ITASCA, IL — September 11, 2017 -- Kester will be exhibiting (booth #1123) at Surface Mount Technology Association International (SMTAI) 2017, which will take place September 19-20 at the Donald Stephens Convention Center in Rosemont, IL.
Kester’s booth will offer attendees the opportunity to meet with the R&D and sales teams, and learn more about Kester’s various new products.
In addition to exhibiting, Kester will have multiple papers being presented. On Wednesday, September 20:
Kester’s Joseph Biggs will present “Optimization Study of Filler Loading Level on Interconnection Performance with OSCA-R Materials” at 8:30am.
Kester’s Fan Gao will present “Rheology Behavior of Flux and Solder Paste” at 11am.
To learn more about these sessions, please click here.
To schedule an appointment with a member of our R&D or sales team or if you have any questions, please contact Email Contact.
Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.