About the Technology Leadership Awards Contest
Mentor’s Technology Leadership Award contest is open to any designs created with Mentor’s PCB solutions, including the Board Station®, Expedition™ Enterprise and PADS® design flows. Judging will be based on overcoming complexity challenges, such as small form factor, high-speed content, design team collaboration, advanced PCB fabrication technologies and design-cycle time reduction. Judging will start July 31, 2012 and winners will be announced September 23, 2012 on a worldwide web broadcast.
Meet the Judges of the 24th TLA Contest
Happy Holden is the Director of Electronics Technologies at GENTEX Corporation, the world’s preeminent supplier of auto-dimming and rear-camera electronic mirrors. A frequent speaker and lecturer on advanced PCBs and HDI the last 42 years, he retired as CTO for Hon Hai’s Mobile Interconnect Products Business Group of China and Taiwan. Prior to joining Hon Hai, he was the Senior PCB Technologist for Mentor Graphics’ System Design Division in Longmont, CO; then Advanced Technology Manager at NanYa/Westwood Associates and Merix Corporations. He took early retirement from Hewlett-Packard after over 28 years. Mr. Holden formerly managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignments with HP had been as director of PCB R&D and PCB Engineering Manager. Happy has received the IPC President’s Award in 1995 for contributions to printed circuits world-wide. Mr. Holden has written over 130 technical papers and PCB chapters in 3 books plus contributing and being an Assistant Editor for the Coomb’s 4th, 5th and 6th Editions of the PC HANBOOK. In 2009 he wrote the popular (free) HDI HANDBOOK from pcb007 (http://hdihandbook.com). He holds degrees in Chemical Engineering and Computer Science. He is a member of the IPC, SMTA, IMAPS and the IEEE.
Rick Hartley is a Senior Principal Engineer at L-3 Communication, Avionics Systems, as well Principal Engineer of Hartley Enterprises, through which he consults and teaches internationally. His 47 year career has focused on circuits and PC boards for computers, aircraft avionics and telecommunications. The past 37 years were dedicated to PC board and circuit development with emphasis on control of noise. Rick is a past member of the Editorial Review Board of Printed Circuit Design Magazine and has written numerous technical papers on methods to control EMI and signal integrity. He is currently on the IPC Designers Council Executive Board.
A board designer for over 31 years, Andy Kowalewski has a technical background in avionics (HF, VHF and UHF) air-ground-air & radio link communications, radar & navigational aids. Starting as a technician with tubes, then on to board design, he evolved from hand drafting to CAD in 1985. He has owned/operated a service bureau, designing under contract both in Australia and worldwide. He is currently working with an advanced service bureau in Sydney, Australia. Andy was one of the first designers certified as a CID (Certified Interconnect Designer) through the IPC Designers Council in 1995, now also certified as an Advanced Interconnect Designer (CID+). A past President of the North Texas Chapter of the Designers Council & Past Chairman of the Designers Council Executive Board, Andy remains a member of the Designers Council. A Master Instructor qualified to teach and certify other instructors, Andy is active in teaching Basic and Advanced Certification workshops. He is a past member of the Editorial Review Board of Printed Circuit Design magazine, and has written advanced design articles for that magazine. He has spoken at conferences and taught seminars and workshops throughout the USA, in Australia, China, Malaysia and the UK.
Pete Waddell is president of UP Media Group, publisher of Printed Circuit Design and Fab magazine and Circuits Assembly magazine. UPMG also produces the PCB Design Conference and the Printed Circuit University online education site. During his publishing career Pete has been editor and publisher of several magazines in the electronic and PCB markets including Printed Circuit Design magazine and PC Fab magazine, and conference chair for the PCB Design Conferences. Before coming to the publishing world Pete spent 20 years as a PCB and electromechanical designer working on commercial and military applications. He started his career as a draftsman in the structural steel and civil engineering fields.
Gary Ferrari is currently the Director of Technical Support for ITG Circuits. Gary has over 40 years experience in electronic packaging with an emphasis on printed board (PWB) design and manufacturing. He has held senior operations, quality and engineering positions in both OEM- and supplier-based environments, and has served as the executive director and co-founder of the IPC Designers Council. He has chaired a number of IPC technical committees on design, including the popular IPC-2221/2222 Design subcommittee. He served as chairman of the IPC Technical Activities Executive Committee, guiding IPC technical activities during his term. He has written numerous technical articles, and has provided design for manufacture (DFM) consulting services to the industry. Gary spearheaded IPC's highly successful PWB Designers Certification Program, which has trained and recognized over 3000 designers to date. Gary was honored with the IPC “President’s Award” in 1990, recognizing his contributions to the electronic interconnection industry, as well as to the association.
On April 19, 2012 SpringSoft, Inc. (TAIEX: 2473) announced consolidated revenue of US$ 20.427 MILLION, net income of US $5.116 million, and earnings per share of $0.03 for the first quarter ended March 31, 2012.
“Q1 2012 was an important milestone for us with the release of the third generation of our market leading chip ‐ level debug product, Verdi3," said Johnson Teng, COO of SpringSoft.
"This major new upgrade contains significant performance and productivity innovations and is being deployed by our customers worldwide. We also saw continued penetration of our Verdi Interoperability Apps (VIA) with the announcements that ST Electronics has adopted VIA to create custom debug application, and Synopsys integrated their new Protocol Analyzer product with Verdi using VIA."
SpringSoft, Inc. is a global supplier of Electronic Design Automation (EDA) software to the semiconductor and electronic systems industries. The company is the largest in Asia specializing in IC design software. SpringSoft has dual headquarters in Hsinchu, Taiwan, and in San Jose, California and is publically traded on the Taiwan Stock Exchange (TAIEX 2473).
SpringSoft's unique automation technologies save engineers time at key pain points in the design and verification of complex digital, analog and mixed-signal ICs, ASICs, microprocessors, and SoCs. Our products comprise two distinct lines: The Novas line of verification enhancement solutions, and the Laker line of custom IC design solutions. These solutions share the common characteristic that they automate tedious, time consuming tasks to allow engineers to focus on activities that add value.
SpringSoft products have been in commercial use for over a decade. Today, thousands of engineers save time using our solutions at semiconductor and systems companies around the world including all of the global top 20 IC Fabless and Integrated Device Manufacturers. We nurture extraordinary relationships with our customers.
SpringSoft, Inc. (TAIEX: 2473) is a global supplier of innovative automation technologies for the design and verification of complex digital, analog and mixed-signal SoCs. Its award-winning product portfolio is used by more than 400 of today's leading semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with multiple R&D sites and local support offices around the world. For more information, visit