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Last 30 days.  Older
Credo First to Demonstrate 7nm, 112G XSR SerDes
OmniVision's New SoC Provides Entry Level, Thin-Bezel Notebooks With Industry's Best VGA Camera Image…
STMicroelectronics Joins Car Connectivity Consortium
Credo Expands Product Portfolio with Comprehensive 400G MACsec Family
SmartDV Speeds Delivery of its New CXL Verification IP
SmartDV Unveils First Verification IP to Support Ethernet TSN
Keysight Technologies Delivers New Power Supplies
Industry's fastest 12-bit ADC meets the most demanding requirements of tomorrow's test and measurement,…
CAST Expands Popular UDP/IP Networking Cores Line
Teradyne Extends Memory Test Capabilities with New Magnum VU Test System
Keysight’s Americas Laboratories Achieve Highest Level of Accreditation for Calibration Services, …
Pickering Interfaces Highlights Wide Range of PXI RF & Microwave Switch Modules and Modular LXI Chassis…
Silicon Labs and Philips Hue Further Advance Smart Lighting
Qualcomm and EE Bring 5G to the UK with the Launch of the First Commercial 5G Service
MVSILICON License and Deploy CEVA Bluetooth® IP in its latest Wireless Audio Platform
USI Launches Highly Integrated WWAN SOM Module and NB-IoT Communication Module
Minima Processor names Semiconductor Veteran Tuomas Hollman as CEO
NI Introduces mmWave Test Solution to Accelerate the Race to 5G Commercialization
NI Releases the Latest Version of SystemLink™ Software
Single-Stage, High Power Factor LED Driver-Controller from Diodes Incorporated with Mixed-Mode Dimmi…
Redpine Unveils the Industry's Most Advanced, Low Power and Highly Integrated Smart Home Chip at the…
Sanmina and Smiota Partner to Deliver Innovative Smart Locker Solutions to "Secure LASTYARD with TRU…
MediaTek Licenses Patent Portfolio From IPValue Management
Faraday Geared Up for Data Communication Applications in ASIC Development
Innovative Logic USB IP Portfolio Strengthens RISC-V Ecosystem
MediaTek Accelerates Design of Smart Connected Devices With New Rich IoT Program Based on Open Stand…
RADX Announces Trifecta Family of COTS PXIe SSD RAID Modules
Lattice sensAI Delivers 10X Performance Boost for Low Power, Smart IoT Devices at the Edge
Analogix Introduces Its VirtualLink™ Reference Design for High-Performance Gaming Notebooks
Lattice’s New MachX03D FPGA Enhances Security with Hardware Root-of-Trust Capabilities
NI and OPAL-RT Sign Strategic Agreement to Work Together to Advance Electric Vehicle Testing Through…
Kneron Debuts Edge AI Chip, Bringing AI to Devices Everywhere
Agile Analog secures $5M in funding to change the semiconductor industry
Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung
Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank
Tiempo Secure Joins Deutsche Telekom’s nuSIM Partnering Network
Moortec Support Canaan Creatives Mass Production ASIC On TSMC 7nm Process
Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse
Toshiba Memory and Western Digital to Jointly Invest in Flash Manufacturing Facility in Kitakami, Ja…
NVIDIA Announces Financial Results for First Quarter Fiscal 2020
IPValue Subsidiary Licenses Samsung to Patent Portfolio Acquired from Cypress
Micron Memory Sets New DDR4 Overclocking World Record
SmartDV Reduces Protocol Debug Time with Smart ViPDebug
More Than 11.2 Million Vehicles Will Be Equipped with V2X Communications in 2024, IHS Markit Says
MACOM Announces Stephen G. Daly as President and Chief Executive Officer
Micron Solutions, Inc. Reports 2019 First Quarter Results
Microchip Expands Carrier-Grade Time and Synchronization Portfolio to Solve Network Deployment, Reliability…
Introspect Technology Launches Industry-First Dual-Mode MIPI D-PHY/C-PHY Display Module Tester
Nano Dimension Reports 2019 First Quarter Financial Results
TowerJazz Announces First Quarter 2019 Results: Revenues of $310 million, Cash from Operations of $75…
Arm Demonstrates New IoT Test Chip and Board for Highly Efficient, Secure IoT Designs
NXP and Microsoft Demonstrates Edge-to-Cloud Machine Learning Solution for Predictive Maintenance
TSMC April 2019 Revenue Report
Spectrum introduces 16-bit AWGs with 8 channels per card
eSilicon Announces Production Qualification of 5G Infrastructure ASIC
Keysight Technologies Launches Next Generation Integrated Network Analyzers
Advantest Again Earns Distinction as a VLSI 5 Star Company and its 31st Consecutive Appearance on the…
MACOM to Showcase Industry Leading RF and Microwave Portfolio Enabling the Future of 5G at IMS 2019
Molex QSFP-DD BiPass Thermal Cooling Configuration Provides Next- Generation Solutions
USB PD Controller from Diodes Incorporated Supports Standard and Proprietary Protocols for Power Delivery…
SiTime Delivers Timing Products for 5G Radio Synchronization in Global Wireless Network
ON Semiconductor Showcases Automotive CMOS Image Sensors, LiDAR and Radar Solutions at AutoSens 2019…
Reflex Photonics' LightCONEX, the First 150 Gbps 24-lane Rugged Transceiver on the Market, to Power …
Renesas Electronics Reports First Quarter 2019 Financial Results
SMC Korea 2019 this Week: Semiconductor Materials Trends, Opportunities in Focus
Texas Instruments Widens Its Lead As World’s Top Analog IC Supplier
CoreHW and RoodMicrotec to establish long-term supply chain partnership
Algo-Logic Systems Delivers Ultra-Low-Latency Pre-Trade Risk Check (PTRC) Solution Powered by Xilinx…
Wave Computing® Appoints Industry Veteran Art Swift CEO
Efinix® Partners with Samsung to Develop Quantum™ eFPGAs on 10nm Silicon Process
Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program
PowerVR GPU and NNA available on SiFive platform
Silicon Mitus: Industry’s First General-Purpose UHD TV LCD Panel Power Management IC Offers High Integration…
Osram and FSG Announce Collaborative Partnership for Smart Building IoT Solutions
Sequans and Momentum IoT Partner on Cloud-Based Telematics Solution for Fleet Managers
Samsung Enhances Functional Safety to its Automotive Semiconductors with ISO 26262 Certification
Moortec Support Canaan-Creative’s Mass Production ASIC on TSMC’s 7nm Process
Codasip Presence at upcoming events: China Roadshow, DAC 2019, and RISC-V Workshop Zurich
Blu Wireless raises $16.6 million in growth funding round for 5G applications
CEVA, Inc. Announces First Quarter 2019 Financial Results
GUC Monthly Sales Report – Apr 2019
Sankalp Semiconductor to Exhibit at ChipEx - 2019
X-FAB Offers Unique Substrate Coupling Analysis Solution to Address Unwanted Parasitic Effects
San Francisco Circuits Updates Turnkey PCB Assembly Capabilities
MoSys, Inc. Reports First Quarter 2019 Financial Results
inTEST Reports 2019 First Quarter Financial Results
SmartDV Appoints HyperSilicon Exclusive Sales Representative in China
Western Digital Addresses Increasing Data Demands Driven by Connected Cars Leading to an Autonomous …
eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
UMC Reports Sales for April 2019
QuickLogic Reports Fiscal 2019 First Quarter Results
ON Semiconductor Showcases Latest Low-Power Innovations for Industrial, Personal IoT and Smart Homes/Buildings…
ROHM Presents the Industry’s First AC/DC Converter ICs with a Built-In 1700V SiC MOSFET
Keysight Technologies, GOHIGH Data Networks Collaborate to Accelerate Cellular V2X Technology for Connected…
SMIC Reports 2019 First Quarter Results
Microchip Technology Announces Financial Results for Fourth Quarter and Fiscal Year 2019
Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs
GOWIN Semiconductor Joins Arm DesignStart Offering Free Arm Cortex-M Processors for its FPGA Product…
UnitedSiC adds 7 SiC FETs to 650V product portfolio
Diodes Incorporated Reports First Quarter Financial Results
MACOM Reports Fiscal Second Quarter 2019 Financial Results
Abaco Announces Ultra-high Performance Graphics, Vision and AI Evaluation Platform Featuring NVIDIA …
SmartDV Heads to ChipEx2019 in Israel with Extensive Design and Verification IP Portfolio
Keysight Technologies Announces Dynamic Power Device Analyzer with Double-Pulse Test Capability
STMicroelectronics Makes IoT Sensing Accessible with IoT Plug and Play, Ready to Connect to Microsoft…
MACOM Announces Industry’s First Analog CDR-Based PAM-4 Portfolio
AMD EPYC CPUs, AMD Radeon Instinct GPUs and ROCm Open Source Software to Power World’s Fastest Supercomputer…
ChipMOS REPORTS FIRST QUARTER 2019 RESULTS
 eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip
Advantest Introduces New V93000 Wave Scale Millimeter Solution to Cost-Effectively Test 5G-NR mmWave…
Power Integrations Unveils Complete Range of Switcher ICs with Integrated 900 V MOSFETs
Helix Semiconductors Brings Improved Power Efficiency to Range of DC-DC Applications
ASMC 2019 Highlights Latest Advanced Manufacturing Strategies
Vela enters into strategic partnership with Enyx
Renesas Electronics Showcases Real-Time Embedded Intelligence for a Connected World at Internet of Things…
1Q19 Registers the 4th Largest Sequential IC Market Decline on Record
ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment
GOWIN Adopts HyperBus(TM) for built-in PSRAM and HyperRAM (TM) Interfacing
Moortec To Showcase Its PVT Monitoring IP At TSMC 2019 Boston Technology Workshop
Arm announces appointment of Inder Singh as Chief Financial Officer
LoRa Alliance™ Bringing LoRaWAN® Live! to Berlin; Biggest LoRaWAN Event of the Year Will Showcase…
Pixelworks Reports First Quarter 2019 Financial Results
Monolithic Power Systems Announces Results for the First Quarter Ended March 31, 2019
Motorola Solutions Reports First-Quarter 2019 Financial Results
Alpha and Omega Semiconductor Reports Financial Results for the Fiscal Third Quarter of 2019 Ended March 31,…
Helix Semiconductors Expands Global Reach for Highly Efficient Power Solutions
MoSys Promotes Michael Miller to Chief Technology Officer
Moortec Provides Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on …
MaxLinear, Inc. Announces First Quarter 2019 Financial Results
Synopsys and Photonics Industry Leaders Partner to Advance PIC Technology with Plasmonics
TI enables greater system reliability in hybrid and electric vehicles with highly accurate monitoring…
SiFive Expands into Silicon Forest With new Development Office in Beaverton, Oregon
Toshiba Memory America Highlights Transformative Power of Flash-Based Storage at Dell Technologies W…
New 10W Reed Relay from Pickering Electronics Suits High-PCB-Density Applications
Advantest to Showcase Latest IC Test Solutions and Services at SEMICON Southeast Asia in Kuala Lumpur…
eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
Data I/O Announces Michael Tidwell as Vice President of Marketing and Business Development
Nano Dimension Presents Industry’s First Fully Functional Additively Manufactured IoT Devices
AMD Reports First Quarter 2019 Financial Results
Maxim Integrated Reports Results For The Third Quarter Of Fiscal 2019
Lattice Semiconductor Reports First Quarter 2019 Results
Rogers Corporation Reports First Quarter 2019 Results
ON Semiconductor to Launch SiC-based Hybrid IGBT and Isolated High Current IGBT Gate Driver at PCIM …
Microchip Announces Production Release of Silicon Carbide (SiC) Products That Enable High-Voltage, Reliable…
eSilicon Expands Technical Advisory Board
GOWIN Adopts HyperBus™ for built-in PSRAM and HyperRAM™ Interfacing
NXP Semiconductors Reports First Quarter 2019 Results
TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement
Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from “Edge…
Tamba Networks’ Ethernet IP Selected for Innovium’s TERALYNX™ 12.8 Tbps Data-Center Optimized …
Docker and Arm Partner to Deliver Frictionless Cloud-native Software Development and Delivery Model …
Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017
Firecomms Collaborates with Egrtech in Developing Highly Efficient Silicon Carbide (SiC) Gate Driver…
AMD Commemorates 50th Anniversary with Launch of ‘Gold Edition’ AMD Ryzen Processor and AMD Radeon…
Vishay Siliconix and TowerJazz Expand Manufacturing Collaboration with Next-generation Automotive Pl…
eSilicon Signs Multi-Year Agreement with Google Cloud
ON Semiconductor Reports First Quarter 2019 Results
Mobiveil, Inc. today announced availability of its PCI Express® 5 controller IP
Alphawave Joins TSMC IP Alliance Program
Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Adva…
TSMC Celebrates 25th Anniversary of the North American Technology Symposium
TSMC Certifies Synopsys' Digital and Custom Design Platforms on TSMC 5nm FinFET Process Technolo…
AI Hardware Asia Summit: Chinese and US AI Heavyweights to Meet at AI in Beijing, 4-5 June 2019
STMicroelectronics Holds STM32 Summit 2019 in Shenzhen, China
Percepio Announces Tracealyzer Version 4.3 With FreeRTOS Stack Analysis, Improved State Machine Analysis…
SiFive Announces Strategic Partnership with QuickLogic and Launches SoC Templates for Rapid Chip Des…
Power Integrations Reports First-Quarter Financial Results
Cypress Reports First Quarter 2019 Results
Data I/O Reports First Quarter 2019 Results
Nano Dimension Enables a Shorter and Simplified, End-to-End Process for Assembling BGAs and Other SMT…
AnalogX Launches Ultra Low Power Interconnect SerDes IP Portfolio to Fuel Next-Generation I/O Connec…
TTM Technologies Purchases Two Nano Dimension Additive Manufacturing Systems, Expanding Total to Three…
BD71847AMWV - Power Management IC Optimized for NXP Semiconductors’ i.MX 8M Mini Applications Proc…
Free Integrated Development Environment from STMicroelectronics Further Expands Popular STM32Cube Microcontroller…
Toshiba Launches Three-phase Brushless Motor Controller ICs With Sine Wave Drive
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