Q3 2011 GAAP net income was $0.523 million [or $0.01 per share], down 28.26% compared to $0.729 million [and $0.01 per share] in just-prior Q2 2011, and down 93.13% compared to $7.616 million [and $0.16 per share] in Q3 2010.
“In the third calendar quarter, we achieved our forecast financial goals and continued to strengthen our solution offerings. While our financial performance in the quarter continues to mirror the overall consumer electronics and network infrastructure economic environment, we are confident in MIPS’ long-term market opportunity,” said Sandeep Vij, chief executive officer, MIPS Technologies.
MIPS Technologies, Inc. self description
MIPS Technologies, Inc. (NASDAQ: MIPS) is a provider of industry-standard processor architectures and cores for digital home, networking and mobile applications. The MIPS architecture powers some of the world’s most popular products, including broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.
MIPS is a trademark or registered trademark of MIPS Technologies, Inc. in the United States and other countries.
52 week range = $3.87 – $18.19
Market Cap = $296.4 million
Late News about MIPS
MIPS Technologies ’Processor IP at the Heart of Sequans’ New LTE SoCs for Handsets and Tablets
MIPS-Based™ SoCs Recently Announced by Chipmaker with Leading Market Share in 4G Handset SoCs
SUNNYVALE, Calif. – October 27, 2011 – MIPS Technologies, Inc. (NASDAQ: MIPS), a provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, announced that the new LTE (Long Term Evolution) SoC (System-on-Chip) from 4G chipmaker
Sequans Communications S.A. (NYSE: SQNS) is powered by MIPS® industry-standard processors. Targeted at smart phones and tablets, the SQN3110 SoC is Sequans’ second generation LTE baseband chip. It incorporates dual MIPS32® 24Kc® processor cores, and is the first of a planned series of MIPS-Based LTE chips from Sequans.
LTE is a 4G wireless broadband technology that is quickly proliferating across the world. According to recent research from IHS iSuppli, growth of LTE infrastructure spending will reach $27.9 billion by 2014, a CAGR of a 107.5 percent from $1.5 billion in 2010. And research firm In-Stat forecasts that LTE subscriptions will experience an unprecedented 3,400% growth between 2011 and 2015. The MIPS® architecture is used widely in LTE network infrastructure solutions, and now through licensees such as Sequans, is gaining traction in user equipment (UE) such as handsets and tablets.
Implemented in an advanced 40nm process technology, the new SQN3110 SoC achieves LTE CAT4 data throughput with ultra-low power consumption. With Sequans’ 4G “slim modem” approach, the SoC provides high performance with compact area and low system cost. Compared with the previous generation LTE chip, the new MIPS-Based SoC features increased data throughput, 3GPP Release-9 support and improved power consumption.
“As the leading provider of 4G SoCs for handsets, Sequans leveraged its deep WiMAX and LTE experience to deliver this new SoC that offers key benefits for handsets and tablets. The SQN3110 SoC offers uncompromised performance in a low-power implementation with a high level of integration. MIPS’ flexible solutions and business model are enabling us to offer a broad range of options to our customers,” said Dr. Georges Karam, president and CEO, Sequans.
“MIPS Technologies continues to make inroads into the mobile market, with a growing presence in applications processing, baseband processing, and other mobile-related functionality. Sequans is clearly at the forefront of 4G chip development, with more than 10 million chipsets shipped to-date. We are pleased to team with Sequans as the company brings its high-performance, low-power MIPS-Based LTE chips to the world. The rapid adoption of 4G technologies provides a significant opportunity for Sequans to proliferate its products across the globe,” said Sandeep Vij, president and CEO, MIPS Technologies.
About Sequans Communications
Sequans Communications S.A. (NYSE: SQNS) is a 4G chipmaker, supplying LTE and WiMAX chips to original equipment manufacturers and original design manufacturers worldwide. Founded in 2003 to address the WiMAX market, the company expanded in early 2009 to address the LTE market. Sequans is based in Paris, France with additional offices throughout the world, including United States, United Kingdom, Israel, Hong Kong, Singapore, Taiwan, and China.
On November 3, 2011 MoSys, Inc. (NASDAQ: MOSY), a provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, reported poor financial results for the third quarter ended September 30, 2011.
Third Quarter and Recent Highlights
- Ended the quarter with total cash and investments of $26.4 million;
- Announced availability of a Bandwidth Engine® FPGA Companion and Characterization Kit;
- Announced interoperability of the Bandwidth Engine integrated circuit (IC) family with Avago’s SerDes;
- Bandwidth Engine IC named a finalist for the prestigious UBM TechInsights Most Innovative Memory Product award; and
- Achieved first design wins for the Bandwidth Engine IC.
“Revenue from license fees and royalties in the third quarter declined sequentially as our IP business was negatively impacted by global economic conditions and delays in customer acceptance of IP delivered under existing projects,” commented Len Perham, MoSys’ President and Chief Executive Officer.
“Despite the current environment, we remain focused on further advancing our Bandwidth Engine family of ICs by continuing to engage with a growing list of prospective customers and partners. We recently achieved our first Bandwidth Engine design wins with two high-performance board suppliers. Additionally, the Bandwidth Engine IC is now being incorporated into system schematics at a number of design wins in progress with global networking equipment suppliers,” Perham continued.
“During the quarter, we continued to make progress successfully demonstrating the interoperability of our Bandwidth Engine IC with high-performance network processing ASICs, such as those available from Avago Technologies. This achievement expands on our current interoperability success with FPGA devices from both Altera Corporation and Xilinx. We continue to work with both the network equipment companies and their SOC suppliers to further expand the acceptance and use of our GigaChip™ Interface for serial chip-to-chip applications in their future generations of line cards. Finally, we have now fully defined our next generation IC, Bandwidth Engine 2, and it has been released to the design team. Bandwidth Engine 2 will include significant performance upgrades and feature enhancements. We are very enthusiastic about the ongoing adoption of our revolutionary Bandwidth Engine family of products and look forward to sharing this information as it becomes available,” concluded Mr. Perham.