for an Autonomous Future
Micron Technology, Inc. Reports Results for the Fourth Quarter and Full Year of Fiscal 2020
NXP Advances 5G with New Gallium Nitride Fab in Arizona
Keysight Delivers First 256 GSa/s Arbitrary Waveform Generator With 65 GHz Analog Bandwidth
Marvell Enabling the Next Generation of Data Center and Automotive AI Accelerator ASICs
STMicroelectronics Raises Performance and Value for Smart, Connected Devices with Even Faster STM32H7…
Renesas Introduces Functional Safety Over EtherCAT for 32-Bit RX Microcontrollers
Toshiba Launches Ultra-Low Current Consumption CMOS Operational Amplifier That Contributes to Longer…
Fairview Microwave Debuts New VNA Test Cables with Flex Life Exceeding 100,000 Cycles
Richardson Electronics Now Offering Amogreentech Magnetic Components Globally
Avalanche Technology Introduces Drop-In Replacements for Cypress F-RAM and Everspin MRAM Devices for…
Spectral Design & Test Inc. Announces 3rd Generation 45RFSOI Low Power SRAM Targeted at the 5G Mobile…
The Industry’s First Integrated Zero Cross Detection ICs from ROHM Semiconductor
Aehr Test Systems Reports First Quarter Fiscal 2021 Financial Results and Maintains Financial Guidance…
GLOBALFOUNDRIES and Movano Inc. Partner to Advance Needle-Free Continuous Glucose Monitoring Technol…
GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for…
GLOBALFOUNDRIES Announces Industry-Leading GF SHIELD Program to Further Safeguard Customer Data and …
Richardson Electronics Now Offering General Atomics Electromagnetic Systems High Energy Capacitors for…
28HV Solution Accelerates GLOBALFOUNDRIES Leadership in OLED Display Drivers for Mobile Devices
Renesas Joins the Global Semiconductor Alliance
Mobileye, Geely to Offer Most Robust Driver-Assistance Features
Vidatronic Launches New 22 Nm Analog IP for Ultra-Low-Power, System-on-Chip Physical Attack Mitigation…
Xilinx and Continental Collaborate to Create Auto Industry’s First Production-Ready 4D Imaging Radar…
Diodes Incorporated Receives Approval from China’s Antitrust Authority for Lite-On Semiconductor Acquisition…
Maxim Integrated and Serial Microelectronics Sign Distribution Agreement
Spectral Design & Test Inc. Announces a Family of Rad Hard By Design (RHBD) Memory Compilers in the …
SUBARU Selects ON Semiconductor Image Sensing Technology for its New-Generation EyeSight® Driver Assist…
Mavenir Delivers Industry Leading 5G Core User Plane Function (UPF) with NVIDIA Mellanox SmartNIC Ac…
Advantest Introduces Evolutionary V93000 EXA Scale™ SoC Test System
Arm Accelerates the Next Generation Cloud-to-Edge Infrastructure
Oracle Cloud Infrastructure First to Make NVIDIA A100 GPUs Generally Available in the Cloud
Analog Devices Collaborates with Microsoft to Mass Produce State-of-the-Art 3D Imaging Products and …
SensiML Launches Support for QuickLogic's QuickFeather IoT Development Kit
Maxim Integrated Enables Dynamic Gesture Sensing for Automotive Applications at Industry's Lowest Cost…
AMD Launches First “Zen”-based Chromebook mobile processors for faster web browsing, improved office…
Microchip Introduces No-Cost, License- and Royalty-Free Ensemble Graphics Toolkit to Speed Linux® Graphical…
CEVA Enhances the User Experience and Extends the Use Cases for TWS Earbuds and Hearables with New MotionEngine™…
Silicon Labs and Amazon Collaborate on Sidewalk, a New Shared Network for IoT Consumer Devices
BrainChip Announces India Software Development Center
Sourceability launches its first BOM management tool with ‘one-click’ purchasing
TDK announces worldwide availability of Chirp CH101 ultrasonic ToF sensor platform
BrainChip Confirms Validation of the Akida Neural Processor
Epiq Solutions Introduces Matchstiq™ Z3u, a New Radically Small, Field-Ready, Low Profile Software-Defined…
Digi-Key Electronics to Distribute NI Test and Measurement Products
TigerGraph Unveils Complete Agenda for Graph + AI World 2020, First Open Conference on Accelerating …
SiFive Appoints Patrick Little as President and Chief Executive Officer
Lattice Extends Industry-leading Security and System Control to Automotive Applications
Richardson Electronics, Ltd. Strengthens RF & Microwave, Power Management, and 5G Field Technical Resources…
AMD President and CEO Dr. Lisa Su to Keynote at CES 2021
Maxim Integrated's Essential Analog Transceivers Deliver Reliable Connectivity and Industry's Highest…
InterDigital develops CompressAI platform to accelerate AI-based video compression research and deve…
SensiML Integrates Google's TensorFlow Lite for Microcontrollers
CEVA Partners with Fluent.ai to Offer Multilingual Speech Understanding Solutions for Intelligent Edge…
VVDN Announces 5G IP Software for Xilinx T1 Telco Accelerator Card
Molex Showcases Next-Generation Automotive Electronic Solutions at the Virtual Bordnetz Kongress 202…
Lattice to Deliver Keynote Address at Prestigious FPGA-Conference Europe
Power Integrations Targets Compact Smart-Lighting Designs With Highly Efficient GaN-Powered LYTSwitch-6…
Digi-Key Electronics Announces Global Partnership with Machinechat to Deliver Ready-to-Use IoT Data …
Keysight Unveils Industry’s First Cloud-Native Solution to Test Performance and Security of Hybrid…
MagnaChip Expands its UHD TV BLU LED Driver IC Portfolio
Xilinx Ships Multi-Function Telco Accelerator Card for Growing 5G O-RAN Virtual Baseband Unit Market…
Samsung Expands Advanced 0.7μm-Pixel ISOCELL Image Sensor Offerings for Wider Mobile Applications
Samsung Expands Advanced 0.7μm-Pixel ISOCELL Image Sensor Offerings for Wider Mobile Applications
Mitsubishi Electric to Launch Second-generation Full-SiC Power Modules for Industrial Use
GLOBALFOUNDRIES Goes Virtual with 2020 Global Technology Conference Series
Apollo4 SoC Family from Ambiq Redefines "Ultra-low Power" in Battery-Powered, Intelligent Endpoint IoT…
AMD COVID-19 HPC Fund Adds 18 Institutions and Five Petaflops of Supercomputer Processing Power to Assist…
Building the Future Ecology of AR Chips, Apple and WIMI Hologram's 5G Layout
Micron M29F 5V Parallel NOR Flash Products Now Available Direct From Alliance Memory
Avnet Introduces 96Boards ON Semiconductor Dual Camera Mezzanine for Fast Prototyping
Tower Semiconductor Announces All Manufacturing Sites Operational Following Cyber Event
Broadcom Samples Industry’s Highest-Performing Routing Chip at 14.4 Terabits per Second
Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications
MaxLinear Acquires NanoSemi, Inc.
UCF Consortium Receives Open Source Contribution from Arm to Speed Access to Persistent Memory Stora…
Lattice Shrinks Design Footprint and Cost, Boosts Reliability in Embedded Systems with Single Wire Aggregation…
Qeexo AutoML Enables Machine Learning on Arm Cortex-M0 and Cortex-M0+
Kushagra Vaid Joins Flex Logix's Board of Directors
Silicon Labs Strengthens Industry's Leading Bluetooth Portfolio, Delivering Unmatched Performance & …
Ribbon Introduces Hybrid Slicing for 5G Networks Using Xilinx Virtex Ultrascale+ Technology
Microchip Technology Narrows Financial Guidance for Second Quarter Fiscal 2021
BrainChip Demonstrates Company’s Event-Based AI Neural Processor at Embedded Vision Summit
Renesas Introduces DDR5 Data Buffer for High-Performance Server and Cloud Service Applications
ChipMOS REPORTS AUGUST 2020 REVENUE
UMC Reports Sales for August 2020
Socionext Delivers High-speed, High-quality H.264 Video Encoder Available on Amazon Web Services
Micron Launches Limited Edition Crucial® Ballistix® MAX 5100 Gaming DRAM, Offering the Fastest Speed…
Ouster Lidar Raises $42 Million Series B Funding to Accelerate Digital Lidar Adoption
OmniVision and GEO Semi Launch Automotive Industry’s First Viewing Camera Solution to Simultaneously…
Renesas Expands Wireless Power Portfolio with 15W Wireless Power P9415-R Receiver Featuring WattShare…
MACOM Demonstrates Latest Products at CIOE 2020
Tower Semiconductor Provides an Update on a Cyber Event
Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government's Consideration…
Broadcom Inc. Announces Third Quarter Fiscal Year 2020 Financial Results and Quarterly Dividends
Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States
Rambus and Micron Extend Patent License Agreement
MediaTek Advances its 5G Platform with New T750 5G Chipset for Fixed Wireless Access Routers and Mobile…
Rain Tree Photonics’ 400G-DR4 Silicon Photonic Engine and MaxLinear’s Telluride PAM4 DSP Combine…
Last 180 days.  Older

Featured Video









Submit | More Videos 
Sponsored Videos
Submit | More Videos 
Editorial
Roberto FrazzoliEDACafe Editorial
by Roberto Frazzoli
Concerns over Nvidia-Arm deal; ISSCC innovations; DAC postponed to December
More Editorial  
Latest Blog Posts
IC InsightsIC Insights
by IC Insights
TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
Colin WallsEmbedded Software
by Colin Walls
Variable declarations in C – plenty of pitfalls
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
AUGER: Celebrating Our Users
2021 EDACafe PredictionsEDACafe Editorial
by 2021 EDACafe Predictions
Atmosic Technologies Electronics Design Industry Predictions
More EDA Blogs 
Jobs
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
Business Operations Planner for Global Foundaries at Santa Clara, California
ASIC Engineer for Amazon at seattle, Washington
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
Staff SerDes Applications Design Engineer for Xilinx at San Jose, California
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
Submit Resume | Post Jobs | More Jobs 
Upcoming Events
IPC APEX EXPO 2021 Goes Virtual at - Mar 8 - 12, 2021
ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021
ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021
SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2021 at United States - Apr 13 - 15, 2021
Submit | More Events 
Verific: SystemVerilog & VHDL Parsers



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise