Dataram Launches DDR3 Memory Modules for Intel Based AIC Gemini Platform

Meet Your New Processor: Intel Introduces 17 New Processors

NVIDIA Files Countersuit Against Intel for Breach of Contract

Intel Notifies AMD of Cross-License Breach Efforts to Resolve Dispute Continuing

congatec Introduces First True Extended Temperature Module Based on Intel® Atom™ Processor Z5xx Series

RadiSys Announces Cost-Effective Embedded Server Based on Intel® Multi-Core Technology

Yoan Dupret, Managing Director Menta

e-con Systems

Paul Cunningham, Corporate VP and GM Cadence

EDACafe Editorial by Roberto Frazzoli Concerns over Nvidia-Arm deal; ISSCC innovations; DAC postponed to December

IC Insights by IC Insights TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories

Embedded Software by Colin Walls Variable declarations in C – plenty of pitfalls

Agnisys Automation Review by Anupam Bakshi AUGER: Celebrating Our Users

EDACafe Editorial by 2021 EDACafe Predictions Atmosic Technologies Electronics Design Industry Predictions

Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California

Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

DVCon U.S. 2021 at Virtual - Mar 1 - 4, 2021

IPC APEX EXPO 2021 Goes Virtual at - Mar 8 - 12, 2021

ISQED'21 - 22nd International Symposium at POB 607 Los Altos CA - Apr 7 - 9, 2021

ADAS Sensors 2021 at The Henry Hotel 300 Town Center Drive Dearborn MI - Apr 7 - 8, 2021