ROHM's New Arduino Expansion Board Enables Configuration of a Sensor Environment in Only 5 Minutes

Balluff Simplifies Integration of Serial Devices with IO-Link

Microsemi Collaborates with China Telecom to Deliver Optimized OTN Solution for 5G

MACOM Introduces New Wideband Double-Balanced Mixers for High-Performance Test and Measurement, Microwave Radio and Radar Applications

Ready for 3GPP Compliance - Anokiwave Introduces new IC family that supports 3GPP compliant mmW 5G Equipment

HEIDENHAIN’s Popular LIF 400 Linear Encoder Family Receives Several Enhancements

John Coonrod & Mahyar Vahabzadeh Rogers Corporation

Hitendra Divecha & Brandon Bautz Cadence

Michael Munsey & Brad Hart Perforce

EDACafe Editorial by Roberto Frazzoli New emulation and prototyping systems; Arm v9 architecture; low power FPGAs; HKMG DRAM; automotive startups; open source updates

IC Insights by IC Insights Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

ASIC SoC Verification Engineer for Ericsson at Austin, Texas

ASIC Engineer for Amazon at seattle, Washington

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

Test and Measurement System Architect for Xilinx at San Jose, California

Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California

Simulation World at United States - Apr 20 - 21, 2021

Virtual ASMC 2021 at United States - May 10 - 12, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021