ON Semiconductor’s ASIC Design Methodology Meets Stringent Requirements of DO-254 Standard for Electronic Hardware in Airborne Systems

TI announces first near infrared DLP® device and DLP NIRscan™ evaluation module for spectroscopy

Freescale Simplifies Software-Defined Networking Implementations with New, OpenFlow™-Compatible Software Integrated on QorIQ Multicore Processors

Freescale Releases Its First 11 RF Power Products Suitable for U.S.-Based Defense Market Applications

MediaTek Announces Pump Express(TM) Fast-Charging for Mobile Devices

GCT Semiconductor and D2 Technologies Integrate VoLTE and IR.94 Video Call Into Chipset Solution for Mobile and Automotive (M2M) Applications

Vic Kulkarni, VP ANSYS

Paul Cunningham, Corporate VP and GM Cadence

Onn Haran, CTO Autotalks

EDACafe Editorial by Roberto Frazzoli Intel’s new CEO: comments from media and analysts

EDACafe Editorial by 2021 EDACafe Predictions Synopsys: 2021 Predictions for EDA Innovation

Embedded Software by Colin Walls Libraries – a good way to promote embedded code reuse?

Bridging the Frontier by Paul Cohen Electronic System Design Reports 15% Q3 Revenue Growth; IP, Asia Pacific Surpass $1B

IC Insights by IC Insights IC Insights Bulletin: China Forecast to Fall Far Short of its “Made in China 2025” Goals for ICs

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

Product Line Manager for EDA Careers at Multiple, North Carolina

Senior Application Engineer Formal Verification for EDA Careers at California or Austin, California

Entry Level Design Verification Engineer for Cirrus Logic, Inc. at Austin, Texas

Senior Java Developer/Architect for EDA Careers at Varies, North Carolina

Si2 AI/ML Winter Workshop at United States - Jan 29, 2021

virtual DATE 2021 at France - Feb 1 - 5, 2021

SEMI Technology Unites Global Summit at United States - Feb 15 - 19, 2021

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021