Toshiba Adds New 2-in-1 Detachable Laptop to Portfolio of Innovative Business Computing Solutions

For users that need to connect more desktop peripherals, the Portégé® X30T is compatible with Toshiba’s advanced docking solutions– the dynadock® U3.0 Universal USB 3.0 and dynadock 4K Universal USB 3.0 docking stations. These docking options are designed to expand the overall productivity of Toshiba’s new 2-in-1 detachable laptop through a single connection.

About Toshiba America Information Systems, Inc. (TAIS)

Headquartered in Irvine, Calif., TAIS is comprised of three business units: Client Solutions Division, Imaging Systems Division and Industrial Solutions & Services Division. Together, these divisions provide digital products as well as services and solutions, including award-winning mobile computing devices, security solutions and cloud services; imaging products for the security, medical and manufacturing markets; and IoT solutions development, data analytics and IT services. TAIS provides sales, marketing and services for its wide range of products in the United States and Latin America. TAIS is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation. For more information on TAIS visit us.toshiba.com.

About Toshiba Corporation

For over 140 years, Toshiba Corporation has contributed to a sustainable future by applying innovative technologies to value creation. Today, our business domains are centered on the essential infrastructure that supports modern life and society. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations that contribute to realization of a world where generations to come can live better lives. To find out more about Toshiba, visit www.toshiba.co.jp/worldwide/about/index.html.

© 2018 Toshiba America Information Systems, Inc. Portégé is a trademark of Toshiba Client Solutions, Co. Ltd. Intel, Intel Core, Intel vPro and Pentium are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Windows is a trademark of Microsoft Corporation in the United States and/or other countries. All other trademarks are the property of their respective owners. All rights reserved. While Toshiba has made every effort at the time of publication to ensure the accuracy of the information provided herein, product specifications, configurations, prices, system/component/options availability are all subject to change without notice. Some features and specifications may be limited to certain models only. Some features may require certain software and/or service activation. *For the complete legal disclaimer visit us.toshiba.com/info.



Contact:

Media:
Eric Paulsen
Toshiba America Information Systems, Inc.
Email Contact
(949) 583-3541



« Previous Page 1 | 2             



Review Article Be the first to review this article

 Advanced Asembly

Featured Video
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
You’re Invited! SEMI’s Innovation for a Transforming World
intelThe Dominion of Design
by intel
The Long Game: Product and Security Assurance
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Setting a High Standard for Standards-Based IP
Jobs
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
NAND Hardware Engineer for Apple Inc at Cupertino, California
Business Operations Planner for Global Foundaries at Santa Clara, California
Staff SerDes Applications Design Engineer for Xilinx at San Jose, California
Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California
Upcoming Events
Join Chipx2021 - at Tel Aviv Expo convention center Tel Aviv Israel - Jun 21 - 22, 2021
Innovation for a Transforming World -virtual Event at United States - Jul 13 - 14, 2021
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021
True Circuits IoT



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise