Webinar about the gvSIG Project

Esri European Wind User Group Finds New Uses for GIS

Autodesk Introduces Breakthrough Technology for Infrastructure

CACI Makes Key Investment in Geospatial Capabilities

Intermap Announces $3.5 Million Mapping Services Solutions Contract

Esri Launches New Flexible Developer Subscriptions for ArcGIS Online

Aparna Dey, U.S. General Chair DVCon

Hitendra Divecha & Brandon Bautz Cadence

IPC APEX EXPO 2021 is the place to be...from wherever you are! IPC APEX

EDACafe Editorial by Roberto Frazzoli Nvidia’s datacenter CPU; fast AI training on x86; Siemens acquires OneSpin; EDA Q4 results

IC Insights by IC Insights Chinese Companies Hold Only 5% of Global IC Marketshare

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

Test and Measurement System Architect for Xilinx at San Jose, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

SoC Physical Design Engineer for Qualcomm at Austin, Texas

Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California

Simulation World at United States - Apr 20 - 21, 2021

Virtual ASMC 2021 at United States - May 10 - 12, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021