LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor

IAR Systems provides support for Texas Instruments’ new EnergyTrace technology

Synopsys Announces Immediate Availability of Broad Portfolio of IP for TSMC 28HPC Process

Texas Instruments ushers in a new era of ultra-low power with new MSP430™ FRAM microcontrollers

ARM and Sensor Platforms Deliver an Open Source Framework for Sensor Devices

Spreadtrum Launches Highly Integrated Quad-core Smart Phone Platform Using 28nm Process

IPC APEX EXPO 2021 is the place to be...from wherever you are! IPC APEX

Zach Dismukes, West Coast Regional Manager Bowman XRF

Manny Marcano, President EMA

EDACafe Editorial by Roberto Frazzoli Concerns over Nvidia-Arm deal; ISSCC innovations; DAC postponed to December

IC Insights by IC Insights TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories

Embedded Software by Colin Walls Variable declarations in C – plenty of pitfalls

Agnisys Automation Review by Anupam Bakshi AUGER: Celebrating Our Users

EDACafe Editorial by 2021 EDACafe Predictions Atmosic Technologies Electronics Design Industry Predictions

Business Operations Planner for Global Foundaries at Santa Clara, California

Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California

ASIC Engineer for Amazon at seattle, Washington

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

IPC APEX EXPO 2021 Goes Virtual at - Mar 8 - 12, 2021

ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021

ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021

DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021