Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO

Intel Editorial: Building the Industry’s Best PC Experiences

IPC APEX EXPO 2021 Goes Virtual

eMemory & PUFsecurity Announce with UMC the World’s First PUF-based Secure Embedded Flash Solution

Intel, Microsoft, IBM Technologists Elected to Si2 OpenAccess Coalition Leadership Posts

Worldwide Server Market Revenue Grew 2.2% Year Over Year in the Third Quarter of 2020, According to IDC

Zach Dismukes, West Coast Regional Manager Bowman XRF

Richard DePoto, Business Development Manager Uyemura International

e-con Systems

EDACafe Editorial by Roberto Frazzoli Concerns over Nvidia-Arm deal; ISSCC innovations; DAC postponed to December

IC Insights by IC Insights TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories

Embedded Software by Colin Walls Variable declarations in C – plenty of pitfalls

Agnisys Automation Review by Anupam Bakshi AUGER: Celebrating Our Users

EDACafe Editorial by 2021 EDACafe Predictions Atmosic Technologies Electronics Design Industry Predictions

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021

IPC APEX EXPO 2021 Goes Virtual at - Mar 8 - 12, 2021

ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021

ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021