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Last 30 days.  Older
AIM to Participate at SMTA Silicon Valley Expo & Tech Forum
Simply NUC® Launches First Fully Customizable Frost Canyon Intel® NUC
SmartDV’s Platform-Independent VIP Portfolio Ensures Seamless Coverage-Driven Verification Flow
Industry’s First 4Mbit EEPROM Memory Chips from STMicroelectronics Let Small Devices Handle Bigger…
Renesas’ R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking IT and OT Seamlessly With CC-Link…
ROHM's New 200V Ultra-low IR Schottky Barrier Diodes
Renesas Electronics Introduces Industry’s First ASi-5 ASSP for Industrial Automation
SEMI, Partners Launch Largest Microelectronics Education Initiative Co-Funded by Erasmus+ Program
X-FAB Selects Methodics Solution to Achieve Scalability and Design Quality Goals
Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband…
Reno Sub-Systems IP Portfolio Bolstered by Simultaneous Award of Six New Patents
AMD Launches World’s First 7nm Professional PC Workstation Graphics Card for 3D Designers, Architects…
OSS Introduces Industry’s First Solution Incorporating NVIDIA GPUs with NVLink and Marvell ThunderX2…
Nexperia Launches High-efficiency GaN FET with Industry-leading Performance
Nano Dimension’s Partner, Accucode, Expands with Opening of First 3D Electronics Service Bureau in…
Gyrfalcon’s New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use
PragmatIC is inspiring innovators to create extraordinary solutions
Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices
Blaize Emerges from Stealth to Transform AI Computing
Rianta Releases Ethernet MAC/PCS/FEC IP Suite for ASICs targeting Datacenter, Networking and 5G Mobile…
ASSET SourcePoint now supports AMD EPYC processors
NVIDIA Launches Magnum IO Software Suite to Help Eliminate Data Bottlenecks for Data Scientists and …
NVIDIA Announces Scalable GPU-Accelerated Supercomputer in the Microsoft Azure Cloud
NVIDIA and Tech Leaders Team to Build GPU-Accelerated Arm Servers for New Era of Diverse HPC Archit…
ArchiTek Select SiFive and DTS-Insight To Enable Next-Generation AI Solution Development
OCF-over-Thread is Now Available to Simplify Highly Secure, Scalable, Low-Power IP-based IoT Product…
Ayar Labs Selected as Optical Solution Partner for Intel’s DARPA PIPES Project and Announces Customer…
Centaur Demonstrates Industry’s First High-Performance x86 SoC with Server-Class CPUs and Integrated…
AMD Delivers Best-in-Class Performance from Supercomputers to HPC in the Cloud at SC19
Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP
Achronix to Showcase 7nm FPGA Solutions at SC19
New Smart Meter using Adesto®’s Memory and Communications Technologies Begins Pilot Program in Africa…
Inphi to Acquire eSilicon, a Leading Provider of 2.5D Packaging, SerDes and Custom Silicon
MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services
Palma Ceia SemiDesign to Showcase Complete NB-IoT Solution during Synopsys ARC Processor Summit in B…
Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most…
Diamond Design Software from Lattice Semiconductor Enables Enhanced Security Features for MachXO3D F…
SC19: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Five-Meter Samtec Cable Assembly
Qorvo® Unveils Groundbreaking Integration and Performance with Motor Control and Drive SoC for Brushless…
Semtech Launches Next Generation BlueRiver® AV Processor Chipset Series for SDVoE™ Applications
Nano Dimension Announced Financial Results for the Third Quarter
PCB Connect Opens American Headquarters
Micron Solutions, Inc. Reports 2019 Third Quarter Results
AMD Radeon™ Pro 5000M Series Mobile GPUs Bring High-Performance AMD RDNA Architecture to Apple’s…
Nano Dimension Reports 2019 Third Quarter Financial Results
TowerJazz Announces Third Quarter 2019 Results
Rambus Announces Comprehensive PCI Express 5.0 Interface Solution
Skyworks Reports Q4 and Full Year FY19 Results
Synaptics VideoSmart SoC Approved for Widevine CAS on Android TV Platforms
MACOM Reports Fiscal Fourth Quarter and Fiscal Year 2019 Financial Results
Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter
Efinix® Rolls Out Trion® T120 FPGAs
Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors…
Micron Eliminates Need for Network Video Recorders With Launch of World’s First 1TB Industrial-Grade…
Aehr Test Systems to Exhibit at the 50th International Test Conference  in Washington, D.C. Nov 12 …
Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions
BittWare Expands Portfolio with Multiple Industry-First Capabilities on FPGA Acceleration Products
Volkswagen Joins SEMI; Membership to Advance Automotive Electronics
SMIC Reports 2019 Third Quarter Results
Wind River Teams with Xilinx on Secure and Safe Platform for Automated Driving Applications
Xilinx Vitis Unified Software Platform Now Available for Download
Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applicati…
NXP Announces New Automotive Ultra-Wideband Chip Capable of Turning Smartphones into Car Keys
GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio
STMicroelectronics Adds Wireless Support to Proven Smart-Meter Chipset for More Flexible, Scalable Smart…
AdaCore Introduces Support for C++ Embedded Environments
SMTC Corporation Reports Third Quarter Results
Aehr Receives Follow-on Orders of Over $6 Million for FOX-XP™ Test and Burn-in System and WaferPaks™…
eSilicon to be Acquired by Inphi and Synopsys
Accolade Technology Partners with Titan IC in Search Acceleration on FPGA-based SmartNICs and ATLAS …
Announcing OpenTitan, the First Transparent Silicon Root of Trust
Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019
Abaco Announces Industry’s First 6U VPX Solution to Feature new Xilinx RF System-on-Chip Technolog…
TSMC October 2019 Revenue Report
MediaTek’s World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology
inTEST Reports 2019 Third Quarter Financial Results
UMC Reports Sales for October 2019
CHIPS Alliance announces technical milestones, three new workgroups including Chisel and the 3rd Chisel…
CTA Announces CES 2020 Innovation Awards Honorees
2019 Global Semiconductor Alliance Award Nominees Announced
AMD Introduces World’s Fastest High-End Desktop Processors With 3rd Gen Ryzen Threadripper Family:…
CEVA, Inc. Announces Third Quarter 2019 Financial Results
Renesas Electronics Reports Financial Results for the Third Quarter Ended September 30, 2019
QuickLogic Reports Fiscal 2019 Third Quarter Financial Results
Xperi Corporation Announces Third Quarter 2019 Results
Lattice Highlights How Low Power FPGAs Deliver Milliwatt AI to the Edge in Upcoming Webinars
NVIDIA Announces Jetson Xavier NX, World’s Smallest Supercomputer for AI at the Edge
SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019
Netlist Strengthens Memory Partnership with Validation on 2nd Generation AMD EPYC™ Processors
Saki Corporation Unveils New Inspection Systems and Software at Productronica Stand A2.259
ChipMOS REPORTS THIRD QUARTER 2019 RESULTS
Advantest Marks European Debut of V93000 Wave Scale Millimeter Test Solution at SEMICON Europa in Munich,…
Microchip Technology Announces Financial Results for Second Quarter of Fiscal Year 2020
Marvell Completes Acquisition of Avera Semi
NIO Inc. Announces Strategic Collaboration with Mobileye to Bring Level 4 Autonomous Driving Vehicles…
Broadcom Expands Collaboration with Infosys, Delivering Industry-First Innovations to Automate Business…
Mobileye Outlines Strategy for Driving Significant Growth
GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Ap…
PCIe Packet Switches from Diodes Incorporated Meet Automotive Demands for Advanced Features
Volkswagen and NXP Deliver Safety to European Roads with World’s Largest Rollout of Communicating …
CEVA Appoints Bernadette Andrietti to its Board of Directors
China GDP and PMI Contraction A Risk Factor For Global Economy
DMP adopted for NEDO project of “Survey of issues for finding ideas regarding Technology Development…
American Researchers have Developed New Transistors, Wearable Devices are Closer to Us
Diodes Incorporated Reports Third Quarter Financial Results
Alpha and Omega Semiconductor Reports Financial Results for the Fiscal First Quarter of 2020 Ended September 30,…
Rambus Reports Third Quarter 2019 Financial Results
Half-Bridge Evaluation Board from GaN Systems and ON Semiconductor Demonstrates Next Performance Leap…
Advantest to Sponsor and Participate in 50th International Test Conference in Washington, DC, November…
Silex Insight Fast-track FIPS 140-2 Certification with NIST-Validated Crypto Coprocessor
TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-Li…
David Zinsner Appointed to Credo Board of Directors
Adesto Joins STMicroelectronics Partner Program to Accelerate Time-to-Market for Customers
Dr. Necip Sayiner Joins Rambus Board of Directors
New Products in Essential Analog Portfolio by Maxim Shatter Industry Benchmarks in Power, Solution Size…
UNISOC achieves 5G data call over 5G mmWave module
Xilinx Alveo Accelerators Power SK Telecom's Real-Time AI-based Physical Intrusion and Theft Detection…
The Linley Group Microprocessor Report Highlights BrainChip’s Akida™ Spiking-Neural-Network Proc…
Pixelworks Reports Third Quarter 2019 Financial Results
PDF Solutions® Reports Third Fiscal Quarter Results
Data I/O Reports Third Quarter 2019 Results
InterDigital Announces Financial Results for Third Quarter 2019
Automotive-Compliant Level Shifters from Diodes Incorporated Provide High-Speed, Flexible, and Easy-to-Use…
Renesas Premieres RE Family for Its SOTB™ Process-Based Energy Harvesting Embedded Controller Portfolio…
Maxim Provides Industry's First and Only Automotive-Grade Secure Authenticator to Enhance Vehicle Sa…
TSMC and UMC Deals Conclude the First Wave of Innovative Foundry Technologies' Foundry Licensing Pro…
Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps
FormFactor, Inc. Reports 2019 Third Quarter Results
Rogers Corporation Reports Third Quarter 2019 Results
GLOBALFOUNDRIES Appoints Amir Faintuch as SVP and General Manager Leading Computing and Wired Infrastructure…
Renesas Electronics Joins the Autonomous Vehicle Computing Consortium to Speed Autonomous Driving Vehicle…
SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
UMC Reports Third Quarter 2019 Results
Renesas Electronics Announces Company Name Change of Consolidated Subsidiary
Maxim Integrated Reports Results For The First Quarter Of Fiscal 2020
AMD Reports Third Quarter 2019 Financial Results
Lattice Semiconductor Reports Third Quarter 2019 Results
New Keithley SMU Modules Solve Tough Test Challenges Involving Low Current, High Capacitance
James C. Morgan, Chairman Emeritus of Applied Materials, Inc., Awarded the Global Semiconductor Alliance’s…
The Industry's First Ultra-High Noise Tolerant Comparators
AIC Semiconductor Licenses CEVA's 802.11ax Wi-Fi 6 IP for IoT Connectivity
Toshiba’s New Three-Phase Brushless Motor Control Pre-Driver IC Features Intelligent Phase Control…
Toshiba’s New Three-Phase Brushless Motor Control Pre-Driver IC Features Intelligent Phase Control…
Optima Design Automation Announces the “Optima Safety Platform” To Drive Order-of-Magnitude Safety…
Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tool…
NXP Semiconductors Reports Third Quarter 2019 Results
GLOBALFOUNDRIES and TSMC Announce Resolution of Global Disputes Through Broad Global Patent Cross-Li…
Amkor Technology Reports Financial Results for the Third Quarter 2019
GaN Systems to Showcase Significant GaN Advancements at Leading Power Electronics Event in China
mPower Technology Raises $2.5 Million in Series A Round
 Renesas Electronics to Accelerate Intelligent and Secure IoT Device Development with Microsoft Azure…
Microchip Solves Interoperability Challenges of Delivering up to 90 Watts of Power Over Ethernet Wir…
Nano Dimension and CBTP in S. Korea Sign MOU for Additive Manufacturing of Electronics Research Coll…
ON Semiconductor Reports Third Quarter 2019 Results
Innosilicon’s Broad IP Portfolio Qualified on GLOBALFOUNDRIES 12LP FinFET Platform for High-Performance…
AES Encryption IP Cores from CAST Receive NIST Certification
TensorFlow gets native support for PowerVR GPUs via optimised open-source SYCL libraries
Rambus Closes Sale of Payments and Ticketing Businesses to Visa
CEVA Celebrates Wireless IoT Milestone, Surpassing 100 Licensing Deals for its Bluetooth and Wi-Fi T…
Nano Dimension Reports Growth in Revenues and Record Third Quarter Revenues of $2.2 Million Based on…
SiFive Announces New U8-Series Core IP For High-Performance Compute
Micron Brings 3D XPoint™ Technology to Market With the World’s Fastest SSD
Micron Introduces Industry’s First Silicon-Based Security-as-a-Service Platform for IoT Edge Devic…
Micron Introduces Comprehensive AI Development Platform
Power Integrations Announces Settlement of Patent Litigation
MaxLinear, Inc. Announces Third Quarter 2019 Financial Results
Cypress Reports Third Quarter 2019 Results and Provides Update on Regulatory Approvals
Power Integrations Reports Third-Quarter Financial Results
Renesas Expands Access to Portfolio of Leading-Edge IP Licenses
Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
STMicroelectronics Reports 2019 Third Quarter Financial Results
Nano Dimension Reports Growth in Revenues and Record Third Quarter Revenues of $2.2 Million Based on…
OneSpin Shows How to Achieve IC Integrity at DVCon Europe
VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX® for Edge AI …
Xilinx Reports Fiscal Second Quarter 2020 Results
SiFive Announces New SiFive Shield For Modern SoC Design
MagnaChip Reports Revenue of $229.7 Million in Third Quarter 2019; OLED, Power Revenue Set Records; …
Samsung Showcases Its Latest Silicon Technologies for the Next Wave of Innovation at Annual Tech Day…
Award-winning Lattice sensAI Solutions Stack Further Extends Lead in Ultra Low-power AI at the Edge
New Flagship Mobile Processor and 5G Modem Unveiled at Samsung Tech Day
Microchip Solves Interoperability Challenges of Delivering up to 90 Watts of Power Over Ethernet Wir…
Silicon Labs Announces Third Quarter 2019 Results
Teledyne Technologies Reports Third Quarter Results
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Downstream : Solutuions for Post processing PCB Designs

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