IDT Introduces High-speed Multiplexer for DDR4 NVDIMM Technology; Selected by Micron as Preferred Supplier

Micron Technology Joins SPEC/GWPG

Catalent Acquires Micron Technologies

OmniVision Delivers Industry-Leading 13-Megapixel Image Sensor with Large 1.3-Micron Pixels and Stacked Die Technology

Rambus Updates Second Quarter Guidance

Rambus to Exhibit and Speak at the Design Automation Conference (DAC)

Manny Marcano, President EMA

e-con Systems

Hend Wagieh, Senior Calibre Product Manager Mentor Graphics

EDACafe Editorial by Roberto Frazzoli Intel’s new CEO: comments from media and analysts

EDACafe Editorial by 2021 EDACafe Predictions Synopsys: 2021 Predictions for EDA Innovation

Embedded Software by Colin Walls Libraries – a good way to promote embedded code reuse?

Bridging the Frontier by Paul Cohen Electronic System Design Reports 15% Q3 Revenue Growth; IP, Asia Pacific Surpass $1B

IC Insights by IC Insights IC Insights Bulletin: China Forecast to Fall Far Short of its “Made in China 2025” Goals for ICs

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Senior Java Developer/Architect for EDA Careers at Varies, North Carolina

Technical Marketing Mmanager for EDA Careers at Fremont, California

Senior Analog IC Design Engineer for Marvell Semiconductor at Santa Clara, California

Senior Application Engineer Formal Verification for EDA Careers at California or Austin, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

Si2 AI/ML Winter Workshop at United States - Jan 29, 2021

virtual DATE 2021 at France - Feb 1 - 5, 2021

SEMI Technology Unites Global Summit at United States - Feb 15 - 19, 2021

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021