Research and Markets: Engineering Software (CAD, CAM, CAE, AEC, & EDA) Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2014 - 2022

Intergraph® Honors Virgin Media and Pure Force and Rescue Corp. with Icon Awards

DAC 2015: What’s Happening on the Exhibit Floor

ZWSOFT Partners With TraceParts to Bring Free 3D CAD Library to ZW3D Users

Intergraph® Unveils I/Map Editor™ for ArcGIS®

3D Printer Manufacturer EnvisionTEC® to Unveil the First Paste-based DLP 3D Printer

Geir Eide, Director Mentor, a Siemens business

Aparna Dey, U.S. General Chair DVCon

Brian Faith, President & CEO QuickLogic

EDACafe Editorial by Roberto Frazzoli New emulation and prototyping systems; Arm v9 architecture; low power FPGAs; HKMG DRAM; automotive startups; open source updates

IC Insights by IC Insights Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

SerDes Applications Design Engineer for Xilinx at San Jose, California

Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California

ASIC Engineer for Amazon at seattle, Washington

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

Business Operations Planner for Global Foundaries at Santa Clara, California

Simulation World at United States - Apr 20 - 21, 2021

Virtual ASMC 2021 at United States - May 10 - 12, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021