Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software

UVM Reference Implementation Aligned with IEEE 1800.2-2020 Standard

Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs

Synopsys Initiates $250 Million Accelerated Share Repurchase Agreement

Synopsys Introduces Improved Illumination Optics Design with New LightTools Version

Intel, Microsoft, IBM Technologists Elected to Si2 OpenAccess Coalition Leadership Posts

IPC APEX EXPO 2021 is the place to be...from wherever you are! IPC APEX

Stephen Douglas, Head of 5G Strategy Spirent

Hitendra Divecha & Brandon Bautz Cadence

EDACafe Editorial by Roberto Frazzoli Special Report: Machine Learning in EDA

IC Insights by IC Insights Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes

Bridging the Frontier by Bob Smith, Executive Director Remembering Jim Hogan

Embedded Software by Colin Walls Variable declarations in C – plenty of pitfalls

Agnisys Automation Review by Anupam Bakshi AUGER: Celebrating Our Users

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California

Business Operations Planner for Global Foundaries at Santa Clara, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Test and Measurement System Architect for Xilinx at San Jose, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

IPC APEX EXPO 2021 Goes Virtual at - Mar 8 - 12, 2021

ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021

ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021

SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2021 at United States - Apr 13 - 15, 2021