Toshiba Debuts New Technology, Highlights Latest Memory and Storage Solutions at Flash Memory Summit

SANTA CLARA, Calif., Aug. 9, 2016 — (PRNewswire) —   Toshiba America Electronic Components, Inc. (TAEC) will be on hand at the Flash Memory Summit (FMS) this week to showcase its latest memory and storage solutions. The inventor and one of the world's largest producers of NAND flash, Toshiba will leverage FMS as a stage to highlight key technologies, including its BiCS FLASH*1 64-layer, 256Gb 3D flash memory - and to debut an all-flash solution for big data analytics. The company will also give one of the Summit's keynote presentations. In keeping with this year's FMS theme of high density NAND flash memory for vertical applications, Toshiba will focus on the needs of the enterprise, data center, automotive, industrial, mobile and client markets. Toshiba will be located in its theater-style booth (#407) on the show floor at the Santa Clara Convention Center from August 9-11.

Toshiba's Shigeo (Jeff) Ohshima (pictured above) and Yoichiro Tanaka will jointly present a keynote session at FMS titled: "New 3D Flash Technologies Offer Both Low Cost and Low Power Solutions."

Toshiba's Shigeo (Jeff) Ohshima, technology executive, SSD, and Yoichiro Tanaka, senior fellow, will jointly present a keynote session titled: " New 3D Flash Technologies Offer Both Low Cost and Low Power Solutions." Taking place on Tuesday, August 9 from noon – 12:30 p.m., the session will focus on the need for multiple 3D technologies to support today's new flash applications. Emphasis will be placed on the data-intensive tasks such as real-time analytics, computational genomics, cloud computing, and video and image processing that are driving the need for high-density, low-cost solutions.

3D Flash Memory: Toshiba Continues to Lead the Way
Toshiba's 3D flash memory solution, BiCS FLASH, will play a prominent role this year at FMS. Based on Toshiba's cutting-edge stacking process, 3D BiCS FLASH makes larger capacities possible for enterprise applications, surpassing the capacity of mainstream two dimensional NAND flash memory while enhancing reliability and endurance and boosting performance.

With samples now shipping, Toshiba's 64-layer 3D flash memory builds on the company's reputation as leaders in this space – Toshiba was the first to introduce 48-layer 3D flash memory, which it debuted in March of last year. Underlining this commitment to next-generation memory solutions and furthering its momentum in the market, Toshiba recently celebrated the opening of its new Fab 2. This new semiconductor fabrication facility is dedicated to the production of its 3D flash memory solutions.

Additionally, Toshiba will showcase its new BG series solid state drive (SSD) family. Toshiba's new single-package ball grid array (BGA) NVMe PCI Express® (PCIe®)*2 Gen3 x2 SSD features BiCS FLASH deploying 3-bit-per-cell (TLC) technology, and utilizes an in-house Toshiba-developed controller and firmware for a fully vertically developed solution. This helps to ensure that the technology is tightly integrated for optimal performance, power consumption and reliability.

Flashmatrix Revealed and More
FMS will mark the debut of Toshiba's new, all-flash, big data analytic platform technology: Flashmatrix*3. This platform represents a new breed of superconverged infrastructure that features integrated compute, storage and network elements optimized for high performance. This makes it suited for hybrid cloud architectures and edge-based applications that require highly distributed analytic capabilities. Flashmatrix will be demoed in the Toshiba booth.

The recently launched OCZ RD400 NVM Express® M.2 SSD Series*4 will also be demoed at the Toshiba booth, running live in an ORIGIN PC MILLENNIUM desktop. The RD400 Series outperforms SATA SSDs by more than 4.5 times in sequential read (up to 2,600MB/s), and more than 3 times in sequential write performance (up to 1,600MB/s)*5, increasing storage bandwidth for data-intensive workloads. ORIGIN PC is currently leveraging the performance of RD400 1024GB SSDs in several system configurations to provide ample storage capacity for custom gaming and professional PC builds.

For more information on Toshiba's flash memory solutions, please visit and follow the company on Facebook. To learn more about Toshiba's SSDs, please visit

*1: BiCS FLASH is a trademark of Toshiba Corporation
*2: PCIe and PCI Express are registered trademarks of PCI-SIG
*3: Flashmatrix is a trademark of Toshiba Corporation
*4: NVM Express is a trademark of NVM Express, Inc.
*5: This reflects maximum performance of RD400 512GB compared to VT180 480GB

Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specification.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor, solid state drive and hard disk drive manufacturer and the world's seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 550 consolidated companies employing over 188,000 people worldwide (as of March 31, 2016). Visit Toshiba's web site at

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
Email Contact

Shown here, Toshiba's Yoichiro Tanaka will be delivering one of the keynote sessions at FMS, alongside colleague Shigeo (Jeff) Ohshima. The session will focus on the need for multiple 3D technologies to support today's new flash applications.


Toshiba Corporation logo

Photo -
Photo -
Logo -


To view the original version on PR Newswire, visit:

SOURCE Toshiba America Electronic Components, Inc.

1 | 2  Next Page »

Review Article Be the first to review this article
Featured Video
SerDes Applications Design Engineer for Xilinx at San Jose, California
Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Logic Design Engineer for Intel at Santa Clara, California
Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California
Upcoming Events
SEIA' 2021 at Palma de Mallorca Balearic Islands Spain - Sep 22 - 24, 2021
Strategic Materials Conference (SMC) 2021 at DoubleTree by Hilton san jose CA - Sep 27 - 29, 2021
Embedded Systems Week at Virtual Conference Virtual Conference - Oct 10 - 15, 2021
DVCon Europe 2021 at Germany - Oct 26 - 27, 2021

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise