ASTM International and Open Geospatial Consortium (OGC®) to Jointly Develop Standards and More through MOU

Canon Unveils 11 New Monochrome imageCLASS Models

New Leica Geosystems reference servers, monitoring receiver anticipate needs, provide solutions for today, tomorrow

Esri Adds Innovative Web Map Analytics Tool to ArcGIS Marketplace

Simio Announces Compatibility With Oculus Rift 3D Headsets and GIS Support in Latest Software Release

SitecoAnnounces the New Rail-SIT Software Release

Hend Wagieh, Senior Calibre Product Manager Mentor Graphics

Onn Haran, CTO Autotalks

Paul Cunningham, Corporate VP and GM Cadence

EDACafe Editorial by Roberto Frazzoli EDA updates; Indy Autonomous Challenge; Qualcomm-Nuvia deal; RRAM-based edge learning; robomorphic computing

Bridging the Frontier by Bob Smith, Executive Director Innovating for the Future! Electronic System Design –– Where Microelectronics Begin

IC Insights by IC Insights IC Insights Releases the New 2021 Edition of The McClean Report

Agnisys Automation Review by Anupam Bakshi Why Users Care about EDA Partnerships

EDACafe Editorial by 2021 EDACafe Predictions IAR Systems Embedded Development Trends 2021

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Senior Application Engineer Formal Verification for EDA Careers at California or Austin, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

Si2 AI/ML Winter Workshop at United States - Jan 29, 2021

virtual DATE 2021 at France - Feb 1 - 5, 2021

SEMI Technology Unites Global Summit at United States - Feb 15 - 19, 2021

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021