UMC Reports First Quarter 2020 Results

Revenue contribution from 28nm declined to 9% while 40nm business represented 25% of sales.

Revenue Breakdown by Customer Type

Customer Type

1Q20

4Q19

3Q19

2Q19

1Q19

Fabless

88

%

87

%

92

%

93

%

94

%

IDM

12

%

13

%

8

%

7

%

6

%

Revenue from fabless customers was 88% of revenue.

Revenue Breakdown by Application (1)

Application

1Q20

4Q19

3Q19

2Q19

1Q19

Computer

13%

13%

13%

14%

15%

Communication

54%

54%

54%

52%

48%

Consumer

24%

24%

26%

28%

29%

Others

9%

9%

7%

6%

8%

Revenue from communication remained flat at 54%, while business from consumer applications and computing peripherals remained unchanged at 24% and 13% respectively.

(1) Computer consists of ICs such as CPU, GPU, HDD controllers, DVD/CD-RW control ICs, PC chipset, audio codec, keyboard controller, monitor scaler, USB, I/O chipset. Communication consists of handset components, broadband, WLAN, bluetooth, Ethernet, LAN, DSP, etc. Consumer consists of ICs used for DVD players, DTV, STB, MP3/MP4, flash controller, game consoles, DSC, smart cards, toys, etc.

Blended ASP Trend for Foundry Segment

Blended average selling price (ASP) in 1Q20 declined slightly.

(To view ASP trend, visit http://www.umc.com/english/investors/1Q20_ASP_trend.asp)

Shipment and Utilization Rate3 for Foundry Segment

Wafer Shipments

 

1Q20

4Q19

3Q19

2Q19

1Q19

Wafer Shipments
(8” K equivalents)

2,148

 

2,042

 

1,806

 

1,730

 

1,611

 

 

Quarterly Capacity Utilization Rate

 

1Q20

4Q19

3Q19

2Q19

1Q19

Utilization Rate

93

%

92

%

91

%

88

%

83

%

Total Capacity
(8” K equivalents)

2,278

 

2,237

 

2,004

 

1,970

 

1,937

 


« Previous Page 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10  Next Page »



Review Article Be the first to review this article
Featured Video
Editorial
More Editorial  
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
ESD Alliance/Accellera Panel Takes Executive View on Returning to the Office
Vincent ThibautArteris IP Blog
by Vincent Thibaut
Arteris IP Extends IP-XACT to UVM Testbenches
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Specification Automation for Designers
Jobs
Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California
Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
NAND Hardware Engineer for Apple Inc at Cupertino, California
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
Design Verification Engineer II for Synopsys, Inc. at Mountain View, California
Upcoming Events
DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021
SEMICON Southeast Asia 2021 Hybrid Event at Setia SPICE Convention Centre Penang Malaysia - Aug 23 - 27, 2021
SEMI Europe Summit at Online, Central European Time Germany Germany - Sep 1 - 3, 2021
7th International Conference on Sensors & Electronic Instrumentation Advances (SEIA' 2021) at Palma de Mallorca, Mallorca balearic islands) Spain - Sep 14 - 16, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise