Faraday Showcases FinFET ASIC Solutions and SoCreative!V™ SoC Platform at DAC 2019

INGChips selects Dolphin Integration’s Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash

OmniVision's New SoC Provides Entry Level, Thin-Bezel Notebooks With Industry's Best VGA Camera Image Quality, Low Power Consumption and Overall Value

SmartDV Speeds Delivery of its New CXL Verification IP

SmartDV Unveils First Verification IP to Support Ethernet TSN

MVSILICON License and Deploy CEVA Bluetooth® IP in its latest Wireless Audio Platform

Ellis Smith, CEO Blue Pearl Software

Onn Haran, CTO Autotalks

Mark Gilbert, President EDA Careers

EDACafe Editorial by Roberto Frazzoli EDA Q3 figures; Achronix to list on Nasdaq; automotive chip shortage; SMIC added to Entity List; AI updates

EDACafe Editorial by 2021 EDACafe Predictions Electronic Design Industry Predictions – Lanza techVentures

Bridging the Frontier by Paul Cohen Electronic System Design Reports 15% Q3 Revenue Growth; IP, Asia Pacific Surpass $1B

IC Insights by IC Insights IC Insights Bulletin: China Forecast to Fall Far Short of its “Made in China 2025” Goals for ICs

Embedded Software by Colin Walls Questions on data representation

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Product Line Manager for EDA Careers at Multiple, North Carolina

Senior Java Developer/Architect for EDA Careers at Varies, North Carolina

Physical Design Engineer for Cirrus Logic, Inc. at Austin, Texas

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Si2 AI/ML Winter Workshop at United States - Jan 29, 2021

virtual DATE 2021 at France - Feb 1 - 5, 2021

SEMI Technology Unites Global Summit at United States - Feb 15 - 19, 2021

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021