eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC

AI Hardware Asia Summit: Chinese and US AI Heavyweights to Meet at AI in Beijing, 4-5 June 2019

Xilinx to Acquire Solarflare

MACOM Reports Preliminary Fiscal Second Quarter 2019 Non-GAAP Financial Results

MACOM and Goertek Form Joint Venture to Service China’s 5G Build Out

Teradyne Reports First Quarter 2019 Results

Vic Kulkarni, VP ANSYS

e-con Systems

Hend Wagieh, Senior Calibre Product Manager Mentor Graphics

EDACafe Editorial by Roberto Frazzoli Intel’s new CEO: comments from media and analysts

IC Insights by IC Insights Industry R&D Spending To Rise 4% After Hitting Record in 2020

EDACafe Editorial by 2021 EDACafe Predictions The Semiconductor Industry will Persevere in 2021

Embedded Software by Colin Walls Libraries – a good way to promote embedded code reuse?

Bridging the Frontier by Paul Cohen Electronic System Design Reports 15% Q3 Revenue Growth; IP, Asia Pacific Surpass $1B

Physical Design Engineer for Cirrus Logic, Inc. at Austin, Texas

Technical Marketing Mmanager for EDA Careers at Fremont, California

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Senior Analog IC Design Engineer for Marvell Semiconductor at Santa Clara, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Entry Level Design Verification Engineer for Cirrus Logic, Inc. at Austin, Texas

Si2 AI/ML Winter Workshop at United States - Jan 29, 2021

virtual DATE 2021 at France - Feb 1 - 5, 2021

SEMI Technology Unites Global Summit at United States - Feb 15 - 19, 2021

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021