Antelope Audio Announces Partnership with BAE Audio, as Company Prepares Imminent Release of Authentic, Vintage Product Emulations

German Advanced Electronic Design Automation Tools and Services Now Available in North America

FDL 2016 Call for WiP & Other Contributions

Enhanced In-flight Communications through Pre-integrated ARINC 600 Network Server

UltraSoC announces significant product update, improved support for analytics and ‘any CPU’ capability

Spectrum launches educational tools teach signal generation, acquisition and analysis

Richard DePoto, Business Development Manager Uyemura International

Stephen Douglas, Head of 5G Strategy Spirent

Hitendra Divecha & Brandon Bautz Cadence

EDACafe Editorial by Roberto Frazzoli Special Report: Machine Learning in EDA

IC Insights by IC Insights Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes

Bridging the Frontier by Bob Smith, Executive Director Remembering Jim Hogan

Embedded Software by Colin Walls Variable declarations in C – plenty of pitfalls

Agnisys Automation Review by Anupam Bakshi AUGER: Celebrating Our Users

Business Operations Planner for Global Foundaries at Santa Clara, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

IPC APEX EXPO 2021 Goes Virtual at - Mar 8 - 12, 2021

ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021

ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021

SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2021 at United States - Apr 13 - 15, 2021