Zarlink Releases First Quarter Fiscal 2009 Results

Trading of Zarlink Semiconductor Common Shares Will Be Suspended from the New York Stock Exchange

Dissident Group Rejects Zarlink's Attempt to Fairly Represent Views of all Company Shareholders

Zarlink Urges Shareholders to Learn the Truth

Zarlink Introduces High Performance Synchronous Ethernet Devices

Zarlink Extends Lead in Growing Voice Gateway Market With New Enhanced Two-Channel Voice-over-IP Solutions

Geir Eide, Director Mentor, a Siemens business

Hitendra Divecha & Brandon Bautz Cadence

Aparna Dey, U.S. General Chair DVCon

EDACafe Editorial by Roberto Frazzoli New emulation and prototyping systems; Arm v9 architecture; low power FPGAs; HKMG DRAM; automotive startups; open source updates

IC Insights by IC Insights Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California

ASIC Engineer for Amazon at seattle, Washington

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California

Circuit Design & Layout Simulation Engineer - Co-Op (Spring 2021) for Global Foundaries at Santa Clara, California

Simulation World at United States - Apr 20 - 21, 2021

Virtual ASMC 2021 at United States - May 10 - 12, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021