Integra Devices Acclaimed by Frost & Sullivan for Expanding the Scope of 3D Manufacturing with its Amalga (TM) Paradigm

Spyglass Connected Solutions Releases AI-Driven Manufacturing Visual Inspection Solution

ANSYS Expands Materials Teaching Support With New CES EduPack 2019 From Granta

FARO® Introduces FARO RevEng™ for Design Professionals

VELO3D Introduces Enhancements to Its Flow Software to Accelerate Metal 3D Printing in Production

Additive manufacturing with liquid materials

Geir Eide, Director Mentor, a Siemens business

IPC APEX EXPO 2021 is the place to be...from wherever you are! IPC APEX

Brian Faith, President & CEO QuickLogic

EDACafe Editorial by Roberto Frazzoli New emulation and prototyping systems; Arm v9 architecture; low power FPGAs; HKMG DRAM; automotive startups; open source updates

IC Insights by IC Insights Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

SerDes Applications Design Engineer for Xilinx at San Jose, California

Business Operations Planner for Global Foundaries at Santa Clara, California

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

SoC Physical Design Engineer for Qualcomm at Austin, Texas

SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2021 at United States - Apr 13 - 15, 2021

Simulation World at United States - Apr 20 - 21, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021