Silicon Labs Drives IoT Industry Forward in 2020

ROHM Introduces New EMARMOUR(TM) Two-Channel, High-Speed Op Amp

Latest Release of Lattice sensAI Solutions Stack Delivers up to 6X Performance Boost on Award-Winning CrossLink-NX FPGAs

MagnaChip Introduces First Power Management IC for Laptops with UHD Display Panels

Renesas Accelerates ADAS and Automated Driving Development with Best-in-Class R-Car V3U ASIL D System on Chip

RT-Thread IoT OS Joins STMicroelectronics Partner Program to Deliver One-Stop & Free-to-Use IDE RT-Thread Studio for STM32 IoT Development

Hitendra Divecha & Brandon Bautz Cadence

Brian Faith, President & CEO QuickLogic

Geir Eide, Director Mentor, a Siemens business

EDACafe Editorial by Roberto Frazzoli Nvidia’s datacenter CPU; fast AI training on x86; Siemens acquires OneSpin; EDA Q4 results

IC Insights by IC Insights Chinese Companies Hold Only 5% of Global IC Marketshare

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

Staff SerDes Applications Design Engineer for Xilinx at San Jose, California

Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

Test and Measurement System Architect for Xilinx at San Jose, California

Business Operations Planner for Global Foundaries at Santa Clara, California

Simulation World at United States - Apr 20 - 21, 2021

Virtual ASMC 2021 at United States - May 10 - 12, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021