Oski Names Craig Shirley CEO and Vigyan Singhal Chief Oski

ESD Alliance Reports EDA Industry Revenue Increase For Q4 2017

Elastifile to Present the Benefits of Cloud-Integrated Semiconductor Design At D&R IP-SoC Days

eSilicon to present: Enabling Technology for the Cloud and AI – One Size Fits All?

Semiconductor Industry Responds to OneSpin’s Dare to Solve “The Sudoku Challenge” Holiday Puzzle

Synopsys Acquires Silicon and Beyond Private Limited to Expand High-Speed SerDes IP Portfolio

John Coonrod & Mahyar Vahabzadeh Rogers Corporation

Aparna Dey, U.S. General Chair DVCon

Hitendra Divecha & Brandon Bautz Cadence

EDACafe Editorial by Roberto Frazzoli New emulation and prototyping systems; Arm v9 architecture; low power FPGAs; HKMG DRAM; automotive startups; open source updates

IC Insights by IC Insights Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

ASIC Engineer for Amazon at seattle, Washington

Entry Level SOC Verification Engineer for NXP Semiconductors at Austin (Oakhill, Office), Texas

Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2021 at United States - Apr 13 - 15, 2021

Simulation World at United States - Apr 20 - 21, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021