NANIUM presents the most compact eWLB-based 10 Chip Array in the Medical Market

DRAM Capacity Rises from Slump; Sector Faces New Challenges

New feature enhancements with the Asscon VP800 increases process efficiencies

Spotlight on MEMS: SEMI Launches New European MEMS Summit

Truechip announces first customer shipment of ARM® AMBA® 4 ACE Comprehensive Verification IP (CVIP)

MegaChips Partners with Bosch Sensortec to Deliver Health and Fitness tracking for Smartphones and Wearables in Real Time

Loris Valenti, VP Microcontrollers and Digital Products, Americas STMicroelectronics

Hitendra Divecha & Brandon Bautz Cadence

e-con Systems

EDACafe Editorial by Roberto Frazzoli Special Report: Machine Learning in EDA

IC Insights by IC Insights Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes

Bridging the Frontier by Bob Smith, Executive Director Remembering Jim Hogan

Embedded Software by Colin Walls Variable declarations in C – plenty of pitfalls

Agnisys Automation Review by Anupam Bakshi AUGER: Celebrating Our Users

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California

ASIC Engineer for Amazon at seattle, Washington

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021

ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021

SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2021 at United States - Apr 13 - 15, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021